• Design & Manufacturing
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• v.14 no.4
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• pp.65-70
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• 2020

Partial reinforcement of sheet metal parts with CFRP patch is a technology that can realize ultra-lightweight body parts while overcoming the high material cost of carbon fiber. Performing these patchworks with highly productive press equipment solves another issue of CFRP: high process costs. The A-pillar is the main body part and has an undercut shape for fastening with other parts such as roof panels and doors. Therefore, it is difficult to bond CFRP patches to the A-pillar with a general press forming tool. In this paper, a flexible system that applies uniform pressure to complex shapes using ceramic particles and silicone rubber is proposed. By benchmarking various A-pillars, a reference model with an undercut shape was designed, and the system was configured to realize a uniform pressure distribution in the model. The ceramic spherical particles failed to realize the uniform distribution of high pressure due to their high hardness and point contact characteristics, which caused damage to the CFRP patch. Compression equipment made of silicone rubber was able to achieve the required pressure level for curing the epoxy. Non-adhesion defects between the metal and the CFRP patch were confirmed in the area where the bending deformation occurred. This defect could be eliminated by optimizing the process conditions suitable for the newly developed flexible system.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.535-542
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• 2021

In this study, to improve the interfacial bond strength of cast iron-aluminum dissimilar materials, graphite was removed to a certain depth from the cast iron surface through de-graphitization heat treatment. As the heat treatment time increased, the depth at which graphite was removed increased, showing a linear relationship between the heat treatment time and depth. Aluminum was filled to a certain depth on the de-graphitized cast iron surface through die-casting method, and no intermetallic compounds were formed on the cast iron-aluminum interface. The interfacial bonding strength showed a value of 90 MPa regardless of the heat treatment time, which is very high compared to the 12MPa bonding strength of the material without de-graphitization heat treatment. This result is thought to be due to the mechanical bonding of the undercut structure as the liquid aluminum, penetrated by the high pressure die-casting process, solidified in the de-graphitized region of the cast iron.

• Transactions of Materials Processing
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• v.10 no.3
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• pp.253-260
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• 2001

This study was performed to investigate the optimized warm forming conditions which gave the maximum drawing depth in square cup drawing of clad sheet metals, by changing the temperatures of die and blankholder and also shapes and materials of blanks. Two kinds of clad sheet metals, STS304-A1050-STS304 and STS304-A1050-STS430 were selected for experiments. The relative drawing depth of STS304-A1050-STS304 clad sheet was increased up to 4.4 at $150^{\circ}C$ that was 29% higher than at room temperature, whereas STS304-A1050-STS430 material was improved to 3.9 at $120^{\circ}C$ which was 15% better than at room temperature. In addition, comparison of wall thickness and hardness of a warm drawn cup with those of room temperature showed more even distributions. No separation between each laminated material after drawing occurred through inspection by microscope as well as application of penetrant test and bond strength test. Therefore, warm forming technique was confirmed to give better results in deep drawing of stainless clad sheet metal.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Journal of electromagnetic engineering and science
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• v.6 no.1
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• pp.30-35
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• 2006

This paper describes fully integrated low phase noise MMIC voltage controlled oscillators(VCOs). The Asymmetrical Inductance Tank VCO(AIT-VCO), which optimize the shortcoming of the previous tank's inductance optimization approach, has lower phase noise performance due to achieving higher equivalent parallel resistance and Q value of the tank. This VCO features an output power signal in the range of - 11.53 dBm and a tuning range of 261 MHz or 15.2 % of its operating frequency. This VCO exhibits a phase noise of - 117.3 dBc/Hz at a frequency offset of 100 kHz from carrier. A phase noise reduction of 15 dB was achieved relative to only one spiral inductor. The AIT-VCO achieved low very low figure of merit of -184.6 dBc/Hz. The die area, including buffers and bond pads, is $0.9{\times}0.9mm^2$.

• Journal of Dental Rehabilitation and Applied Science
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• v.25 no.4
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• pp.403-415
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• 2009

The purpose of the study is to establish the effect of different abutment shapes and types of cements on the retention of the full veneer casted gold crowns. Metal dies that has the similar shape with the implant abutment were manufactured using a short(5mm) and long(10mm) dies with different convergence angles. Metal dies and gold crowns, which were made from the metal dies, were cemented with Temp-bond, Temp-bond mixed with petroleum jelly, ZPC and Premier implant cement. After that, these were tested for tensile force at the point of separation. The effect of convergence angle changes of different cement types on the retention was studied as well as the effects of the cement type changes with different convergence angles on the retention. In addition, study about the marginal gap of Premier implant cement used for this experiment was conducted. The results are as followed under the in-vitro experimental limits; 1. The retention of the Temp-bond mixed with petroleum jelly decreased as the convergence angle increased, and the retention was weakest among the cements. 2. The retention of ZPC decreased as convergence angle increased. When convergence angle was 5 degrees, ZPC showed stronger retention than Premier implant cement. 3. Premier implant cement had the weakest retention when the convergence angle was 5 degrees but when the convergence angle was 10 degrees, it had the strongest retention. As the angle increased more than 10 degrees, the retention decreased. 4. Premier implant cement showed bigger marginal gap when the convergence angle was 5 degrees than 10 degrees under the experimental condition.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• The Journal of Korean Academy of Prosthodontics
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• v.39 no.3
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• pp.260-272
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• 2001

All-ceramic restorations have had a more limited life expectancy than metal ceramic restorations because of their low strength. Their relatively lower strength and resistance to fracture have restricted the use of all-ceramic crowns to anterior applications where occlusal loads are lower. But there has been increasing interest in all-ceramic restorations because patients are primarily concerned with improved esthetics. Many efforts have been made to in prove the mechanical properties of dental ceramics. This study was designed to elucidate the influence of the luting agent on the strength of the Empress 2 crown (staining technique) cemented on human teeth. Seventy extracted human permanent molar teeth were chosen. Teeth were prepared for Empress 2 crowns with milling machine on a surveyor. A dental bur was placed in the mandrel that was positioned so that the long axis of the bur was perpendicular to the surveyor base. Dimensions of the Empress 2 crown preparation were $6^{\circ}$ taper on each side, $1.5{\pm}0.1mm$ shoulder margin, and 4mm crown height. The luting cements used in this study were as follow: 1. Uncemented 2. Zinc phosphate cements (Confi-Dental) 3. Conventional glass ionomer cement : Fuji 1 (GC) 4. Resin-modified glass ionomer cements : Fuji plus (GC) 5. Adhesive cements : Panavia F (Kuralay), Variolink II (Vivadent), Choice (Bisco). Fracture test using Instron. The crowns were loaded in compressive force to evaluate the effect of these cements on the breaking strength of these all-ceramic crowns. A steel ball with a diameter of 4mm was placed on the occlusal surface and load was applied to the steel ball by a cylindrical bolt with a crosshead speed of 0.5mm per minute until fracture occurred. The fractured surface was examined using Scanning Electron Microscopic Image (SEM) to discover the correlation between fracture strength and bonding capacity. Within the limitation of this in vitro study design, the results were as follows : 1. fomentations significantly increased the fracture resistance of Empress ceramic crowns compared to control. Uncemented (206.9 N): ZPC (812.9 N): Fuji 1 (879.5 N): Fuji Plus (937.7 N): Choice (1105.4 N): Variolink II (1221.1 N): Panavia F (1445.2 N). 2. Resin luting agent, treated by a silane bond enhancing agents, yielded a significant increase in fracture resistance. In some of the Panavia F group, a fracture extended into dentin. 3. According to SEM images of fractured Empress crowns, the stronger the bond at both interfaces(crown and die), the more fracture strength was acquired.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.21-25
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• 2016

The automotive vehicle is made through the following processes such as press shop, welding shop, paint shop, and general assembly. Among them, the most important process to determine the quality of the car body is the welding process. Generally, more than 400 pressed panels are welded to make BIW (Body In White) by using the RSW (Resistance Spot Welding) and GMAW (Gas Metal Arc Welding). Recently, as the needs of light-weight material due to the $CO_2$ emission issue and fuel efficiency, new joining technologies for aluminum, CFRP (Carbon Fiber Reinforced Plastic) and etc. are needed. Aluminum parts are assembled by the spot welding, clinching, and SPR (Self Piercing Rivet) and friction stir welding process. Structural adhesive boning is another main joining method for light-weight materials. For example, one piece aluminum shock absorber housing part is made by die casting process and is assembled with conventional steel part by SPR and adhesive bond. Another way to reduce the amount of the car body weight is to use AHSS (Advanced High Strength Steel) panel including hot stamping boron alloyed steel. As the new materials are introduced to car body joining, productivity and quality have become more critical. Productivity improvement technology and adaptive welding control are essential technology for the future manufacturing environment.