• International Journal of Automotive Technology
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• v.8 no.6
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• pp.761-769
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• 2007

The configuration of the flow channel on a bipolar plate of a proton exchange membrane fuel cell(PEMFC) for efficient reactant supply has great influence on the performance of the fuel cell. Recent demand for higher energy density fuel cells requires an increase in current density at mid voltage range and a decrease in concentration overvoltage at high current density. Therefore, an interdigitated flow channel where mass transfer rate by convection through a gas diffusion layer is greater than the mass transfer by a diffusion mechanism through a gas diffusion layer was recently proposed. This study attempts to analyze the i-V performance, mass transfer and pressure drop in interdigitated flow channels by developing a fully three dimensional simulation model for PEMFC that can deal with anode and cathode flow together. The results indicate that the trade off between performance and pressure loss should be considered for efficient design of flow channels. Although the performance of the fuel cell with interdigitated flow is better than that with conventional flow channels due to a strong mass transfer rate by convection across a gas diffusion layer, there is also an increase in friction due to the strong convection through the porous diffusion layer accompanied by a larger pressure drop along the flow channel. It was evident that the proper selection of the ratio of channel and rib width under counter flow conditions in the fuel cell with interdigitated flow are necessary to optimize the interdigitated flow field design.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.41.2-41.2
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Metal Oxide Semiconductor) based electronic devices become much faster speed and smaller size than ever before. However, very narrow interconnect line width causes some drawbacks. For example, deposition of conformal and thin barrier is not easy moreover metallization process needs deposition of diffusion barrier and glue layer. Therefore, there is not enough space for copper filling process. In order to overcome these negative effects, simple process of copper metallization is required. In this research, Cu-V thin alloy film was formed by using RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane $SiO_2$/Si bi-layer substrate with smooth and uniform surface. Cu-V film thickness was about 50 nm. Cu-V layer was deposited at RT, 100, 150, 200, and $250^{\circ}C$. XRD, AFM, Hall measurement system, and XPS were used to analyze Cu-V thin film. For the barrier formation, Cu-V film was annealed at 200, 300, 400, 500, and $600^{\circ}C$ (1 hour). As a result, V-based thin interlayer between Cu-V film and $SiO_2$ dielectric layer was formed by itself with annealing. Thin interlayer was confirmed by TEM (Transmission Electron Microscope) analysis. Barrier thermal stability was tested with I-V (for measuring leakage current) and XRD analysis after 300, 400, 500, 600, and $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However V-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Thus, thermal stability of vanadium-based thin interlayer as diffusion barrier is good for copper interconnection.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.111-118
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• 2002

A new lithium niobate optical modulator with a polymer buffer layer on Ni in-diffused optical waveguide is proposed for the fist time, successfully fabricated and examined at a wavelength of 1.3 mm. By determining the diffusion parameters of Ni in-diffused waveguide to achieve more desirable mode size which is well matched to the mode in the fiber, the detailed results on the achievement of high optical throughput are reported. In addition, the usefulness of polymer buffer layer which can be applicable to a buffer layer in Ni in-diffused waveguide devices is demonstrated. Several sets of channel waveguides fabricated on Z-cut lithium niobate by Ni in-diffusion were obtained and on which coplanar traveling-wave type electrodes with a polymer-employed buffer layer were developed by a conventional fabrication method for characterizing of electro-optical performances of the proposed device. The experimental results show that the measured half-wave voltage is of ~10 V and the total measured fiber-to-fiber insertion loss is of ~6.4 dB for a 40 mm long at a wavelength of =1.3 mm, respectively. From the experimental results, it is confirmed that the polymer-employed buffer layer in LiNbO3 optical modulator can be a substitute material instead of silicon oxide layer which is usually processed at a high temperature of over $300^{\circ}C$. Moreover, the fabrication tolerances by using polymer materials in LiNbO3 optical modulators are much less strict in comparison to the case of dielectric buffer layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.37-40
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• 2001

This paper presents the modeling methodology of Zinc diffusion process applied for high-speed avalanche photodiode fabrication using neural networks. Three process factors (sealing pressure, amount of Zn$_3$P$_2$ source per volume, and doping concentration of diffused layer) are examined by means of D-optimal design experiment. Then, diffusion rate and doping concentration of Zinc in diffused layer are characterized by a static response model generated by training fred-forward error back-propagation neural networks. It is observed that the process models developed here exhibit good agreement with experimental results.

• Journal of the Korean Magnetics Society
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• v.16 no.2
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• pp.121-129
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• 2006

The diffusion theory for spin injection from magnetic layer into nonmagnetic layer was reviewed. Basic equations were derived and applied to a ferromagnet/semiconductor/ferromagnet system. The spin polarization and magnetoresistance were calculated. The reason for difficulty in detecting spin injection with magnetoresistance was explained, and a possible solution was discussed.

• Journal of the Korean institute of surface engineering
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• v.16 no.3
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• pp.98-107
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• 1983

A study on the improvement of wear resistance of brasses by electroplating and diffusion treatment of tin was carried out. The optimum condition of the treatment obtained was as follows. Plating thickness of tin : 5 - 9 $\mu\textrm{m}$ Condition of diffusion treatment : atmosphere ; fused nitrate bath (KNO3 + NaNO3) temperature and time ; 1st step 320$^{\circ}C$, 60min. and 450$^{\circ}C$, 30min. During the diffusion treatment, internetallic compounds of Cu-Sn were formed and these compounds were identified as η, $\varepsilon$ and $\delta$ phase from the outer tin layer. It was considered that the improvement of wear resistance of brasses by the treatment is because of the formation of intemetallic compounds particalarly $\varepsilon$phase which is very hard, between soft tin layer brass.

• Journal of the Korean Ceramic Society
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• v.30 no.6
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• pp.510-516
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• 1993

$PbTiO_3$ thin films have been formed by rapid thermal annealing(RTA) of $TiO_2$/Pb/$TiO_2$ multilayer films deposited on Si wafers by RF sputtering. Based on the optimal depositon conditions of TiO2 and Pb, $TiO_2$/Pb/$TiO_2$ three layers were deposited for 900$\AA$ each. These films were subjected to RTA process at the temperatures ranging from $400^{\circ}C$ to $900^{\circ}C$ for 30 seconds in air, and were analyzed by X-ray diffraction and transmission electron microscopy to investigate the phases and the microstructures. As a result, perovskite $PbTiO_3$ phases was obtained above $500^{\circ}C$ with the trace of unreacted $TiO_2$. RBS analysis revealed the anisotropic behavior of diffusion that the diffusivity of Pb to the bottom $TiO_2$ layer was faster than that of Pb to the top $TiO_2$ layer. The amorphous Pb-silicate was formed between film and Si substrate due to the diffusion of Pb, but Pb-silicate existed locally at the interface and the amount of that phase was very small. Therefore the effect of bottom $TiO_2$ layer as a diffusion barrier was confirmed. $PbTiO_3$ films formed by current technique showed a relative dielectric constant of 60, and the maximum breakdown field reached 170kV/cm.

• 한국해양학회지
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• v.12 no.1
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• pp.7-12
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• 1977

Vertical mixing in the ocean affects the formation of water masses as well as the vertical distribution of nutrients and dissolved substances. this study is to investigate the effect of stability on the intensity of vertical transfer in the case of shallow and straitfied channel. It is found that the relation of the stability and vertical turbulent diffusion is given by K$\sub$z/ = -${\beta}$-(c+${\beta}$) / ${\alpha}$(E-1/${\alpha}$) where K$\sub$z/ and E denotes the vertical turbulent diffusion coefficient and stability, respectively. The empirical coefficients ${\alpha}$, ${\beta}$ and c depend on the magnitude of vertical components and stability, i.e., through thermocline intensity. The study indicates that the diffusivity of the surface mixed layer is (K$\sub$z/)=300∼1,200$\textrm{cm}^2$/sec, the thermocline layer is (K$\sub$z/)= 50∼200$\textrm{cm}^2$/sec and the cold layer is (K$\sub$z/)=200∼600$\textrm{cm}^2$/sec based on near- minimum least-squares error estimates from the regression analysis. An important result of our study comes out that the model is in accordance with the general trends of the effect of stability on the vertical turbulent diffusion coefficients in the case of shallow and strongly stratified channel.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.2
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• pp.130-138
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• 1996

It has been investigated that the ion nitriding effects of a STD61 steel in various time conditions of 3 to 9 hours, and the microstructure of compound and diffusion layers of the ion nitrided specimen for 6 hours and subsequently reheated for 1 hour at various temperatures of $400{\sim}800^{\circ}C$ As the nitriding time increased, the thickness of compound and diffusion layers was increased, but the hardness of surface was not considerably increased (Max Hv=1045 at 9hrs). Some of the nitrogen was denitrided out of the surfac and diffused into the core, and also the oxides ($Fe_3O_4$, $Fe_2O_3$) were formed on the surface of the specimen during reheating. The compound layer was partially decomposed at about $600^{\circ}C$ but the diffusion layer was increased up to $800^{\circ}C$. With increasing reheated temperture, the hardness of the surface was decreased, whereas the hardness depth of diffusion layer (0.25mm) was increased up to $600^{\circ}C$ more than that of ion nitrided (0.18mm). The blend-heat treated STD61 steel by ion nitriding is therefore expected to hold on the characteristics of ion nitriding up to $600^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.188-188
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• 2011

Recently, scaling down of ULSI (Ultra Large Scale Integration) circuit of CMOS (Complementary Meta Oxide Semiconductor) based electronic devices, the electronic devices, become much faster and smaller size that are promising property of semiconductor market. However, very narrow interconnect line width has some disadvantages. Deposition of conformal and thin barrier is not easy. And metallization process needs deposition of diffusion barrier and glue layer for EP/ELP deposition. Thus, there is not enough space for copper filling process. In order to get over these negative effects, simple process of copper metallization is important. In this study, Cu-V alloy layer was deposited using of DC/RF magnetron sputter deposition system. Cu-V alloy film was deposited on the plane SiO2/Si bi-layer substrate with smooth surface. Cu-V film's thickness was about 50 nm. Cu-V alloy film deposited at $150^{\circ}C$. XRD, AFM, Hall measurement system, and AES were used to analyze this work. For the barrier formation, annealing temperature was 300, 400, $500^{\circ}C$ (1 hour). Barrier thermal stability was tested by I-V(leakage current) and XRD analysis after 300, 500, $700^{\circ}C$ (12 hour) annealing. With this research, over $500^{\circ}C$ annealed barrier has large leakage current. However vanadium-based diffusion barrier annealed at $400^{\circ}C$ has good thermal stability. Therefore thermal stability of vanadium-based diffusion barrier is desirable for copper interconnection.