• Journal of Welding and Joining
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• v.20 no.6
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• pp.830-837
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• 2002

This study investigated variations of micro-structures and mechanical properties of Ti / STS321L joint with various bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed that the thickness of their reaction layer increased due So increasing diffusion rate and time. From the EPMA results, Ti diffused to the STS321L substrate according to increasing bending time to 30min. Hardness of bonded interface increased with increasing bonding temperature and time due to increasing their oxides and intermetallic compounds. XRD data indicated that Ag, Ag-Ti intermetallic compounds, TiAg and $Ti_3Ag$ and titanium oxide, $TiO_2$ were formed in interface. In tensile test, it was found that the tensile strength had a maximum value at the bonding temperature of $900^{\circ}C$ and time of 5min, and tensile strength decreased over bonding time of 5min. The critical thickness of intermetallic compounds was observed to about $30\mu\textrm{m}$, because of brittleness from their excessive intermetallic compounds and titanium oxide, and weakness from void.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.242-247
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• 2009

On the Transient Liquid Phase Bonding (TLPB) phenomenon with the MBF-50 insert metal at narrow gap (under 100), it takes long time for the bonding and the homogenizing. Typically, isothermal solidification is controlled by the diffusion of depressed element of B and Si. However, the amount of B and Si in the MBF-50 filler metal is large. This is reason of the long bonding time. Also, the MBF-50 filler metal did not contained Al and Ti which are ${\gamma}^{\prime}$ phases former. This is reason of the long homogenizing time. From the bonding phenomenon with the MBF-50 insert metal, we search main factors on the bonding mechanism and select several insert-metals for using the wide-gap TLPB. New insert-metals contained Al and Ti which are ${\gamma}^{\prime}$ phases former and decrease the B then the MBF-50. When the new insert-metal was used on the TLPB, the bonding time was decreased about 1/10 times and homogenizing heat treatment was no needed. In spite of the without homogenizing, the volume fraction of ${\gamma}^{\prime}$ phases in the boned interlayer was equal to homogenizing heat treated specimen which was TLPB with the MBF-50. Finally, the new insert metal named WG1 for the wide-gap TLPB is more efficient then the MBF-50 filler metal without decreasing the bonding characteristic.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.688-693
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• 2002

Adhesive bonding is becoming one of the popular joining techniques in metal industries, since it has some advantages over other techniques such as welding and diffusion bonding, e.g., any dissimilar metals are easily adhesive-bonded together. In this study, the experiments were carried out in order to provide the statistical data with strength evaluation methods: tension, shear and four-point bending tests for thermoplastic epoxy resin based adhesive-bonded metal joints. We should certificate on the probability of the adhesive strength that has the tendency of brittle fracture, the adhesive bonding strength between metals with thermoplastic adhesive has the best probability at four-point bending test. The strength testing method that has higher probability is four-point bending test, shear test and tensile test in order.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.10
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• pp.101-105
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• 1990

The use of a sol-gel processed cordierite precursor sinterable about$900^{\circ}C$ allows cosintering of the copper and the ceramic. A strong bonding between the copper film and the cordierite substrate can be achieved through an eutectic bonding technique. These interfaces were investigated using STEM. copper diffusion as well as strong chemical and structural modifications was observed in the interface region. Although these interfaces have good adhesion properties, there was no evidence of the formation of the copper compound at the interface.

• Journal of the Korean institute of surface engineering
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• v.24 no.1
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• pp.16-16
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• 1991

Generally brittle eta phase produced during TiC deposition has a effect on the TRS (transverse rupture strength ; thoughness). Therefore it is necessary to reduce eta(η), phase for the improvement of tool life. At this experiment some properties (TRS, bonding strength, tool life, eta phase)have been investigated by inserting TiN or TiCN underlayer between TiC layer and substrate. The results obtained were as follows; 1. by inserting underlayer eta phase were decreased and TRS was increased, but the bonding strength was decreased. 2. the diffusion of W, Co from the substrate was hindered by the underlayer. 3. TiC layer with TiCN underlayer had the finsest grain size. 4. by inserting underlayer (TiCN or TiN) the tool life was improved and especially notch and crater wear resistance was greatly improved.

• Journal of the Korean institute of surface engineering
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• v.25 no.1
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• pp.16-23
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• 1992

Generally brittle eta phase produced during TiC deposition has a bad effect on the TRS (transverse rupture strength ; thoughness). Therefore it is necessary to reduce eta(η) phase for the improvement of tool life. At this experiment some properties (TRS, bonding strength, tool life, eta phase) have been investigated by inserting TiN or TiCN underlayer between TiC layer and substrate. The results obtained were as fellows; 1. by inserting underlayer eta phase was decreased and TRS was increased, but the bonding strength was decreased. 2. the diffusion of W, Co from the substrate was hindered by the underlayer. 3. TiC layer with TiCN underlayer had the finsest gain size. 4. by inserting underlayer (TiCN or TiN) the tool life was improved and especially notch and crater wear resistance was greatly improved.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1134-1135
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• 2006

A revolutionary "Active Braze Coated Diamond" (ABCD) has been developed for bonding diamond grits firmly in the metal matrix. The molten braze is wetted and reacted with diamond to form strong chemical bond at the interface so that the diamond does not become knocked out of tools. The ABC is a nickel alloy that can form metallurgical diffusion bondswith the metal matrix. In essence, ABCD turns diamond into a metal grain so that the diamond tools can be made by conventional powder metallurgical process without being concerned about the poor bonding between matrix metal powder and the diamond as before.

• Journal of the Korean Ceramic Society
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• v.31 no.4
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• Transactions of Materials Processing
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• v.31 no.6
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• pp.337-343
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• 2022

Electrically assisted pressure joining (EAPJ) utilizes electric current-induced kinetic enhancement to achieve solid state diffusion bonding within a short time. In this study, aluminum alloy specimens, which are known as a hard-to-weld metal, were successfully solid-state joined through EAPJ. The bonding process was performed in two ways: continuous direct current (CDC), which applies relatively low current density, and pulsed direct current (PDC), which applies high current density. It was observed that the bonding strength was higher in PDC than in CDC. The microstructure of the joint was characterized using 3D X-ray microscopy (XRM) and electron backscatter diffraction (EBSD).

• Korean Journal of Remote Sensing
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• v.19 no.6
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• pp.479-490
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• 2003

This study proposed a modified anisotropic diffusion restoration for image classification. The anisotropic diffusion restoration uses a probabilistic model based on Markov random field, which represents geographical connectedness existing in many remotely sensed images, and restores them through an iterative diffusion processing. In every iteration, the bonding-strength coefficient associated with the spatial connectedness is adaptively estimated as a function of brightness gradient. The gradient function involves a constant called "temperature", which determines the amount of discontinuity and is continuously decreased in the iterations. In this study, the proposed method has been extensively evaluated using simulated images that were generated from various patterns. These patterns represent the types of natural and artificial land-use. The simulated images were restored by the modified anisotropic diffusion technique, and then classified by a multistage hierarchical clustering classification. The classification results were compared to them of the non-restored simulation images. The restoration with an appropriate temperature considerably reduces error in classification, especially for noisy images. This study made experiments on the satellite images remotely sensed on the Korean peninsula. The experimental results show that the proposed approach is also very effective on image classification in remote sensing.