• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.101-107
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• 2006

Cold gas dynamic spray or cold spray is a novel manufacturing method for coatings. Cold spray is a high rate and direct material deposition process that utilizes the kinetic energy of particles sprayed at high velocity (300-1,200m/s). In this research, a technique to repair the damaged mold by cold spray deposition and mechanical machining was proposed. An aluminum 6061 mold with three-dimensional surface was fabricated, intentionally damaged and material-added by cold spray, and its original geometry was re-obtained successfully by Computer Numerical Control (CNC) machining. To investigate deformation of material caused by cold spray, deposition was conducted on thin aluminum plates ($100mm{\times}100mm{\times}3mm$). The average deformation of the plates was $205{\sim}290{\mu}m$ by Coordinate Measurement Machine (CMM). In addition, the cross section of deposited layer was analyzed by scanning electron microscopy (SEM). To compare variation of hardness, Vickers hardness was measured by micro-hardness tester.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2003.10a
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• pp.204-207
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• 2003

The present paper reports high-fidelity simulation of direct initiation processes of cylindrical detonation waves by concentrated energy deposition. The goal is to understand the underpinning mechanisms in failed or successful detonation initiation processes. We employed the Space-Time CESE method to solve the reacting flow equations, including realistic finite-rate chemistry model of the nine species and twenty-four reactions for H$_2$-O$_2$-Ar mixtures. Detailed results of sub-critical, critical. and supercritical initiation process are reported.

• Korean Journal of Metals and Materials
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• v.50 no.2
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• pp.107-115
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• 2012

Direct laser melting (DLM) is a powder-based additive manufacturing process to produce parts by layer-by-layer laser melting. As the properties of the manufactured parts depend strongly on the deposited laser-melted bead, deposited layers obtained by the DLM process were characterized in this study. This investigation used a 200 W fiber laser to produce single-line beads under a variety of different energy distributions. In order to obtain a feasible range for the two main process parameters (i.e. laser power and scan rate), bead shapes of single track deposition were intensively investigated. The effects of the processing parameters, such as powder layer thickness and scan spacing, on geometries of the deposited layers have also been analyzed. As a result, minimum energy criteria that can achieve a complete melting have been suggested at the given powder layer thickness. The surface roughnesses of the deposited beads were strongly dependent on the overlap ratio of adjacent beads and on the energy distributions of laser power. Through microstructural analysis and hardness measurement, the morphological and mechanical properties of the deposited layers at various overlapped beads have also been characterized.

• Journal of Powder Materials
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• v.29 no.4
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• pp.314-319
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• 2022

The effect of the laser beam diameter on the microstructure and hardness of 17-4 PH stainless steel manufactured via the directed energy deposition process is investigated. The pore size and area fraction are much lower using a laser beam diameter of 1.0 mm compared with those observed using a laser beam diameter of 1.8 mm. Additionally, using a relatively larger beam diameter results in pores in the form of incomplete melting. Martensite and retained austenite are observed under both conditions. A smaller width of the weld track and overlapping area are observed in the sample fabricated with a 1.0 mm beam diameter. This difference appears to be mainly caused by the energy density based on the variation in the beam diameter. The sample prepared with a beam diameter of 1.0 mm had a higher hardness near the substrate than that prepared with a 1.8 mm beam diameter, which may be influenced by the degree of melt mixing between the 17-4 PH metal powder and carbon steel substrate.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.96-97
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• 2012

In nitride and oxide film deposition, sputtered metals react with nitrogen or oxygen gas in a vacuum chamber to form metal nitride or oxide films on a substrate. The physical properties of sputtered films (metals, oxides, and nitrides) are strongly influenced by magnetron plasma density during the deposition process. Typical target power densities on the magnetron during the deposition process are ~ (5-30) W/cm2, which gives a relatively low plasma density. The main challenge in reactive sputtering is the ability to generate a stable, arc free discharge at high plasma densities. Arcs occur due to formation of an insulating layer on the target surface caused by the re-deposition effect. One current method of generating an arc free discharge is to use the commercially available Pinnacle Plus+ Pulsed DC plasma generator manufactured by Advanced Energy Inc. This plasma generator uses a positive voltage pulse between negative pulses to attract electrons and discharge the target surface, thus preventing arc formation. However, this method can only generate low density plasma and therefore cannot allow full control of film properties. Also, after long runs ~ (1-3) hours, depends on duty cycle the stability of the reactive process is reduced due to increased probability of arc formation. Between 1995 and 1999, a new way of magnetron sputtering called HIPIMS (highly ionized pulse impulse magnetron sputtering) was developed. The main idea of this approach is to apply short ${\sim}(50-100){\mu}s$ high power pulses with a target power densities during the pulse between ~ (1-3) kW/cm2. These high power pulses generate high-density magnetron plasma that can significantly improve and control film properties. From the beginning, HIPIMS method has been applied to reactive sputtering processes for deposition of conductive and nonconductive films. However, commercially available HIPIMS plasma generators have not been able to create a stable, arc-free discharge in most reactive magnetron sputtering processes. HIPIMS plasma generators have been successfully used in reactive sputtering of nitrides for hard coating applications and for Al2O3 films. But until now there has been no HIPIMS data presented on reactive sputtering in cluster tools for semiconductors and MEMs applications. In this presentation, a new method of generating an arc free discharge for reactive HIPIMS using the new Cyprium plasma generator from Zpulser LLC will be introduced. Data (or evidence) will be presented showing that arc formation in reactive HIPIMS can be controlled without applying a positive voltage pulse between high power pulses. Arc-free reactive HIPIMS processes for sputtering AlN, TiO2, TiN and Si3N4 on the Applied Materials ENDURA 200 mm cluster tool will be presented. A direct comparison of the properties of films sputtered with the Advanced Energy Pinnacle Plus + plasma generator and the Zpulser Cyprium plasma generator will be presented.

• Journal of the Korean Electrochemical Society
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• v.18 no.3
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• pp.102-106
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• 2015

The performance of Li-B alloy as anode for molten salt electrolysis was firstly investigated. The crystalline phase of the prepared Li-B alloy was identified as $Li_7B_6$. The potential profile of Li-B alloy anode was monitored during the electrodeposition of $Nd^{3+}$ onto an LCC (liquid cadmium cathode) in molten LiCl-KCl salt at $500^{\circ}C$. The potential of Li-B alloy was increased from -2.0 V to -1.4 V vs. Ag/AgCl by increasing the applied current from 10 to $50mA{\cdot}cm^{-2}$. It was found that not only the anodic dissolution of Li to $Li^+$ but also the dissolution of the atomic lithium ($Li^0$) into the LiCl-KCl eutectic salt was observed, following the concomitant reduction of $Nd^{3+}$ by the $Li^0$ in Li-B alloy. It was expected that the direct reduction could be restrained by maintaining the anode potential higher that the deposition potential of neodymium.

• Journal of Drive and Control
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• v.16 no.3
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• pp.42-50
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• 2019

3D printing AM processes have advantages in complex shapes, customized fabrication and prototype development stage. However, due to various parameters based on both the machine and the material, the AM process can produce finished output after several trials and errors in the initial stage. As such, minimizing or optimizing negative factors for various parameters of the 3D printing AM process could be a solution to reduce the trial-and-error failures in the early stages of such an AM process. In addition, this can be largely solved through software simulation in the preprocessing process of 3D printing AM process. Therefore, the objective of this study was to investigate a simulation technology for the AM software, especially Ansys Inc. The metal 3D printing AM process, the AM process simulation software, and the AM process simulation processor were examined. Through this study, it will be helpful to understand 3D printing AM process and AM process simulation processor.

• Journal of Powder Materials
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• v.31 no.3
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• pp.213-219
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• 2024

Additive Manufacturing (AM) is a process that fabricates products by manufacturing materials according to a three-dimensional model. It has recently gained attention due to its environmental advantages, including reduced energy consumption and high material utilization rates. However, controlling defects such as melting issues and residual stress, which can occur during metal additive manufacturing, poses a challenge. The trial-and-error verification of these defects is both time-consuming and costly. Consequently, efforts have been made to develop phenomenological models that understand the influence of process variables on defects, and mechanical/ electrical/thermal properties of geometrically complex products. This paper introduces modeling techniques that can simulate the powder additive manufacturing process. The focus is on representative metal additive manufacturing processes such as Powder Bed Fusion (PBF), Direct Energy Deposition (DED), and Binder Jetting (BJ) method. To calculate thermal-stress history and the resulting deformations, modeling techniques based on Finite Element Method (FEM) are generally utilized. For simulating the movements and packing behavior of powders during powder classification, modeling techniques based on Discrete Element Method (DEM) are employed. Additionally, to simulate sintering and microstructural changes, techniques such as Monte Carlo (MC), Molecular Dynamics (MD), and Phase Field Modeling (PFM) are predominantly used.

• Journal of Drive and Control
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• v.16 no.3
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• pp.51-58
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• 2019

The objective of this study was to investigate a simulation technology for the AM field based on ANSYS Inc.. The introduction of metal 3D printing AM process, and the examining of the present status of AM process simulation software, and the AM process simulation processor were done in the previous study (part 1). This present study (part 2) examined the use of the AM process simulation processor, presented in Part 1, through direct execution of Topology Optimization, Ansys Workbench, Additive Print and Additive Science. Topology Optimization can optimize additive geometry to reduce mass while maintaining strength for AM products. This can reduce the amount of material required for additive and significantly reduce additive build time. Ansys Workbench and Additive Print simulate the build process in the AM process and optimize various process variables (printing parameters and supporter composition), which will enable the AM to predict the problems that may occur during the build process, and can also be used to predict and correct deformations in geometry. Additive Science can simulate the material to find the material characteristic before the AM process simulation or build-up. This can be done by combining specimen preparation, measurement, and simulation for material measurements to find the exact material characteristics. This study will enable the understanding of the general process of AM simulation more easily. Furthermore, it will be of great help to a reader who wants to experience and appreciate AM simulation for the first time.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.389-389
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• 2012

Molybdenum is one of the most important materials used as a back ohmic contact for $Cu(In,Ga)(Se,S)_2$ (CIGS) solar cells because it has good electrical properties as an inert and mechanically durable substrate during the absorber film growth. Sputter deposition is the common deposition process for Mo thin films. Molybdenum thin films were deposited on soda lime glass (SLG) substrates using direct-current planar magnetron sputtering technique. The outdiffusion of Na from the SLG through the Mo film to the CIGS based solar cell, also plays an important role in enhancing the device electrical properties and its performance. The structure, surface morphology and electrical characteristics of Mo thin films are generally dependent on deposition parameters such as DC power, pressure, distance between target and substrate, and deposition temperature. The aim of the present study is to show the resistivity of Mo layers, their crystallinity and morphologies, which are influenced by the substrate temperature. The thickness of Mo films is measured by Tencor-P1 profiler. The crystal structures are analyzed using X-ray diffraction (XRD: X'Pert MPD PRO / Philips). The resistivity of Mo thin films was measured by Hall effect measurement system (HMS-3000/0.55T). The surface morphology and grain shape of the films were examined by field emission scanning electron microscopy (FESEM: Hitachi S-4300). The chemical composition of the films was obtained by the energy dispersive X-ray spectroscopy (EDX). Finally the optimum substrate temperature as well as deposition conditions for Mo thin films will be developed.