• 대한기계학회논문집A
• /
• 제25권4호
• /
• pp.695-702
• /
• 2001

In this paper, the drop/impact simulation for a mobile phone has been carried out with the explicit code LS-DYNA and its validation has been experimentally verified. The small size of this kind of electronics products makes it time-consuming, and difficult to conduct drop tests to detect the failure mechanism and identify their drop behaviors. Strict drop/impact performance criteria of such hand held electronic products as mobile phones play an important role in their design because these products must withstand both normal and unexpected shock. Usually, the product durability on drop impact depends on designers experience. The present reliable methodology of drop/impact simulation provides an efficient and powerful vehicle to improve the design quality and reduce the design period.

• 한국소음진동공학회논문집
• /
• 제17권6호
• /
• pp.484-490
• /
• 2007

A reciprocating compressor used in domestic refrigerators can be subjected to many different forms of shock. These shocks are usually experienced during transporting the products from a manufacturer to customers. The hermetic structure of this kind of compressor makes it difficult to conduct drop tests for identifying the failure mechanism and their drop behaviors. The drop/impact simulation for a reciprocating compressor has been carried out with the explicit code LS-DYNA and its validation has been experimentally verified. Simulation results are in good agreement with those of drop test. The present method of drop/impact simulation provides an efficient and powerful solution to improve the design quality and reduce the design period.

• 한국정밀공학회지
• /
• 제22권12호
• /
• pp.117-123
• /
• 2005

This paper deals with the finite element model of the monitor fur the simulation of directional free drop tests such as the backward and vertex free drop as well as the associated free-drop experiment. The model was made for an unconditional stable solution fur the explicit integration algorithm. It was found through the comparison between simulation and experimental results that the general behaviors at the time of impact were observed to well correlate with each other in terms of acceleration, displacement, contact force and stress of monitor components.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 춘계학술대회 논문집
• /
• pp.710-713
• /
• 2005

Many impact or drop test researches of home appliances are published, but those of toys cannot be found easily. External impacts are the primary causes of fracture of toys. For impact proof design, the finished product should pass an impact test after molding design. There are several international toy safety standards or requirements such as US CPSC(Consumer Product Safety Commission), ASTM F963-96a, EN71 and so on. The puppy robot which patrols around the house, namely, the watchdog was selected to investigate toy safety because it has considerable weight and outer panels are made of plastics. First the model of watchdog robot was obtained by 3 dimensional scan. Surface data can be generated from 3D polygon data of the watchdog. A reliable drop simulation method for the watchdog was established using Pam-crash program according to Korean toy safety standards. When there is a low impact allowance value, the molding design should be reinforced or changed. It was found that the maximum impact stress reaches the ultimate stress of panel material.

• 한국전산유체공학회지
• /
• 제21권4호
• /
• pp.90-95
• /
• 2016

Leidenfrost drops with ellipsoidal shaping can control the bouncing height by adjusting the aspect ratio(AR) of the shape at the moment of impact. In this work, we focus on the effect of the AR and the impact Weber number(We) on the non-axisymmetrical spreading dynamics of the drop, which plays an important role in the control of bouncing. To understand the impact dynamics, the numerical simulation is conducted for the ellipsoidal drop impact upon the perfect non-wetting solid surface by using volume of fluid method, which shows the characteristics of the spreading behavior in each principal axis. As the AR increases, the drop has a high degree of the alignment into one principal axis, which leads to the consequent suppression of bouncing height with shape oscillation. As the We increases, the maximum spreading diameters in the principal axes both increase whereas the contact time on the solid surface rarely depends on the impact velocity at the same AR. The comprehensive understanding of the ellipsoidal drop impact upon non-wetting surface will provide the way to control of drop deposition in applications, such as surface cleaning and spray cooling.

• 동력기계공학회지
• /
• 제13권3호
• /
• pp.53-58
• /
• 2009

The importance of cost reduction has grown bigger to ensure the competetive power of products in the electric home appliances industry. Thus, it is necessary to assess the reliability due to drop-impact happenning in process of distribution of microwave ovens with the panel and cavity of thinner thickness for cost reduction. In the present study, the drop/impact simulation using the explicit code LS-DYNA3D has been carried out for improving the impact resistance of a microwave oven. This CAE-based design approach can be successfully applied to enhance the deteriorated dynamic behavior under the impact conditions of dropping height 70cm according to ISTA procedure 2A.

• 한국항공우주학회지
• /
• 제36권12호
• /
• pp.1229-1235
• /
• 2008

비상위치송신기(ELT)는 무수한 조난시의 응급구조에 큰 역할을 해왔다. 비행사, 항해사 그리고 지상 사용자들은 세상 어디에서든지 비상시에 조난신호를 위성에 송신이 가능한 장치를 갖추고 있는 것이다. 이 논문에서는 비상위치송신기의 본체를 낙하충격에 대하여 MSC/Dytran을 이용하여 해석하였다. 그리고 그 결과를 Karas' Example 이론 결과에 비교하였다. 또한, 추락생존성 시험에 대해 MSC/Nastran을 이용해 해석하였다. 비상위치송신기의 충격조건하에 과도응답해석을 하였다.

• 마이크로전자및패키징학회지
• /
• 제18권2호
• /
• pp.35-41
• /
• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• 대한기계학회논문집A
• /
• 제29권1호
• /
• pp.81-87
• /
• 2005

A fracture of hand held device, such as radio, TV and CD-RW drive, mainly occurs due to drop situation. For CD-RW drive, the need of high reading/writing speed in conjunction with low price accelerates the fracture of the device. Computer simulation can reduce the period of development and enhance impact characteristic of device. In this study, the detailed finite element model of CD-RW drive was developed to predict the damage under drop conditions. Material property for shock absorbing damper was obtained from tensile test of raw material. A MOONEY-RIVLIN type rubber in LS-DYNA was used as the material model of damper. To assess the reliability of the developed model, drop test at 200G-2msec and 150G-10msec condition was conducted and acceleration at pick-up was compared.

• 동력기계공학회지
• /
• 제14권5호
• /
• pp.24-29
• /
• 2010

TFT-LCD module with thin, small and layered structure makes its shock analysis very difficult and complicated. As TFT-LCD becomes more thinner, it is more difficult to assure its required shock resistance. Recently, the drop/impact simulation using the commercial explicit dynamic analysis software such as LS-DYNA3D is actively applied to assess the shock characteristics of TFT-LCD. In this study, the effects of analysis parameters and design modifications in the drop/impact simulation are carefully studied. the reliability of the present analysis results can be assured through the experimental verification.