• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.49-56
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• 2002

In this study, the InGaP epilayers were grown on the exact and the $2^{\circ}$, $6^{\circ}$, $10^{\circ}$ of cut GaAs substrates by metal-organic vapor phase epitaxy, and the effects of interfacial elastic strains determined by the substrate offcut angle upon the resulting dislocation density of epilayer were investigated for the first time. The elastic strains were obtained from lattice mismatch and lattice misfit by TXRD, and the dislocation densities from epilayer x-ray FWHM. For the offcut angle range used in this study, the elastic strain was maximum and x-ray FWHM minimum at offcut angle $6^{\circ}$. From 11K PL measurements, PL wavelength was found to decrease with an increase of offcut angle. PL intensity was maximum at offcut angle $6^{\circ}$. TEM results showed that the electron diffraction pattern was of typical zincblende structure, and that the dislocation density was minimum for substrate offcut angle $6^{\circ}$. The results obtained in this study, along with the device fabrication process and beam characteristics, clearly demonstrated that the optimum substrate offcut angle for the InGaP/GaAs heterostructures is $6^{\circ}$.

• Journal of the Korean Society for Nondestructive Testing
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• v.31 no.1
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• pp.32-39
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• 2011

The object of this study is to evaluate and discriminate nondestructively the dislocation substructures of Cu and Cu-Zn alloy subjected to the low-cycle-fatigue. The ultrasonic wave velocity, electrical resistivity and positron annhilation lifetime(PAL) were measured to the nondestructive testing. Cyclic fatigue test of Cu and Cu-Zn alloy with much different stacking fault energies was conducted and the correlations between dislocation behavior and nondestructive parameters were studied. Dislocation cell substructure was developed in Cu, while planar array of dislocation structure was developed in Cu-35Zn alloy only increasing dislocation density with fatigue cycles. Decrease in ultrasonic wave velocity, increase in electrical resistivity and PAL were shown because of the development of lattice defects, dislocations and vacancies, by cyclic fatigue at room temperature. In contrast to Cu-Zn alloy of the planar-array dislocation substructure showing continuous changes in the nondestructive parameters, it does not make any noticeable changes in the nondestructive parameters after the evolution of dislocation cell substructure in Cu.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.5
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• pp.444-450
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• 2010

In the present study, the microscopic degradation of copper and copper alloy subjected to cyclic deformation has been evaluated by the electrical resistivity measurement using the DC four terminal potential method. The copper (Cu) and copper alloy (Cu-35Zn), whose stacking fault energy is much different each other, were cyclically deformed to investigate the response of the electrical resistivity to different dislocation substructures. Dislocation cell substructure was developed in the Cu, while the planar array of dislocation structure was developed in the Cu-35Zn alloy increasing dislocation density with fatigue cycles. The electrical resistivity increased rapidly in the initial stage of fatigue deformation in both materials. Moreover, after the fatigue test it increased by about 7 % for the Cu and 6.5 % for the Cu-35Zn alloy, respectively. From these consistent results, it may be concluded that the dislocation cell structure responds to the electrical resistivity more sensitively than the planar array dislocation structure evolved during cyclic fatigue.

• Journal of Powder Materials
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• v.11 no.4
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• pp.341-347
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• 2004

In the study, a hybrid constitutive model for densification of metallic powders was applied to cold isostatic pressing. The model is based on a pressure-dependent plasticity model for porous materials combined with a dislocation density-based viscoplastic constitutive model considering microstructural features such as grain size and inter-particle spacing. Comparison of experiment and calculated results of microscale and nanoscale Cu powders was made. This theoretical approach is useful for powder densification analysis of various powder sizes, deformation routes and powder processing methods.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.6
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• pp.969-980
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• 2003

The interactions between curved cracks are examined in an orthotropic plate and the effects of rectilinear anisotropy on the stress intensity factors are analyzed. The finite element alternating method (FEAM) is used in this study to get the stress intensity factors for the multiple curved cracks. To obtain analytical solutions, which is necessary in FEAM, the curved cracks are modeled as continuous distributions of dislocations, and integral equations are formulated for unknown dislocation density functions to satisfy the given resultant forces on the crack surfaces. Several basic problems are solved to verify the accuracy and efficiency of the proposed method and it can be found that present results show good agreements with the previously published results.

• Interaction and multiscale mechanics
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• v.2 no.1
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• pp.1-14
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• 2009

This paper proposes an interaction field concept based on the field theory of plasticity. Relative deformation between two arbitrary scales, e.g., macro and micro fields, is defined which can be implemented in the crystal plasticity-based constitutive framework. Differential geometrical quantities responsible for describing dislocations and defects in the interaction field are obtained, based on which dislocation density and incompatibility tensors are further derived. It is shown that the explicit interaction exists in the curvature or incompatibility tensor field, whereas no interaction in the torsion or dislocation density tensor field. General expressions of the interaction fields over multiple scales with more than three scale levels are derived and implemented into the present constitutive equation.

• Structural Engineering and Mechanics
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• v.52 no.4
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• pp.829-841
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• 2014

The main purpose of this study is to determine the effect of overlay on the crack propagation. In order to simplify the problem, a cement concrete pavement is modeled as an elastic plate on Winkler foundation. To derive the singular integral equations, the Fourier transform and dislocation density function are used. Lobatto-Chebyshev integration formula, as a numerical method, is used to solve the singular integral equations. The numerical solution of stress intensity factor at the crack tip is derived. In order to examine the effect of overlay for resisting crack propagation, numerical analyses are carried out for a cement concrete pavement with an embedded crack and a concrete pavement with an asphalt overlay. Results show the significant factors that influence the crack propagation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.424-427
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• 2003

We have investigated the microstructural analysis of epitaxial lateral overgrowth (ELO), pendeoepitaxy (PE), and superlattice structures used as technology for the reduction of structural defects like dislocation in nitride semiconductors using transmission electron microscopy. We confirmed that the regrowth process such as ELO and PE is very effective technique on the reduction of threading dislocation (less than $10^6/cm^2$) in the specific area. However, to decrease the defect density in the whole nitride films and the suppress the generation of defect by regrowth, we should find the optimized conditions. Besides, the process using double PE and AlGaN/GaN superlattice structure showed no effect on the defect reduction up to now.

• Transactions of Materials Processing
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• v.22 no.8
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• pp.450-455
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• 2013

In the current study, a new dynamic recrystallization model for predicting high temperature flow stress is developed based on a physical model and the mean field theory. In the model, the grain aggregate is assumed as a representative volume element to describe dynamic recrystallization. The flow stress and microstructure during dynamic recrystallization were calculated using three sub-models for work hardening, for nucleation and for growth. In the case of work hardening, a single parameter dislocation density model was used to calculate change of dislocation density and stress in the grains. For modeling nucleation, the nucleation criterion developed was based on the grain boundary bulge mechanism and a constant nucleation rate was assumed. Conventional rate theory was used for describing growth. The flow stress behavior of pure copper was investigated using the model and compared with experimental findings. Simulated results by cellular automata were used for validating the model.

• Applied Microscopy
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• v.16 no.2
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• pp.14-24
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• 1986

The interrelation of secondary defects, intermediate S' phase and aging condition in Al-2.0 wt% Cu-1.1 wt% Mg alloy is studied by transmission electron microscope. The results obtained in this study are as follows. 1. High density of dislocation loops, helices and stacking faults are observed in this specimen with aging treatment. 2. The number of dislocation loops and the width of loop free zone (LFZ) are increased with aging time. 3. The intermediate S' phase precipitates and grows on the dislocations and secondary defects. 4. The misfit dislocations are formed around intermediate S' phase. 5. It is thought that the helices appear to be produced by the climb of screw dislocations, while the dislocation loops appear to be formed both by condensation of vacancies into collapsed discs and by interaction of helices with screw of opposite sign.