• Title/Summary/Keyword: Drop reliability

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A Study on the Characterization of Electroless and Electro Plated Nickel Bumps Fabricated for ACF Application (무전해 및 전해 도금법으로 제작된 ACF 접합용 니켈 범프 특성에 관한 연구)

  • Jin, Kyoung-Sun;Lee, Won-Jong
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.3
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    • pp.21-27
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    • 2007
  • Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

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A Study of Joint Reliability According to Various Cu Contents between Electrolytic Ni and Electroless Ni Pad Finish (전해Ni, 무전해 Ni pad에서의 Cu 함량에 따른 접합 신뢰성에 관한 연구)

  • Lee, Hyun Kyu;Chun, Myung Ho;Chu, Yong Chul;Oh, Kum-Sool
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.3
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    • pp.51-56
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    • 2015
  • It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

A Study on Thickness and Temperature Dependence of Dielectric Breakdown in Polyethylene (폴리에틸렌의 절연파괴와 그의 온도 및 두께의존성)

  • Kim, Jeom-Sik;Lee, Jong-Bum;Jung, Woo-Kyo;Kim, Mi-Hang;Park, Dae-Hee
    • Proceedings of the KIEE Conference
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    • 1995.07c
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    • pp.1388-1390
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    • 1995
  • The characteristic of dielectric breakdown in solid insulating material dominates the reliability and safety of power equipment and affects directly to its life. In this point of view, the thickness and temperature dependence of dielectric breakdown strength and mechanism of dielectric breakdown in low density polyethylene which has been employed widely as insulating material have been technically reviewed by examinations of thermal property. The dielectric breakdown strength depending on its thickness was measured 2.6[MV/cm] at the thickness of 20[${\mu}m$] and 1.9[MV/cm] at the thickness of 75[${\mu}m$] based on ambient temperature of 30[$^{\circ}C$]. It is shown the temperature dependence that dielectric breakdown strength decreases in linear as the thickness increases. The dielectric breakdown strength depending on temperature was measured 2.6[MV/cm] at the temperature of 30[$^{\circ}C$], 1.6[MV/cm] at 60[$^{\circ}C$] and 1.3[MV/cm] at 90[$^{\circ}C$] based on the thickness of 20[${\mu}m$]. As the ambient temperature increases, the temperature dependence is shown that a very large drop is occurred up to temperature of 60[$^{\circ}C$] and a very small drop is discovered over 60[$^{\circ}C$].

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Development of the Serial Data Transmission System for Pneumatic Valve System Control

  • Kim, Dong-Soo;Choi, Byung-Oh;Seo, Hyun-Seok
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.1152-1156
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    • 2003
  • For pneumatic valve system control, we need a serial data transmission system with high speed and reliability for information interchange between main computer and I/O devices. This paper presents a set of design techniques for a data communication system that is mainly used for pneumatic valve system control. For this purpose, we first designed hardware modules for an interface between central control module and local node that handles the operation of solenoid control valves. in addition, we developed a communication protocol for construction of rs-485 based multi-drop network and this protocol is basically designed with a kind of polling technique. Finally we evaluated performance of the developed system. the field test results show that, even under high noise environment, the data transmission of 375kbps rate is possible up to 1,500meter without using repeater. In addition, the system developed in this research is easily to be extended for a communication network because of its modular structure.

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Multi-head Inkjet Patterning System for Manufacturing a Full Color Polymer Light Emitting Device (pLED) (고분자 유기 EL 제조를 위한 멀티헤드형 잉크젯 패터닝 시스템)

  • Oh, Je-Hoon;Kim, Si-Kyoung;Yoon, Hee-Youl;Oh, Se-Il;Kang, Yoo-Myung;Kim, Kwang-Il
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1219-1225
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    • 2003
  • According to the increase of lifetime and efficiency, the interest in the pLED has dramatically increased recently because pLED can be applied to large-size and flexible displays. The core process in the manufacture of pLED is the printing process of red, green and blue light emitting polymers (LEP), and inkjet printing method is one of the promising technology to print red, green and blue LEP on glass substrates. In this work, we developed a multi-head inkjet patterning system with 3 heads for each color. The developed inkjet patterning system is composed of the precise positioning system, head controller circuit, real-time ink drop evaluation system, maintenance system, and stable ink supply system. Finally, we investigated the stability and reliability of the system by printing red, green and blue LEP on the dummy substrate.

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Highly Sensitive Colorimetric Formaldehyde Gas Sensors using Nylon Sheet and Dye (나일론 시트와 염료를 이용한 고감도 색변환 포름알데히드 가스 센서)

  • Jung, Suenghwa;Cho, Yeong Beom;Kim, Yong Shin
    • Journal of Sensor Science and Technology
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    • v.26 no.6
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    • pp.420-426
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    • 2017
  • A colorimetric sensor was investigated to achieve a low-cost warning device for harmful gaseous formaldehyde (HCHO). The sensor is based on selective reactions between hydroxylamine sulfate and HCHO, leading to the production of sulfuric acid. The produced acid results in color-changing response through the acid-base reaction with dye molecules impregnated on a solid membrane substrate. For attaining this purpose, sensors were fabricated by drop-casting a dye solution prepared using different pH indicators on various commercially available polymer sheets, and their colorimetric responses were evaluated in terms of sensitivity and reliability. The colorimetric sensor using bromophenol blue (BPB) and nylon sheet was found to exhibit the best performance in HCHO detection. An initial bluish green of a sensor was changed to yellow when exposed to gaseous formaldehyde. The color change was recorded using an office scanner and further analyzed in term of RGB distance for quantifying sensor's response at different HCHO(g) concentrations. It exhibited a recognizable colorimetric response even at 50 ppb, being lower than WHO's standard of 80 ppb. In addition, the sensor was found to have quite good selectivity in HCHO detection under the presence of common volatile organic compounds such as ethanol, toluene, and hexane.

Injury Assessment and Analysis under Blast Load Using MADYMO (MADYMO를 이용한 폭발 하중에 따른 인체 상해평가 및 분석)

  • Choi, Ho-Min;Kim, Jae-Ki;Pack, In-Seok;Lee, In-Young;Kwon, Dae-Ryeong;Lee, Seok-Soon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.1
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    • pp.24-29
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    • 2017
  • There is a need for explosion experiments for explosion-related research. However, there are many restrictions in performing an actual experiment. Therefore, in this paper, an alternative method of overcoming the constraints of an explosion experiment has been conducted using a passenger behavior analysis program called MADYMO to assess and analyze the human body injury due to explosion load. To increase the reliability of the analysis, a drop test has been conducted with the analysis. We provide a new framework for performing the analysis. In future, we will further develop our research with the goal of reducing the opportunity cost for the study of the human body injury.

A Shock Damage Evaluation Study of Large Digital TV Display Modules (대형 디지털TV Display 모듈의 내충격 설계를 위한 손상평가 연구)

  • 문성인;최재붕;김영진;서형원;이정권;구자춘
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.14 no.10
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    • pp.945-954
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    • 2004
  • Recently, specifications of flat display module is going to be higher definition, brightness and more wide viewing angle. On the other hand, physical thickness of those modules is forced to be slimmer and lighter. The flat display modules such as plasma or TFT-LCD employ thin crystallized panels that are normally weak to high level transient mechanical energy inputs. As a result, anti-shock performance is one of the most important design specifications of TFT-LCD modules. TFT-LCD module manufacturers and their customers like PC or TV makers perform a series of strict impact/drop test for the modules. However most of the large display module designs are generated based on engineer's own trial-error experiences. Those designs may result in disqualification from the drop/impact test during final product evaluation. A rigorous study on the impact failure of the displays is of course necessitated in order to avoid the problems. In this article, a systematic design evaluation is presented with combinations of FEM modeling and testing to support the optimal shock proof display design procedure.

Characteristic Analysis of Electret Filters made by Electrospinning (전기방사를 통한 정전필터제조 및 특성분석)

  • Ahn, Young-Chull;Kim, Gil-Tae;Kim, Seong-Kon;Lee, Jae-Keun;Kim, Jong-Won
    • Proceedings of the SAREK Conference
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    • 2008.06a
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    • pp.1134-1138
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    • 2008
  • Electret filter media are used in general ventilation filters, disposable respirators, vehicle cabin filters, vacuum cleaners and room air cleaners. There are basic mechanisms of interception, inertial impaction, diffusion, gravitational settling, electrostatic attraction by which an aerosol particle can be deposited onto a fiber in a filter. The ability of fine particle removal strongly depends on the electrostatic forces between particles and polarized fibers. Thus, the stability of the fiber polarization is a major factor in the reliability of electret filters. In this study, electrical properties and filtration performance of electrospun filter media are quantitatively investigated. Electrical properties of electrospun filters have been studied on surface charge potential and surface charge density. Also the filtration performance of the electret filters are evaluated on collection efficiency. Electrospun filters show same collection efficiency with low pressure drop compare to commercialized HEPA filters. Surface charge potential and surface charge density of electrospun filters are increased with increasing applied voltage. Also collection efficiency of electrospun filters is increased with increasing surface charge potential and surface charge density.

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Biomechanical Characteristics of Comprehensive Ankle Joint Complex between Chronic Ankle Instability (CAI) and Healthy Control (만성 발목 불안정성(CAI) 환자와 건강 대조군 간 종합적 발목관절복합체의 생체역학적 특성)

  • Kim, Byong Hun;Jeong, Hee Seong;Lee, Inje;Jeon, Hyung Gyu;Lee, Sae Yong
    • Korean Journal of Applied Biomechanics
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    • v.31 no.3
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    • pp.168-175
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    • 2021
  • Objective: To investigate the static and dynamic analysis of ankle joint complex between subjects with chronic ankle instability (CAI) and healthy controls. Method: A total of 38 subjects and CAI group (N=19) and healthy control (N=19) participated in this first study. Variables that were measured in this study were as follows: 1) Subtalar joint axis inclination and deviation 2) Rearfoot angle 3) Navicular drop test 4) Heel alignment view in alignment analysis. Intra Correlation Coefficient (ICC) is used for reliability. A secondary 17 subjects are recruited including 9 of CAI and healthy for gait analysis between group. Lower extremity sagittal, frontal, and transverse kinematics were measured. All data were analyzed to ensemble curve analysis. Results: 1) There were statistically significant differences in standing rearfoot, navicular drop, heel alignment view, subtalar joint (STJ) inclination and deviation. 2) Only in sagittal, meaningful difference is showed during walking in gait analysis. Conclusion: Morphological problem can affect ankle sprain in aspect of structure with no relation to compensation of neuromuscular.