• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.433-438
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• 2024

Piezoelectric ceramics play an important role in various electronic applications. However, traditional ceramics are difficult to be used in some complicated structures, due to their low flexibility and high brittleness. To solve this problem, this study prepared and investigated ceramic/polymer composites that can utilize a good flexibility of polymers. Polyvinylidene fluoride-trifluoroethylene (PVDF-TrFE) and 0.77(Bi_1/2Na_1/2)TiO₃-0.23SrTiO₃ (BNST23) ceramics were selected to fabricate the composites. Ceramic/polymer composites were prepared using various volume fractions of BNST23 ceramics. The distribution of piezoceramic particles in BNST23/PVDF-TrFE composites was investigated using optical microscopy (OM) and scanning electron microscopy (SEM). The dielectric and piezoelectric properties of the composites were significantly influenced by the volume fraction of the piezoelectric ceramics. As a result, the highest piezoelectric constant (d₃₃) of 56 pC/N was obtained in a composites with 70% volume fraction of BNST23 ceramics. Accordingly, it is expected that BNST23/PVDF-TrFE composites can be applied to various sensor applications.

• Advances in nano research
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• v.9 no.1
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• pp.1-13
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• 2020

In this work, the electrical potential (EP) technique with an artificial neural networks (ANNs) for monitoring of nanostructures are used for the first time. This study employs an expert system to identify size and localize hidden nano-delamination (N.Del) inside layers of nano-pipe (N.P) manufactured from Basalt Fiber Reinforced Polymer (BFRP) laminate composite by using low-cost monitoring method of electrical potential (EP) technique with an artificial neural networks (ANNs), which are combined to decrease detection effort to discern N.Del location/size inside the N.P layers, with high accuracy, simple and low-cost. The dielectric properties of the N.P material are measured before and after N.Del introduced using arrays of electrical contacts and the variation in capacitance values, capacitance change and node potential distribution are analyzed. Using these changes in electrical potential due to N.Del, a finite element (FE) simulation model for N.Del location/size detection is generated by ANSYS and MATLAB, which are combined to simulate sensor characteristic, therefore, FE analyses are employed to make sets of data for the learning of the ANNs. The method is applied for the N.Del monitoring, to minimize the number of FE analysis in order to keep the cost and save the time of the assessment to a minimum. The FE results are in excellent agreement with an ANN and the experimental results available in the literature, thus validating the accuracy and reliability of the proposed technique.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.9
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• pp.1561-1565
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• 2007

According to thermal degradation on power transformers, it is known that electrical, mechanical and chemical characteristics for power transformer's oil-paper are changed. In the chemical property, especially, when the kraft paper is aged, the cellulose polymer chains break down into shorter lengths. It causes decrease in both tensile strength and degree of polymerization of paper insulation. Also the paper breakdown is accompanied by an increase in the content of various furanic compounds within the dielectric liquid. It is known that furanic components in transformer oil come only from the decomposition of insulating paper rather than from the oil itself. Therefore the analysis of furanic degradation products provides a complementary technique to dissolved gas analysis for monitoring transformers when we evaluate the aging of insulating paper by the total concentration of carbon monoxide and carbon dioxide dissolved in oil only. Recently, the analysis of furanic compounds by high performance liquid chromatography(HPLC) using IEC 61198 method for estimating degradation of paper insulation in power transformers has been used more conveniently for assessment of oil-paper. It is know that the main products which is produced by aging are 2-furfuryl alcohol, 2-furaldehyde(furfural), 2-furoic acid, 2-acetylfuran, 5-methyl-2-furaldehyde, and 5-hydroxymethyl-2-furaldehyde. For investigating the accelerated aging process of oil-paper samples we manufactured accelerating aging equipment and we estimated variation of insulations at $140^{\circ}C$ temp. during 500 hours. Typical transformer proportions of copper, silicon steel and iron have been added to oil-paper insulation during the aging process. The oil-paper insulation samples have been measured at intervals of 100 hours. Finally we have analyzed that 2-furoic acid and 2-acetylfuran products of furanic compounds were detected by HPLC, and their concentrations were increased with accelerated aging time.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1425_1426
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• 2009

In this study, commercially available polyethylene terephthalate(PET), which is widely used as a substrate of flexible electronic devices, was modified by dielectric barrier discharge(DBD) method in an air condition at atmospheric pressure, and aluminium - doped zinc oxide (ZnO:Al) transparent conducting film was deposited on PET substrate by r. f. magnetron sputtering method. Surface analysis and characterization of the plasma-treated PET substrate was carried out using contact angle measurements, X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscopy (AFM). Especially the effect of surface state of PET substrate on some important properties of ZnO:Al transparent conducting film such as electrical and morphological properties and deposition rate of the film, was studied experimentally. The results showed that the contact angle of water on PET film was reduced significantly from $62^{\circ}$ to $43^{\circ}$ by DBD surface treatment at 20 min. of treatment time. The plasma treatment also improved the deposition rate and electrical properties. The deposition rate was increased almost linearly with surface treatment time. The lowest electrical resistivity as low as $4.97{\times}10^{-3}[\Omega-cm]$ and the highest deposition rate of 234[${\AA}m$/min] were obtained in ZnO:Al film with surface treatment time of 5min. and 20min., respectively.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.5
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• pp.800-805
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• 2017

The accelerated thermal ageing of CSPE (chlorosulfonated polyethylene) was carried out for 16.82, 50.45, and 84.09 days at $110^{\circ}C$, equivalent to 20, 60, and 100 years of ageing at $50^{\circ}C$ in nuclear power plants, respectively. As the accelerated thermally aged years increase, the insulation resistance and resistivity of the CSPE decrease, and the capacitance, relative permittivity and dissipation factor of those increase at the measured frequency, respectively. As the accelerated thermally aged years and the measured frequency increase, the phase degree of response voltage vs excitation voltage of the CSPE increase but the phase degree of response current vs excitation voltage decrease, respectively. As the accelerated thermally aged years increase, the apparent density, glass transition temperature and the melting temperature of the CSPE increase but the percent elongation and % crystallinity decrease, respectively. The differential temperatures of those are $0.013-0.037^{\circ}C$ and, $0.034-0.061^{\circ}C$ after the AC and DC voltages are applied to CSPE-0y and CSPE-20y, respectively; the differential temperatures of those are $0.011-0.038^{\circ}C$ and $0.002-0.028^{\circ}C$ after the AC and DC voltages are applied to CSPE-60y and CSPE-100y, respectively. The variations in temperature for the AC voltage are higher than those for the DC voltage when an AC voltage is applied to CSPE. It is found that the dielectric loss owing to the dissipation factor($tan{\delta}$) is related to the electric dipole conduction current. It is ascertained that the ionic (electron or hole) leakage current is increased by the partial separation of the branch chain of CSPE polymer as a result of thermal stress due to accelerated thermal ageing.

• Advances in aircraft and spacecraft science
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• v.4 no.5
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• pp.515-528
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• 2017

Since composite structures are widely used in structural engineering, delamination in such structures is an important issue of research. Delamination is one of a principal cause of failure in composites. In This study the electrical potential (EP) technique is applied to detect and locate delamination in basalt fiber reinforced polymer (FRP) laminate composite pipe by using electrical capacitance sensor (ECS). The proposed EP method is able to identify and localize hidden delamination inside composite layers without overlapping with other method data accumulated to achieve an overall identification of the delamination location/size in a composite, with high accuracy, easy and low-cost. Twelve electrodes are mounted on the outer surface of the pipe. Afterwards, the delamination is introduced into between the three layers (0º/90º/0º)s laminates pipe, split into twelve scenarios. The dielectric properties change in basalt FRP pipe is measured before and after delamination occurred using arrays of electrical contacts and the variation in capacitance values, capacitance change and node potential distribution are analyzed. Using these changes in electrical potential due to delamination, a finite element simulation model for delamination location/size detection is generated by ANSYS and MATLAB, which are combined to simulate sensor characteristic. Response surfaces method (RSM) are adopted as a tool for solving inverse problems to estimate delamination location/size from the measured electrical potential changes of all segments between electrodes. The results show good convergence between the finite element model (FEM) and estimated results. Also the results indicate that the proposed method successfully assesses the delamination location/size for basalt FRP laminate composite pipes. The illustrated results are in excellent agreement with the experimental results available in the literature, thus validating the accuracy and reliability of the proposed technique.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.332-332
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• 2010

We have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films withouWe have successfully demonstrated the inkjet printing method to create $Al_2O_3$ films without a high temperature sintering process. In order to remove the coffee ring effect in the ink drop, we have introduced a co-solvent system in order to create Marangoni flow in the ink drop, which leads to the dense packing of ceramic powders on the substrate during inkjet process. The packing density of the Inkjet-printed $Al_2O_3$ films is around 60% (max. 70%) which is very high compared to the value obtained from the same material films by other conventional methods such as film casting, dip coating process, etc. The voids inside the films (which are around 40% of the entire film volume) are filled with the polymer resin (Cyanate ester) by the infiltration process. This resin infiltration is also implemented by the inkjet printing process right after the Ah03 film ink-jetting process. The microstructures of the printed $Al_2O_3$ films are investigated by Scanning Electron Microscope (SEM) to understand the degree of packing density in the printed films. The inkjet-printed $Al_2O_3$ films have been characterized to investigate its thickness and roughness. Quality factor of the printed $Al_2O_3$ film is also measured to be over 300 at 1MHz.

• Fire Science and Engineering
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• v.30 no.4
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• pp.73-81
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• 2016

A self-regulating heating cable is an electrical heating element by flowing an electric current between parallel conductors filled with an extruded semi-conductive polymer. Self-regulating heating cables are used mainly for frost protection purposes because the construction is convenient and the price is low. On the other hand, structural problems with imperfections of the insulation can cause a fire despite their usefulness. This paper deduced a direct method to derive the cause by investigating the scene of a fire due to a self-regulating heating cable and analyzed the basic problem using fault tree analysis. In this paper, the actual fire scene was a cold storage warehouse, and fire investigation was conducted. After investigating the fire scene and fault tree analysis, the cause of the fire could be attributed to dielectric breakdown of the self-regulating heating cable. This paper could be utilized in the fire safety activities and similar fire investigations.

• Korean Journal of Materials Research
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• v.10 no.6
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• pp.450-455
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• 2000

For further scaling down of the silicon devices, the application of low dielectric constant materials instead of silicon oxide has been considered to reduce power consumption, crosstalk, and interconnection delay. In this paper, the effect of $O_2/SF_6$ plasma chemistry on the etching characteristics of polyimide-one of the promising low-k interlayer dielectrics-has been studied. The etch rate of polyimide decreases with the addition of $SF_6$ gas due to formation of nonvolatile fluorine compounds inhibiting reaction between oxygen and hydrocarbon polymer, while applying substrate bias enhances etching process through physical attack. However, addition of small amount of $SF_6$ is desirable for etching topography. $SiO_2$ hard mask for polyimide etching is effective under $O_2$plasma etching(selectivity~30), while $O_2/SF_6$ chemistry degrades etching selectivity down to 4. Based on the above results, $1-2\mu\textrm{m}$ L&S PI2610 patterns were successfully etched.