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Evaluation of Microscopic Degradation of Copper and Copper Alloy by Electrical Resistivity Measurement  

Kim, Chung-Seok (Automotive Engineering, Hanyang University)
Nahm, Seung-Hoon (Korea Research Institute of Standards and Science)
Hyun, Chang-Young (Seoul National University of Science and Technology)
Publication Information
Journal of the Korean Society for Nondestructive Testing / v.30, no.5, 2010 , pp. 444-450 More about this Journal
Abstract
In the present study, the microscopic degradation of copper and copper alloy subjected to cyclic deformation has been evaluated by the electrical resistivity measurement using the DC four terminal potential method. The copper (Cu) and copper alloy (Cu-35Zn), whose stacking fault energy is much different each other, were cyclically deformed to investigate the response of the electrical resistivity to different dislocation substructures. Dislocation cell substructure was developed in the Cu, while the planar array of dislocation structure was developed in the Cu-35Zn alloy increasing dislocation density with fatigue cycles. The electrical resistivity increased rapidly in the initial stage of fatigue deformation in both materials. Moreover, after the fatigue test it increased by about 7 % for the Cu and 6.5 % for the Cu-35Zn alloy, respectively. From these consistent results, it may be concluded that the dislocation cell structure responds to the electrical resistivity more sensitively than the planar array dislocation structure evolved during cyclic fatigue.
Keywords
Dislocation Structure; Electrical Resistivity; Stacking Fault; Fatigue;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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