• JSTS:Journal of Semiconductor Technology and Science
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• 제6권2호
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• pp.119-123
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• 2006

This work presents the fabrication and characteristics of $Bi_2O_3/Si$ heterojunction prepared by rapid thermal oxidation technique without any postdeposition annealing condition. The bismuth trioxide film was deposited onto monocrystalline Si and glass substrates by rapid thermal oxidation of bismuth film with aid of halogen lamp at $500^{\circ}C/\;45$ s in static air. The structural, optical and electrical properties of $Bi_2O_3$ film were investigated and compared with other published results. The structural investigation showed that the grown films are polycrystalline and multiphase (${\alpha}-Bi_2O_3$ and ${\beta}-Bi_2O_3$). Optical properties revealed that these films having direct optical band gap of 2.55 eV at 300 K with high transparency in visible and NIR regions. Dark and illuminated I-V, CV, and spectral responsivity of $Bi_2O_3/Si$ heterojunction were investigated and discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 추계학술대회 논문집
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• pp.86-89
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• 1994

This paper describes the fabrication and basic characteristics of a Si Hall device fabricated on a SOI(Si-on-insulator) structure. In which SOI structure was formed by SOB(Si-wafer direct bonding) technology and the insulator of the SOI structure was used as the dielectrical isolation layer of a Hall device. The Hall voltage and sensitivity of the implemented SDB SOI Hall devices showed good linearity with respectivity to the applied magnetic flux density and supple iud current. The product sensitivity of the SDB SOI Hall device was average 670 V/A$.$T and its value has been increased up to 3 times compared to that of bulk Si with buried layer of 10$\mu\textrm{m}$. Moreover, this device can be used at high-temperature, high-radiation and in corrosive environments.

• 소성∙가공
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• 제18권3호
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• pp.262-267
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• 2009

Selective laser sintering is a kind of rapid prototyping process whereby a three-dimensional part is built layer wise by laser scanning the powder. This process is highly influenced by powder and laser parameters such as laser power, scan rate, fill spacing and layer thickness. Therefore a study on fabricating Fe-Ni-Cr powder by selective laser sintering has been performed. In this study, fabrication was performed by experimental facilities consisting of a 200W fiber laser which can be focused to 0.08mm and atmospheric chamber which can control atmospheric pressure with argon. With power increase or energy density decrease, line width was decreased and line surface quality was improved with energy density increase. Surface quality of quadrangle structure was improved with fill spacing optimization.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.284-284
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• 2010

We report a fabrication of 6, 13-bis(triisopropylsilylethynyl) (TIPS) pentacene nanowires that made on Si substrates by liquid bridge-nanotransfer molding (LB-nTM) with polyurethane acrylate (PUA) mold. LB-nTM is based on the direct transfer of various materials from a stamp to a substrate via a liquid bridge between them. In liquid bridge-transfer process, the liquid layer serves as an adhesion layer to provide good conformal contact and form covalent bonding between the TIPS-pentacene nanowire and the Si substrate. The patterned TIPS-Pentacene nanowires have been investigated by Atomic force microscopy (AFM), Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM) and electrical properties.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.282-282
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• 2010

We report a new method of fabrication of polydiacetylene nanowire using liquid bridge-mediated nanotransfer molding (LB-nTM), a direct patterning method for the formation of two- or three-dimensional structures with feature sizes between tens of nanometers and tens of micron over large areas with various materials from a molder to a substrate via a liquid bridge between them. First, we fabricate assembled diacetylene monomer nanowire on the substrate then make it polymerize using 254nm UV-light irradiation. The Polydiacetylene nanowires have been investigated by UV-visible absorption spectroscopy, atomic force microscopy (AFM), and scanning electron microscopy (SEM).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.579-582
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• 2000

This paper described on the fabrication of SOI(Si-on-insulator) structures with buried cavities by SDB technology and eletrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -760mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annaling(100$0^{\circ}C$, 60 min.), the SDB SOI structure was thinned by electrochemical etch-stop. Finally, it was fabricated the SDB SOI structure with buried cavities as well as an accurate control and a good flatness.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.92.1-92.1
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• 2013

Molecular electronics has been the subject of intese research for many years because of the fundamental interest in molecular charge transport and potential applications, such as (bio)nanosensors and molecular memory devices. Molecular electronics requires a method for making reliable eletrical contacts to singlemolecules. To date, several approaches have been reported: scanning-probe microscopy, mechanical break junctions, nano patterning, and direct deposition of electrode on a self-assembled monolayers. However, most methods are laborious and difficult for large-scale application and more importantly, cannot control the number of moleucles in the junction. Recently, DNA has been used as a template for metallic nanostructures (e.g., Ag, Pd, and Au nanowires) through DNA metallization process. Furthermore, oligodeoxynucleotides have been tethered to organic molecules by using conventional organic reactions. Collectively, these techniques should provide an efficient route toward reliable and reproducible molecular electronic devices with large-scale fabrication. Therefore, I will present a paradigm for the fabrication of moleuclar electronic devices by using micrometer-sized DNA-singe organic molecule and DNA triblock structures.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.581-584
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• 2005

Ion beam processing is one of the key technologies to realize mastless and resistless sub 50nm nano fabrication. Unwanted effects, however, may occur since an energetic ion can interact with a target surface in various ways. Depending on the ion energy, the interaction can be swelling, deposition, sputtering, re-deposition, implantation, damage, backscattering and nuclear reaction. Sputtering is the fundamental mechanisms in ion beam induced direct patterning. Re-deposition and backscattering are unwanted mechanisms to avoid. Therefore understanding of ion beam-solid interaction should be advanced for further ion beam related research. In this paper we simulate some important interaction mechanisms between energetic incident ions and solid surfaces and the results are compared with experimental data. The simulation results are agreed well with experimental data.

• 한국기계가공학회지
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• 제20권10호
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• pp.38-43
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• 2021

Photocurable hydrogels are widely used as 3D printing materials in tissue engineering (e.g., scaffold fabrication) as well as optical fibers (or optical sensors) materials. Photocurable hydrogels can control optical and mechanical properties such as chemical or fabrication conditions. In previous research, we introduced a new 3D printing method to fabricate a freestanding overhanging hydrogel structure without supporting structure. This study was measured and analyzed the difference of the mechanical properties of the photocurable hydrogel according to the light intensity using a micro tensile tester. In practically, it was difficult to perform a direct tensile test on a micro (less than 1 mm) size fiber. In this study, the tensile test of the hydrogel fibers could be measured simply and repeatedly using a paper carrier.

• 한국재료학회지
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• 제34권3호
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• pp.144-151
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• 2024

This work focuses on the fabrication of excellent magnetic structures for trapping breast cancer cells. Micromagnetic structures were patterned for trapping cancer cells by depositing 30 nm of permalloy on a silicon substrate. These structures were designed and fabricated using two fabrication techniques: electron beam lithography and laser direct writing. Two types of magnetic structures, rectangular wire and zig-zagged wire, were created on a silicon substrate. The length of each rectangular wire and each straight line of zig-zagged wire was 150 ㎛ with a range of widths from 1 to 15 ㎛ for rectangular and 1, 5, 10 and 15 ㎛ for zigzag, respectively. The magnetic structures showed good responses to the applied magnetic field despite adding layers of silicon nitride and polyethylene glycol. The results showed that Si + Si₃N₄ + PEG exhibited the best adhesion of cells to the surface, followed by Si + Py + Si₃N₄ + PEG. concentration of 5-6 with permalloy indicates that this layer affected silicon nitride in the presence of Polyethylene glycolPEG.