• Korean Journal of Materials Research
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• v.19 no.10
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• pp.550-554
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• 2009

Unreported dielectrics based on the binary system of MgO-SiO$_2$ were investigated as potential candidates for microwave dielectric applications, particularly those demanding a high fired density and high quality factors. Extensive dielectric compositions having different molar ratios of MgO to SiO$_2$, such as 2:1, 3:1, 4:1, and 5:1, were prepared by conventional solid state reactions between MgO and SiO$_2$. 1 mol% of V$_2$O$_5$ was added to aid sintering for improved densification. The dielectric compositions were found to consist of two distinguishable phases of Mg$_2$SiO$_4$ and MgO beyond the 2:1 compositional ratio, which determined the final physical and dielectric properties of the corresponding composite samples. The increase of the ratio of MgO to SiO$_2$ tended to improve fired density and quality factor (Q) without increasing grain size. As a promising composition, the 5MgO.SiO$_2$ sample sintered at 1400 $^{\circ}C$ exhibited a low dielectric constant of 7.9 and a high Q $\times$ f (frequency) value of $\sim$99,600 at 13.7 GHz.

• Korean Journal of Materials Research
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• v.29 no.3
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• pp.175-182
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• 2019

This study examines paraelectric $Bi_{1.5}Zn_{1.0}Nb_{1.5}O_7$ (BZN), which has no hysteresis and high dielectric strength, for energy density capacitor applications. To increase the breakdown dielectric strength of the BZN film further, poly(vinylidene fluoride) BZN-PVDF composite film is fabricated by aerosol deposition. The volume ratio of each composition is calculated using dielectric constant of each composition, and we find that it was 12:88 vol% (BZN:PVDF). To modulate the structure and dielectric properties of the ferroelectric polymer PVDF, the composite film is heat-treated at $200^{\circ}C$ for 5 and 30 minutes following quenching. The amount of ${\alpha}-phase$ in the PVDF increases with an increasing annealing time, which in turn decreases the dielectric constant and dielectric loss. The breakdown dielectric strength of the BZN film increases by mixing PVDF. However, the breakdown field decreases with an increasing annealing time. The BZN-PVDF composite film has the energy density of $4.9J/cm^3$, which is larger than that of the pure BZN film of $3.6J/cm^3$.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1248-1251
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• 2005

In PDP, a transparent dielectric is formed on a front glass substrate so as to cover bus electrodes (Ag). During the fabrication process, sometimes, a transparent dielectric reacts with bus (Ag) electrode in the range of $560-600^{\circ}C$, and the reaction gives the dielectric its yellow coloration, what is called "yellowing phenomena". In this paper, we investigated the reaction between bus electrode and transparent dielectric covered with different frit content in Ag paste.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1444-1446
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• 2009

The atmospheric pressure plasma polymerization of acrylate monomers was carried out to have dielectrics with easy preparation and high performance. The effects of discharge power, monomer concentration and deposition time on film properties were investigated using various characterization tools. With proper conditions, smooth dielectric layer of 100nm thickness was obtained. Dielectric property as organic dielectric layer has been studied for future applications in organic thin film transistors(OTFT).

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.05a
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• pp.16.1-16.1
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• 2008

• Composites Research
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• v.14 no.1
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• pp.30-38
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• 2001

As fiber reinforced composite materials are widely used in aircraft, space structures and robot arms, the on-line cure monitoring during the cure process of the composite materials has become an important research area for the better quality and productivity. In this paper, the dielectric circuit of the Wheatstone bridge type for measuring the dissipation factor during cure of thermsetting resin matrix composite materials was designed and manufactured. Also, the dielectric sensor for the cure monitoring of high temperature cure composites was developed and tested. The residual thermal stresses of the dielectric sensor during high temperature cure were analyzed by the finite element method and its dielectric characteristics at high temperature cure were analyzed by the finite element method and its dielectric characteristics at high temperature were evaluated. The on-line cure monitoring of the BMI(Bismaleimide) resin was performed using the developed Wheatstone bridge type circuit and the high-temperature dielectric sensor.

• Journal of electromagnetic engineering and science
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• v.6 no.1
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• pp.1-9
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• 2006

A sandwich structure of dielectric material and air gap inside a rectangular waveguide is proposed as a fast electrically tunable low-loss phase shifter. As the dielectric material is shifted up and down by piezoelectric actuator and, thereby, the thickness of air gap is changed, the effective dielectric constant of the sandwich structure is varied. Phase shifters based on the sandwich structure with different dielectric materials showed phase shift of $20{\sim}200^{\circ}/cm$ at X-band as the thickness of air gap varied up to $30{\mu}m$. The idea can be extended toward low-loss millimeter wave phase shifters since modem microwave ceramics have been developed to show very low dielectric loss$(tan\;{\delta}{\sim}10^{-4})$.

• Journal of the Korean Vacuum Society
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• v.5 no.2
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• pp.161-168
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• 1996

For the improvement of microelectronic thin film interconnection materials, dielectric passivation effects on the electromigration phenomena were studied. Using Al-1%Si, various shaped patterns were fabricated and dielectric passivation layers of several structures were deposited on the $SiO_2$ layer. Lifetime of straight pattern showed 2~5 times longer than the other patterns that had various line width and area. It is believed that the flux divergence due to the structural inhomogeneity and so the current crowding effects shorten the lifetime of thin film interconnections. The lifetime of thin film interconnections seems to depend on both the passivation materials and the passivation thickness. PSG/$SiO_2$ dielectric passivation layers showed longer lifetime than $Si_3N_4$ dielectric passivation layers. This results from the PSG on $SiO_2$ layer reduces stress and from the improvement of resistance to the moisture and to the mobile ion such as sodium. This is also believed that the lifetime of thin film interconnections seems to depend on the passivation thickness in case of the same deposition materials.

• Electrical & Electronic Materials
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• v.10 no.7
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• pp.651-658
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• 1997

In this paper, effect of interpenetrating polymer network(IPN) introduction on the dielectric properties, heat proof properties, internal structure and defects of the Epoxy/SiO$_2$composite materials, were investigated. we reported a relation between network structures and electrical properties, especially dielectric characteristics with variation of network structures for epoxy composite materials. According to experimental results, the specimens which have single network structures have lower dielectric constant than interpenetrating polymer network(IPN) specimens, but have relatively larger dependency to variation of temperature and frequency. It was confirmed that change of structures is attained by introducing of IPN to insulating materials. Therefore it is counted that introduction of multiple structure including IPN is necessary to improve heat proof and electrical properties.

• Journal of Electrical Engineering and Technology
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• v.9 no.3
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• pp.978-983
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• 2014

The polymer nano composite possess good priority recently for engineering applications. Especially the electrical insulating materials attract the high performance of nano composites. In this work the ballmill synthesiation process of nano sized Alumina ($Al_2O_3$), the preparation of new nano composite material with an content of enamel and synthesized Alumina as 1wt%, 3wt% and 5wt%. Experimental investigation has been carried out for the prepared nano composites materials with respect to dielectric parameter measurements such as dielectric loss (tan ${\delta}$), dielectric constant (${\varepsilon}$), dielectric strength under various temperature. The partial discharge level also measured for all the samples and the PD inception voltage is also observed and compared. Weight loss of the material has been analyzed through TGA. It has been experimentally proved that 3wt% of Alumina nano filler added enamel has significant improvement in the dielectric and thermal properties.