• Korean Journal of Materials Research
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• v.29 no.3
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• pp.175-182
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• 2019

This study examines paraelectric $Bi_{1.5}Zn_{1.0}Nb_{1.5}O_7$ (BZN), which has no hysteresis and high dielectric strength, for energy density capacitor applications. To increase the breakdown dielectric strength of the BZN film further, poly(vinylidene fluoride) BZN-PVDF composite film is fabricated by aerosol deposition. The volume ratio of each composition is calculated using dielectric constant of each composition, and we find that it was 12:88 vol% (BZN:PVDF). To modulate the structure and dielectric properties of the ferroelectric polymer PVDF, the composite film is heat-treated at $200^{\circ}C$ for 5 and 30 minutes following quenching. The amount of ${\alpha}-phase$ in the PVDF increases with an increasing annealing time, which in turn decreases the dielectric constant and dielectric loss. The breakdown dielectric strength of the BZN film increases by mixing PVDF. However, the breakdown field decreases with an increasing annealing time. The BZN-PVDF composite film has the energy density of $4.9J/cm^3$, which is larger than that of the pure BZN film of $3.6J/cm^3$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.44-48
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• 1999

In order to the investigate for the DC(forward-reverse) breakdown properties of gate oxide in MOSFET, we are manufactured the specimen as following. The resistivity is 1.2($\Omega$ $.$ cm), 1.5($\Omega$ $.$ cm) and 1.8($\Omega$ $.$ cm) when thickness is 600(${\AA}$), and the diffusion time is both 110[min] and 150[min] when thickness is 600[${\AA}$]. In DC dielectric strength due to the each resistivity, it is confirmed that almost of the leakage current and breakdown current is flowed through n+ source when positive bias is applied, but is flowed through P region when negative bias is applied. It is thought that the dielectric strength due to the diffusion time is the contribution as increasing of p region.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.436-438
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• 1987

The thermal oxidation recipe has been optimized for very thin (12 nm) capacitor oxide for Mega bit DRAM. The time dependent dielectric breakdown characteristics show that the breakdown voltage and time to breakdown are very high and uniform, indication that our oxide is defect free and suitable for DRAM capacitor dielectric. To our knowledge this is the best oxide quality obtained up tp now around 10 nm.

• Proceedings of the KIEE Conference
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• 1991.11a
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• pp.241-244
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• 1991

In this paper, we introduced Silicon Oxynitride films deposited by Laser CVD, and evaluated the electrical breakdown of these films by TZDB(Time Zero Dielectric Breakdown) and TDDB(Time Dependent Dielectric Breakdown) test. In addition, high frequency C-V test was done in order to calculate hysterisis and flatband voltage(before and after electric field stress). Failure times against eletric field are examined and electric field accelation factor $\beta$ are obtained, and long term reliability was also described by extrapolating into life time in the operating voltage(5V). In this experiments, the deposited films with increased temperature represented small flatband voltage, hysterisis and favorable breakdown characteristics, this is why the hydrogen in the film was decreased and the film was densified, long term reliability was good in the laser CVD SiON films.

• 전기의세계
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• v.30 no.6
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• pp.357-365
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• 1981

When electronegative gas SF$_{6}$ is dissolved and charged with insulating oil, the effect caused in the process by electronegative characteristic is studied and also the pressure effect caused by electronegative SF$_{6}$ acting on the liquid-level is examined respectively. When inert gas Ar is used to find a pressure effect acting on the liquid-level, its effect on dielectric strength is considered in the experiment. With three kinds of impulse voltage different in the duration of wave front and wave tail, a brief experiment if carried out ot see the effects on the dielectric breakdown characteristic as the wave is changing; either if I$_{2}$ and SF$_{6}$ are added to the insulating oil, or if the oil pressure is increased by Ar the dielectric strength becomes great and the longer the duration of wave front is, the greater the increase of the breakdown voltage, because I$_{2}$ added by a small quantity brings about some hirderance in the formation of gas phase. Likewise, the greater the changed pressure is, the greater the incerase of the breakdown voltage. When SF$_{6}$ is charged, the electronegative characteristic is prevailing at the time of low balanced pressure, and the pressure effect at the time of high balanced pressure.ressure.

• Journal of the Korean Vacuum Society
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• v.3 no.1
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• pp.71-76
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• 1994

The electrical characteristics of the capacitor dielectric films of amorphous silicon-nit-ride-oxide(ANO) structures are compared with the capacitor dielectric films of oxide-nitride-oxide (ONO) structrues The electrical characteristics of ONO and ANO films were evaluated by high frequency(1 MHz) C-V high frequency C-V after constant voltage stree I-V TDDB and refresh time measurements. ANO films shows good electrical characteristics such as higher total charge to breakdown storage capacitance and longer refresh time than ONO films. Also it makes little difference that leakage current and flat band voltage shyift(ΔVfb)of ANO ana ONO films.

• Journal of Industrial Technology
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• v.8
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• pp.23-30
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• 1988

In this paper, the characteristics of electrical breakdown and TDDR (Time Dependant Dielectric Breakdown) were studied to evaluate stability and reliability of thin insulator films such as oxide and nitride. As the oxide film thickness decreased, the electrical breakdown field was increased proportioning to its reverse square root, ${d^{-\frac{1}{2}}}$. As for the temperature dependance of breakdown field, its field was inclined to decrease as temperature increased. It also showed that oxide charge (Qss) was changed by stress field and stress time. Consequently, TDDB characteristics and breakdown mechanism proved the improvement of reliability and stability and provided the accurate analysis to predict a device life time.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.11
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• pp.105-112
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• 1993

Oxide and reoxidized-nitrided-oxide were formed by furnace oxidation and rapid thermal processing (RTP). MOS capacitor and n-MOSFET's with those films as gate insulators were fabricated. The electrical characteristics of insulators were evaluated by current-voltage, high-frequency capacitance-voltage (C-V), and time-dependent dielectrical breakdown (TDDB) measurements. The hot carrier effects of MOSFET's were also investigated. Time-dependent dielectrical breakdown (TDDB) characteristics show that the life time of reoxidized-nitrided-oxide films is about 3 times longer than that of oxides. Hot carrier effects reveal that the life time of MOSFET's with reoxidized-nitrided-oxides is about 3 times longer than that of MOSFET's with oxides. Therefore, it is found that the reliability of dielectric films estimated by the hot carrier effects of MOSFET's is consistent with that of dielectric films from TDDB method.

• Proceedings of the KIEE Conference
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• 1991.07a
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• pp.191-193
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• 1991

In this paper, we introduce silicon dioxide films deposited by Laser CVD, and evaluate the breakdown characteristics of these films by TZDB(Time Zero Dieiectric Breakdown) and TDDB(Time Dependent Dielectric Breakdown) test, failure times against eletric field are examined and accelation factors ${\beta}$ are obtained, and also, long term reliability is described by examining TDDB under positive voltage bias, all the above results are compared with PECVD(Plasma Enhanced CVD) $SiO_2$ breakdown, data, as a result, it is shown that the breakdown characteristics of Laser CVD $SiO_2$ films is improved.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.11a
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• pp.1-4
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• 1998

In this paper, we have studied a variation of I-V characteristics, and time-dependent dielectric breakdown(TDDB) of thin layer NO and ONO film depending on nitridation and reoxidation time, respectively, and measured a variation of leakage current and charge-to-breakdown(Q$\_$bd/) of optimized NO and ONO film depending on ambient temperature, and then compared with the properties of conventional SiO$_2$. From the results, we find that these NO and ONO thin films are strongly influenced by process time and the optimized ONO film shows superior dielectric characteristics, and Q$\_$bd/ performance over the NO film and SiO$_2$, while maintaining a similar electric field dependence compared with NO layer.