• 한국레이저가공학회지
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• 제3권2호
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• pp.25-33
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• 2000

One of perspective direction of microfabrication is direct laser writing technology that allows to create metal, semiconductive and dielectric micropatterns on substrate surface. In this work, a two step method, the combination of seed forming process, in which metallic Al seed was selectively generated on AlN ceramic substrate by direct writing technique using a pulsed Nd : YAG laser and subsequent electroless Ni plating on the activated Al seed, was presented. The effects of laser parameters such as pulse energy, scanning speed and pulse frequency on shape of Alseed and conductor line after electroless Ni plating were investigated. The nature of the laser activated surface is analyzed from XPS data. The line width of this metallic Al and Ni is analyzed using SEM. As a results, Al seed line with 24㎛ width and 100㎛ isolated line space is obtained. Finally, laser direct writing can be applied in the field between thin and thick film technique in electronic industry.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.372-373
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• 2006

Modern business trends call for miniaturization of electronic systems. One of the major impedances in this miniaturization is the conductive and inductive components in chips and circuit boards. Direct Write Technology can write these soft magnetic materials, thus allowing for further miniaturization of inductor devices. Another obstacle in electronics fabrication is the size limitations of thick screen-printing and the material limitations in ink jet printing. Direct Write Technologies address both of these limitations by providing feature sizes less than 20 microns with a wide range of materials possibilities. A discussion of the application of these nano-particulate materials by Direct Write Technologies will be presented.

• 대한치과기공학회지
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• 제42권2호
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• pp.81-89
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• 2020

Purpose: This in vitro study was conducted to evaluate the marginal and internal fit of three-unit Co-Cr frameworks fabricated by computer-aided metal milling and direct metal laser sintering(DMLS) systems in comparison to conventional casting method. Methods: Three-unit Co-Cr frameworks were fabricated by conventional wax up with casting(CWC), computer-aided metal milling(MM) and direct metal laser sintering(DMLS)(n=10 each). The marginal and internal fit of specimens were examined using a light-body silicone impression material. The thickness of light-body silicone was measured at eight reference points each, divided in the mesio distal and bucco lingual directions. All measurements were conducted by a stereomicroscope. Digital photos were taken at 150× magnification and then analyzed using a measurement software. The Kruskal-Wallis test and Bonferroni correction were used for analyzing the results. Results: The mean(SD) is ㎛ for fabrication methods, the mean marginal fit were recorded respectively, DMLS 39(27), followed by CWC 63(38), MM 220(128). and the mean internal fit CWC 95(47), DMLS 116(49), MM 210(152). In addition, the largest gap was found in the occlusal surface area among the internal measurement areas of all groups. Conclusion: As a result, the direct metal laser sintering method showed better marginal and internal fit than the metal milling method. The marginal and internal fit were statistically different according to the three fabrication methods(p<0.001). Except the MM group, the marginal fit of the CWC and DMLS groups was below the clinical standard of 120 ㎛. Based on the results of this study, it can be applied to clinical use in the future.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2005년도 제17회 워크샵 및 추계학술대회
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• pp.647-647
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• 2005

• 한국통신학회:학술대회논문집
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• 한국통신학회 2006년도 하계종합학술발표회 논문 초록집
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• pp.689-689
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.635-636
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• 2007

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.875-877
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• 2007

Zinc tin oxide (ZTO) sol-gel solution was synthesized for ink-jet printable semiconducting ink. Bottom-contact type TFT was produced by printing the ZTO layer between the source and drain electrodes. The transistor involving the ink-jet printed ZTO had the $mobility\;{\sim}\;0.01\;cm^2V^{-1}s^{-1}$. We demonstrated the direct-writing of semiconducting oxide for solution processed TFT fabrication.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.249-250
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• 2011

• 한국정밀공학회지
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• 제33권10호
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• pp.845-850
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• 2016

A direct laser lithography system is widely used to fabricate various types of DOEs (Diffractive Optical Elements) including lenses made as CGH (Computer Generated Hologram). However, a parametric study that uniformly and precisely fabricates the diffractive patterns on a large area (up to $200mm{\times}200mm$) has not yet been reported. In this paper, four parameters (Focal Position Error, Intensity Variation of the Lithographic Beam, Patterning Speed, and Etching Time) were considered for stabilization of the direct laser lithography system, and the experimental results were presented.