• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.3
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• pp.85-91
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• 1999

$H:LiNbO_3$ optical modulator with Cu/parylene electrode layer, which has a merits in the bandwidth, power consumption and fabrication conditions as compared with conventional Au/Cr/$SiO_2$, is proposed and fabricated. Analysis and design of optical modulator is performed by finite element calculation. Various unit processes for fabricating the proposed modulator, 1550nm $H:LiNbO_3$ optical waveguide, parylene buffer layer, and CPW Cu electrode, were developed, After dicing and end-face polishing of fabricated modulator chip, optical modulation responses as sawtooth electrical driving voltage has been measured at low frequencies. Properties of optical waveguide had not been changed before and after Cu/parylene electrode processes, which make confirm the reproducible fabrication of optical modulator.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.176-183
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• 2002

Plasma Display Panel(PDP) is a type of flat panel display utilizing the light emission produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalks from adjacent sub-pixels. The mold for forming the barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing processes such as screen printing, sand-blasting and photosensitive glass methods. The mold for PDP barrier ribs have stripes of micro grooves transferring glass-material wall. In this paper , Stripes of grooves of which width 48$\mu$m, depth 124$\mu$m , pitch 274$\mu$m was acquired by machining of single crystal silicon with dicing saw blade. Maximum roughness of the bottom of the grooves was 59.6 nm Ra in grooving Si. Barrier ribs were farmed with silicone rubber mold, which is transferred from grooved Si forming hard mold. Silicone rubber mold has the elasticity, which enable to accommodate the waviness of lower glass plate of PDP. The methods assisted by the microwave and UV was adopted for reducing the forming time of glass paste.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.2
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• pp.443-448
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• 2010

Rapid advance in information technology requires high performance devices with compact size. Integrated multi-layer electronic element with different functions enables those compact devices to possess various performances and powerful capabilities. In mass production, the multi-layer electronic element is manufactured as a bulk type with a large number of parts for productivity. However, this may cause the electronic part to be damaged in the cutting process of the bulk elements to separate into each part. Therefore the cutting performance of multi-layer element bulk is playing an important role in the view of production efficiency. This study focuses on the cutting characteristics of multi-layer electronic elements. In order to increase the efficiency, the vibration cutting method was applied to the blade cutting machine. Flexure hinge structure, which is an physical amplifier of increasing displacement, was attached to the vibration cutting device for machining efficiency. The behaviors of flexure hinge were modeled with Lagrange equation and simulated with finite element method (FEM). Performance of hinge structure was verified by experimental modal analysis (EMA) for hinge structure to be tuned to the specific mode of vibrations. Cutting experiments of multi-layer elements were conducted with the proposed vibrating cutting module, and the characteristics was analyzed.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.335-340
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• 2008

Cutting performance and wear behavior were studied with the diamond micro-blade of Cu/Sn bond materials containing various amount of lubricant materials such as graphite and $MoS_2$. Measurement of instantaneous electric power consumption for cutting glass workpiece at the constant velocity was conducted and proposed as a method to assess cutting efficiency. The energy consumption of micro-blade for glass cutting decreased with the content of graphite and $MoS_2$ while wear amount of blade in volume increased with the amount of lubricant addition during the dicing test. It is because that hardness, flexural strength, and fracture toughness ($K_{IC}$) reduced with the amount of lubricant addition. Blades with $MoS_2$ additive showed higher mechanical properties than those with graphite additives when the same amount of the lubricant additive in wt.% was added. Due to the lower density of graphite than $MoS_2$, higher volume fraction of graphite could result in stronger effect on lowering electric power consumption by reducing the friction between blade and work piece however increasing wear rate due to the reduction in strength and fracture toughness. Adhesive wearing mode of micro blade could be remarkably improved by the addition of graphite as well as $MoS_2$.

• Korean Journal of Poultry Science
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• v.31 no.1
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• pp.45-54
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• 2004

The consumption of poultry meat (chicken and turkey) grew the most during the past few decades due to several contributing factors such as low price, product research and development, favorable meat characteristics, responsive to consumer needs, vertical integration and industry consolidation, new processing equipments and technology, and aggressive marketing. The major processing technologies developed and used in chicken processing include forming/restructuring, tumbling, curing, smoking, massaging, injection, marination, emulsifying, breading, battering, shredding, dicing, and individual quick freezing. These processing technologies were applied to various parts of chicken including whole carcass. Product developments using breast, thigh, and mechanically separated chicken meat greatly increased the utilization of poultry meat. Chicken breast became the symbol of healthy food, which made chicken meat as the most frequent menu items in restaurants. However, the use of and product development for dark meat, which includes thigh, drum, and chicken wings were rather limited due to comparatively high fat content in dark meat. Majority of chicken are currently sold as further processed ready-to-cook or ready-to-eat forms. Major quality issues in chicken meat include pink color problems in uncured cooked breast, lipid oxidation and off-flavor, tenderness PSE breast, and food safety. Research and development to ensure the safety and quality of raw and cooked chicken meat using new processing technologies will be the major issues in the future as they are now. Especially, the application of irradiation in raw and cooked chicken meat products will be increased dramatically within next 5 years. The market share of ready-to-eat cooked meat products will be increased. More portion controlled finished products, dark meat products, and organic and ethnic products with various packaging approaches will also be introduced.

• Journal of the Korean Society of Food Culture
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• v.21 no.2
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• pp.179-186
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• 2006

To investigate the production of yogurt added with desalted bamboo shoots, the component analysis was conducted. Desalted bamboo shoots contained 82.59 % of moisture, 4.56 % of protein, 0.52 % of lipid, 0.50 % of ash and 11.72 % of total dietary fiber. The main mineral elements were Ca, P, S, Na, Mg and K. Yogurt base fermented with 0.005 % ABT-5 starter inoculum at $40\;^{\circ}C$ for 13 hr. For the preparation of bamboo shoots yogurt, various sugaring bamboo shoots were added to the yogurt base. Results of sensory evaluation of the yogurt containing bamboo shoots indicated that color, odor, taste, flesh size, flesh amount, mouth feel, and overall acceptability of the 15 %(w/v) bamboo shoots dicing $(5{\times}5{\times}5\;mm)$ showed higher preference than others. When bamboo shoot yogurt was kept at $4\;^{\circ}C$ for 15 days, pH, titratable acidity, viable counts of lactic acid bacteria and Bifidobacterium bifidum of yogurt were not changed.

• Korean Journal of Materials Research
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• v.20 no.11
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• pp.617-622
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• 2010

We have studied methods to save Si source during the fabrication process of crystalline Si solar cells. One way is to use a thin silicon wafer substrate. As the thickness of the wafers is reduced, mechanical fractures of the substrate increase with the mechanical handling of the thin wafers. It is expected that the mechanical fractures lead to a dropping of yield in the solar cell process. In this study, the mechanical properties of 220-micrometer-solar grade Cz p-type monocrystalline Si wafers were investigated by varying saw-damage etching conditions in order to improve the flexural strength of ultra-thin monocrystalline Si solar cells. Potassium hydroxide (KOH) solution and tetramethyl ammonium hydroxide (TMAH) solution were used as etching solutions. Etching processes were operated with a varying of the ratio of KOH and TMAH solutions in different temperature conditions. After saw-damage etching, wafers were cleaned with a modified RCA cleaning method for ten minutes. Each sample was divided into 42 pieces using an automatic dicing saw machine. The surface morphologies were investigated by scanning electron microscopy and 3D optical microscopy. The thickness distribution was measured by micrometer. The strength distribution was measured with a 4-point-bending tester. As a result, TMAH solution at $90^{\circ}C$ showed the best performance for flexural strength.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.503-509
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• 2019

The demand for smaller, faster, and multi-functional mobile devices in increasing at a rapidly increasing rate. In response to these trends, Stacked Chip Scale Package (SCSP) is used widely in the assembly industry. A film type adhesive called die attach film (DAF) is used widely for bonding chips in SCSP. The DAF requires high flowability at high die attachment temperatures for bonding chips on organic substrates, where the DAF needs to feel the gap depth, or for bonding the same sized dies, where the DAF needs to penetrate bonding wires. In this study, the mixture design of experiment (DOE) was performed for three raw materials to obtain the optimized DAF recipe for low elastic modulus at high temperature. Three components are acrylic polymer (SG-P3) and two solid epoxy resins (YD011 and YDCN500-1P) with different softening points. According to the DOE results, the elastic modulus at high temperature was influenced greatly by SG-P3. The elastic modulus at $100^{\circ}C$ decreased from 1.0 MPa to 0.2 MPa as the amount of SG-P3 was decreased by 20%. In contrast, the elastic modulus at room temperature was dominated by YD011, an epoxy with a higher softening point. The optimized DAF recipe showed approximately 98.4% pickup performance when a UV dicing tape was used. A DAF crack that occurred in curing was effectively suppressed through optimization of the cure accelerator amount and two-step cure schedule. The imizadole type accelerator showed better performance than the amine type accelerator.

• Proceedings of the Korea Society of Poultry Science Conference
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• 2003.07b
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• pp.67-88
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• 2003

The consumption of poultry meat (chicken and turkey) grew the most during the past few decades due to several contributing factors such as low price. product research and development. favorable meat characteristics, responsive to consumer needs, vertical integration and industry consolidation, new processing equipments and technology, and aggressive marketing. The major processing technologies developed and used in chicken processing include forming/restructuring, tumbling, curing, smoking, massaging, injection, marination, emulsifying, breading, battering, shredding, dicing, and individual quick freezing. These processing technologies were applied to various parts of chicken including whole carcass. Product developments using breast, thigh, and mechanically separated chicken meat greatly increased the utilization of poultry meat. Chicken breast became the symbol of healthy food, which made chicken meat as the most frequent menu items in restaurants. However, the use of and product development for dark meat, which includes thigh, drum, and chicken wings were rather limited due to comparatively high fat content in dark meat. Majority of chicken are currently sold as further processed ready-to-cook or ready-to-eat forms. Major quality issues in chicken meat include pink color problems in uncured cooked breast, lipid oxidation and off-flavor, tenderness PSE breast, and food safety. Research and development to ensure the safety and quality of raw and cooked chicken meat using new processing technologies will be the major issues in the future as they are now. Especially, the application of irradiation in raw and cooked chicken meat products will be increased dramatically within next 5 years. The market share of ready-to-eat cooked meat products will be increased. More portion controlled finished products, dark meat products, and organic and ethnic products with various packaging approaches will also be introduced.