A Study on Plasma Display Panel Barrier Rib Fabrication by Mold and Electromagnetic Wave

몰드와 전자기파에 의한 PDP격벽의 성형에 관한 연구

  • Son, Jae-Hyeok (Dept.of Precision Mechanical Engineering, Graduate School of Busan National University) ;
  • Im, Yong-Gwan (Dept.of Precision Mechanical Engineering, Graduate School of Busan National University) ;
  • Jeong, Yeong-Dae (Dept.of Precision Mechanical Engineering, Graduate School of Busan National University) ;
  • Jeong, Seong-Il (Dept.of Precision Mechanical Engineering, Graduate School of Busan National University) ;
  • Jeong, Hae-Do (Dept.of Mechanical Engineering, Busan National University)
  • 손재혁 (부산대학교 대학원 정밀기계공학과) ;
  • 임용관 (부산대학교 대학원 정밀기계공학과) ;
  • 정영대 (부산대학교 대학원 정밀기계공학과) ;
  • 정성일 (부산대학교 대학원 정밀기계공학과) ;
  • 정해도 (부산대학교 기계공학부)
  • Published : 2002.06.01

Abstract

Plasma Display Panel(PDP) is a type of flat panel display utilizing the light emission produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalks from adjacent sub-pixels. The mold for forming the barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing processes such as screen printing, sand-blasting and photosensitive glass methods. The mold for PDP barrier ribs have stripes of micro grooves transferring glass-material wall. In this paper , Stripes of grooves of which width 48$\mu$m, depth 124$\mu$m , pitch 274$\mu$m was acquired by machining of single crystal silicon with dicing saw blade. Maximum roughness of the bottom of the grooves was 59.6 nm Ra in grooving Si. Barrier ribs were farmed with silicone rubber mold, which is transferred from grooved Si forming hard mold. Silicone rubber mold has the elasticity, which enable to accommodate the waviness of lower glass plate of PDP. The methods assisted by the microwave and UV was adopted for reducing the forming time of glass paste.

Keywords

References

  1. 이준신, 'Display 기술 Roadmap과 신기술 동향,' 한국정보디스플레이학회지, Vol. 1, No. 1, 2000
  2. 조인호, 정상철, 정해도, 손재혁, 'PDP격벽 성형용 몰드제작과 성형에 대한 연구,' 한국정밀공학회지, 제18권 제5호, pp. 171-177, 2001
  3. T.MIWA, 'Blade wear and wafer chipping in dicing pocess,' ICPE, 1997
  4. A.J.Kinloch, 'Adhesion and Adhesives science and technology,' Chapman and Hall, 1987
  5. 대한전자공학회, '전파공학,' pp. 283-297, 1998