• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.11
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• pp.739-745
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• 2008

This paper presents the measurement of ground thermal conductivity and the characteristics of ground thermal diffusion by a ground heat exchanger(GHE). A borehole is installed to a depth of 175 m with a diameter of 150 mm. To analyze the thermal diffusion property of the GHE, thermocouples are installed under the ground near the GHE. The outdoor temperature, the ground temperature, and the water temperature of the GHE are monitored for evaluating the characteristics of ground thermal diffusion. The ground thermal conductivity is evaluated by the in-situ thermal response tester and the line source model. It is found to be 3.08 W/$m^{\circ}C$ in this study. The ground temperature is greatly dependent on the outdoor temperature from the ground surface to 2.5 m in depth and is stable below 10 m in depth. The surface temperature of the GHE varies as a function of the temperature of circulating water. But the ground temperature at 1.5 m far from the GHE is not changed in accordance with the temperature of circulating water.

• Journal of Surface Science and Engineering
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• v.38 no.1
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• pp.28-36
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• 2005

In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal organic chemical vapor deposition (MOCVD) and annealed at the temperature between 250℃ and 550℃ in various ambient gases. When the Cu thin films were annealed in the hydrogen ambience compared with oxygen ambience, sheet resistance of Cu thin films decreased and the breakdown of TaN diffusion barrier was not occurred and a stable Cu/TaN/Si structure was formed at the annealing temperature of 450℃. In addition, reflow properties of Cu thin films could be enhanced in H₂ ambient. With Cu reflow process, we could fill the trench patterns of 0.16～0.24 11m with aspect ratio of 4.17～6.25 at the annealing temperature of 450℃ in hydrogen ambience. It is expected that Cu reflow process will be applied to fill the deep pattern with ultra fine structure in metallization.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.30 no.1
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• pp.59-70
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• 1998

A steady-state molecular diffusion experiment was conducted to evaluate the water vapor proof properties of paper Handsheets prepared from unbleached Itraft pulps(UKP) and old newspapers(ONP) and four different types of polymer-laminated white duplex board were tested under appropriate standard conditions. The diffusivity was determined on the basis of the Fickean first law. Results obtained from this study can be summarized as follows ; 1. The diffusivity data for handsheets showed about $10^{-5}cm^2/min$. whereas polymer-laminated paperboards had remarkably improved water-vapor resistance with about $10^3 to 10^4$ times lower diffusivity : 2. Sheet basis weight, wet-swelling and sizing degree had little influence on the diffusivity of paper; 3 Linear relationship existed between sheet density and diffusivity, and, 4. Highly sfgnificant linear relationship could be observed between diffusivity and Darcy s gas permeability. Results indicate that diffusivity, an intrinsic property of paper, can provide a valuable information for precise evaluation and improved quality control of water-vapor proof properties of paper.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.147-156
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• 1995

The change of microstructure in the bonded interlayer and tensile properties of joints were studied for liquid phase diffusion bonding using STS-310 and Incoloy-825 as base metal and base metal+B alloy as insert inetal. Main experimental results obtained in this study are as follows. 1) The optimum amount of B addition into the insert metal was found to be about 4mass%. 2) When isothermal solidification was completed, the microstructure in the bonded interlayer was the same with that of the base metal because of the grain boundary migration in the bonded interlayer. 3) All of the tensile specimen fractured at base metal and joints bonded at optimum condition exhibited tensile properties in excess of base metal requirements. 4) It was determined that fine car-borides and bordes such as M$_{23}$(C,B)$_{6}$, Cr$_{2}$B, and CrB in STS-310S and TiB in Incoloy-825 exist at the grain boundary around bonded interlayer. These precipitates almost disappeared after homogenizing treatment at 1373K for 86.4ks.s.

• Solar Energy
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• v.18 no.3
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• pp.63-69
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• 1998

The heat conduction and the water vapour diffusion flow through heat insulators between hygroscopical moist building materials were measured by means of the plate method. It was found that the heat transport increases with a moisture motion occuring in the temperature drop. On his basis of simplified assumptions, the increase in the thermal conductivity was calculated from the rate of diffusion flow per unit area, which generally resulted in values inferior to the measured values. The Increase in the heat transport due to water vapour diffusion measured at a large-scale wall specimen was inferior to the one measured by means of the plate method by using a comparable arrangement of layers. The overall heat transfer caused by moisture motion is not a characteristic value of the material, but a property of the whole wall structure

• Korean Journal of Materials Research
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• v.14 no.4
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• pp.246-250
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• 2004

We have investigated the effects of boron added to Cu film on the Cu-Ti reaction and microstructural evolution of Cu(B) alloy film during annealing of Cu(B)/Ti/$SiO_2$/Si structure. The result were compared with those of Cu(B)/$SiO_2$ structure to identify the effects of Ti glue layers on the Boron behavior and the result grain growth of Cu(B) alloy. The vacuum annealing of Cu(B)/Ti/$SiO_2$ multilayer structure allowed the diffusion of B to the Ti surface and forming $TiB_2$ compounds at the interface. The formed $TiB_2$ can act as a excellent diffusion barrier against Cu-Ti interdiffusion up to $800^{\circ}C$. Also, the resistivity was decreased to $2.3\mu$$\Omega$-cm after annealing at $800^{\circ}C$. In addition, the presence of Ti underlayer promoted the growth Cu(l11)-oriented grains and allowed for normal growth of Cu(B) film. This is in contrast with abnormal growth of randomly oriented Cu grains occurring in Cu(B)/$SiO_2$ upon annealing. The Cu(B)/Ti/$SiO_2$ structure can be implemented as an advanced metallization because it exhibits the low resistivity, high thermal stability and excellent diffusion barrier property.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.150-155
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• 2004

This study attempts to form a TiN barrier layer against Cu diffusion by the easier and more convenient method. In this new approach, Ti was sputter-deposited, and nitrided by heat-treating in the NH$_3$ambient. Sheet resistance of as-deposited Ti was 20 Ω/$\square$, but increased to 195 Ω/$\square$ after the heat-treatment at 30$0^{\circ}C$, and lowered to 120 Ω/$\square$ after the heat-treatment at 50$0^{\circ}C$, and $600^{\circ}C$. AES results for these thin films confirmed that the atomic ratio of Ti and N was close to 1:1 at or above 40$0^{\circ}C$ heat-treatment. However, it was also found that excessive oxygen was contained in the TiN layer. To examine the barrier property against Cu diffusion, 100nm Cu was deposited on the TiN layer and then annealed at 40$0^{\circ}C$ for 40 min.. Cu remained at the surface without diffusing into the Si layer.

• Journal of Information Technology Services
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• v.11 no.1
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• pp.15-37
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• 2012

This study is progressed for understanding of the acceptance intention differentiated through the view of smart phone non-user's adopting plan. And the research model is proposed in the view of new technology adopting, Innovation Diffusion Theory, Rogers 1995, and Technology Acceptance Model, Davis 1989. In the survey, SPSS 18.0 and AMOS 18.0 are used to analyze the 685 smart phone non-users data. The results of the feasibility analysis and the factor analysis show the measured variables determined in the statistical significant range. Also, 11 hypotheses, among the 16 hypotheses, are adopted by the hypothesis tests through the path analysis, one-way-ANOVA and hierarchial regression analysis. The results indicate variables affect on the non-smart phone user's adopting intention. The primary factor is the perceived usefulness, secondary factor is the social property, and the rest is the playfulness. And, the primary adoption factor is affected to early majority and late majority among each innovation adopters.

• Macromolecular Research
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• v.16 no.6
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• pp.555-560
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• 2008

A series of hydroxyl-group containing polyimides (HPIs) were prepared in order to investigate the structure-gas permeation property relationship. Each polymer membrane had structural characteristics that varied according to the dianhydride monomers. The imidization processes were monitored using spectroscopic and thermog-ravimetric analyses. The single gas permeability of He, $H_2$, $CO_2$, $O_2$, $N_2$ and $CH_4$ were measured and compared in order to determine the effect of the polymer structure and functional -OH groups on the gas transport properties. Surprisingly, the ideal selectivity of $CO_2/CH_4$ and $H_2/CH_4$ increased with increasing level of -OH incorporation, which affected the diffusion of $H_2$ or the solubility of $CO_2$ in HPIs. For $H_2/CH_4$ separation, the difference in the diffusion coefficients of $H_2$ and $CH_4$ was the main factor for improving the performance without showing any changes in the solubility coefficients. However, the solubility coefficient of $CO_2$ in the HPIs increased at least four fold compared with the conventional polyimide membranes depending on the polymer structures. Based on these results, the polymer membranes modified with -OH groups in the polymer backbone showed favorable gas permeation and separation performance.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.2
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• pp.65-73
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• 2012

The Gas Diffusion Layer (GDL) of fuel cell, are required to provide both delivery of reactant gases to the catalyst layer and removal of water in either vapor or liquid form in typical PEMFCs. In this study, the fabrication of GDL containing Micro Porous Layer (MPL) made of the slurry of PVDF mixed with carbon black is investigated in detail. Physical properties of GDL containing MPL, such as electrical resistance, gas permeability and microstructure were examined, and the performance of the cell using developed GDL with MPL was evaluated. The results show that MPL with PVDF binder demonstrated uniformly distributed microstructure without large cracks and pores, which resulted in better electrical conductivity. The fuel cell performance test demonstrates that the developed GDL with MPL has a great potential due to enhanced mass transport property due to its porous structure and small pore size.