• 한국자동차공학회논문집
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• 제11권6호
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• pp.197-204
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• 2003

This paper develops a computer model for estimating the handling of a cabover type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using ADAMS. A shock absorber, a rubber bush, and a leaf spring aunt a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC/PATRAN. A mode analysis is performed with the frame model using MSC/NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double lane change test is performed with an actual vehicle. In the double lane change, lateral acceleration, yaw rate, and roll angle are measured. Those test results are compared with the simulation results.

• 한국소음진동공학회논문집
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• 제15권10호
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• pp.1202-1210
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• 2005

This paper develops a computer model for estimating the bump characterisitcs of a cat)over type large-sized truck. The truck is composed of front and rear suspension systems, a frame, a cab, and ten tires. The computer model is developed using MSC.ADAMS. A shock absorber, a rubber bush, and a leaf spring affect a lot on the dynamic characteristic of the vehicle. Their stiffness and damping coefficient are measured and used as input data of the computer model. Leaf springs in the front and rear suspension systems are modeled by dividing them three links and joining them with joints. To improve the reliability of the developed computer model, the frame is considered as a flexible body. Thus, the frame is modeled by finite elements using MSC.PATRAN. A mode analysis is performed with the frame model using MSC.NASTRAN in order to link the frame model to the computer model. To verify the reliability of the developed computer model, a double wheel bump test is performed with an actual vehicle. In the double wheel bump, vortical displacement, velocity, acceleration are measured. Those test results are compared with the simulation results.

• Journal of Korean Vacuum Science & Technology
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• 제7권2호
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• pp.39-44
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• 2003

Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to a quarter micron and below, which results in the high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in PSG(phosphosilicate glass)/SiO$_2$ passivated Al-l%Si thin film interconnections. Straight line patterns, wide and narrow link type patterns, and meander type patterns, etc. were fabricated by a standard photholithography process. The main results are as follows. The current crowding effects result in the decrease of the lifetime in thin film interconnections. The electric field effects accelerate the decrease of lifetime in the double-layered thin film interconnections. The lifetime of interconnections also depends upon the current conditions of P.D.C.(pulsed direct current) frequencies applied at the same duty factor.

• 한국기계가공학회지
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• 제20권9호
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• pp.42-47
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• 2021

A one-touch descending lifeline that can easily be installed and rapidly evacuated in the event of a fire accident in high-rise buildings was proposed to overcome difficulties of conventional descending lifeline such as complex installation methods and procedures. However, this lifeline exhibits limitations such as restrictions in installation location and large apparatus size. Therefore, this paper proposes a sliding-type descending lifeline, which has a similar operation to that of current one-touch descending lifeline and solves the aforementioned limitations. A double square link mechanism including a sliding four-bar linkage is proposed and the descending lifeline support is redesigned to unfold in two different planes, allowing 3D movement. Additionally, the shape of the support frame is designed to obtain two attachment surfaces that can be attached to a wall, irrespective of the angle between the window and the inner wall. FEA analysis using ABAQUS is performed to ensure that the robustness of the presented support complies with the Fire Control Act Enforcement Decree. Finally, the feasibility of the proposed sliding one-touch descending lifeline is verified through fabrication.

• 한국항행학회논문지
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• 제21권4호
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• pp.413-421
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• 2017

본 논문에서는 전술 및 조작 상황, 목표 위치 정보 확인이 가능한 Link-K (한국 합동 전술 데이터 링크 시스템)를 활용하여 목표물 재설정을 위한 소형 UHF(ultra high frequency) 수신 모듈을 설계 및 제작하였고, 시뮬레이션을 통해 목표물 재설정에 대한 효과를 분석하였다. 설계된 모듈은 UHF 수신반, 제어반 및 전원분배반으로 구성된다. UHF 수신반은 주파수 하향 변환, 필터링 및 자동이득 제어 등을 수행한다. 제어반은 주파수 하향 변환 된 신호를 복조하고, 정보를 추출하고, 외부 연동을 수행한다. 전원분배반은 외부 전원을 공급하고 각 구성품에 필요한 전원을 생성 및 공급한다. 제작 된 모듈의 크기는 $105{\times}105{\times}80mm$이고 무게는 1.10 kg이며, 수신 가능 거리는 50km 이상이다.

• 천문학회보
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• 제44권1호
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• pp.47.4-47.4
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• 2019

Recent observations on the double red clumps in the bulge validate the close connection in stellar populations between Galactic globular clusters (GCs) and the Milky Way (MW) bulge. Intriguingly, diverse phenomena observed in early-type galaxies (ETGs) and their GC systems are also indicating the similarities with Galactic GCs with multiple populations. Here, we present the population synthesis for the Galactic bulge and ETGs using stellar populations observed in the Galactic GCs with multiple populations. Our new models well explain observations of both the MW bulge and ETGs. Also, the inclusion of GC-originated population to the population synthesis model shows substantial impacts on the age-dating of stellar populations. The implication of this result for the interpretation of the formation history and the age-dating of ETGs will be discussed in detail.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(2)
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• pp.165-168
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• 2002

As the demand for higher data-rate chip-to-chip communication such as memory-to-controller, processor-to-processor increases, low cost high-speed serial links\ulcorner become more attractive. This paper describes a 0.25-fm CMOS 1.6Gbps/pin 4-level transceiver using Stub Series Terminated Logic for high Bandwidth. For multi-gigabit/second application, the data rate is limited by Inter-Symbol Interference (ISI) caused by channel low pass effects, process-limited on-chip clock frequency, and serial link distance. The proposed transceiver uses multi-level signaling (4-level Pulse Amplitude Modulation) using push-pull type, double data rate and flash sampling. To reduce Process-Voltage-Temperature Variation and ISI including data dependency skew, the proposed high-speed calibration circuits with voltage swing controller, data linearity controller and slew rate controller maintains desirable output waveform and makes less sensitive output. In order to detect successfully the transmitted 1.6Gbps/pin 4-level data, the receiver is designed as simultaneous type with a kick - back noise-isolated reference voltage line structure and a 3-stage Gate-Isolated sense amplifier. The transceiver, which was fabricated using a 0.25 fm CMOS process, performs data rate of 1.6 ~ 2.0 Gbps/pin with a 400MHB internal clock, Stub Series Terminated Logic ever in 2.25 ~ 2.75V supply voltage. and occupied 500 * 6001m of area.

• Earthquakes and Structures
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• 제16권6호
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• pp.641-654
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• 2019

This paper investigates the seismic response of a typical non-navigable continuous girder bridge isolated with friction sliding bearings of the Hong Kong-Zhuhai-Macao link projects in China. The effectiveness of the friction pendulum system (FPS) and accuracy of the numerical model were evaluated by a 1/20 scaled bridge model using shaking table tests. Based on the hysteretic properties of friction pendulum system (FPS), double concave friction pendulum (DCFP), and triple friction pendulum system (TFPS), seismic response analyses of isolated bridges with the three sliding-type bearings are systematically carried out considering soil-pile interaction under offshore soft clay conditions. The fast nonlinear analysis (FNA) method and response spectrum are employed to investigate the seismic response of isolated offshore bridge structures. The numerical results show that the implementation of the three sliding-type bearings effectively reduce the base shear and bending moment of the reinforced concrete pier, at the cost of increasing the absolute displacement of the bridge superstructure. Furthermore, the TFPS and DCFP bearings show better isolation effect than FPS bearing for the example continuous girder bridge.

• 한국컴퓨터정보학회논문지
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• 제24권11호
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• pp.71-78
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• 2019

현재 상용화된 대부분의 3D 디스플레이는 왼쪽 눈과 오른쪽 눈의 입력영상을 다르게 만들어 입체감을 만드는 양안시차 방식을 적용하고 있다. 하지만 상용화된 3D 영상 출력 장치는 성능 부족에 의한 시청자의 불편 유발과 시청위치의 제약 등의 문제들이 있다. 본 논문에서는 기존 Dual-cell 구조 대비 시야각, Crosstalk 감소, 광투과도를 향상할 수 있는 Single-cell 구조의 편광안경식 입체영상 시스템을 개발하고, 투과도 실험과 시야각 평가를 통해 Single-cell 구조의 편광안경식 입체영상 시스템 특성분석과 Dual-cell 구조 대비 성능향상 효과 분석을 진행하였다. 분석 결과 Single-cell 구조가 Dual-cell 구조 대비 투과도 부분에서 약 25% 이상의 높은 성능을 보이며, 시야각 평가 중 입체 영상 특성품질의 주요지표인 3D crosstalk 지표는 약 37% 이상 향상되는 것을 확인할 수 있었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.717-722
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• 2004

A design was done, and all characteristic of photodetectr of the web pattern type which a standard process of the Bipolar which Si PIN structure was used in this paper, and was used for the current amplifier design was used, and high-speed, was used as receiving optcal area of high altitude, and the module which had a low dark current characteristic was implemented with one chip with a base. Important area decreases an area of Ie at the time of this in order to consider an electrical characteristic and economy than the existing receiving IC, and performance of a product and confidence are got done in incense. First of all, the receiving IC which a spec, pattern of a wafer to he satisfied with the following electrical optical characteristic that produced receiving IC of 5V and structure are determined, and did one-chip is made. On the other hand, the time when AR layer of double is $Si_{3}N_{4}/SiO_{2}=1500/1800$ has an optical reflectivity of less than $10{\%}$ on an incidence optical wavelength of 660 ,and, in case of photo detector which reverse voltage made with 1.8V runs in 1.65V, an error about a change of thickness is very the thickness that can be improved surely. And, as for the optical current characteristic, about 5 times increases had the optical current with 274nA in 55nA when Pc was -27dBm. A BJT process is used, and receiving IC running electricity suitable for low voltage and an optical characteristic in minimum 1.8V with a base with two phases is made with one chip. IC of low voltage operates in 1.8V and 3.0V at the same time, and optical link receiving IC is going to be implemented