• Electrical & Electronic Materials
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• v.10 no.10
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• pp.1022-1028
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• 1997

In this paper we present the construction details and output characteristics of a diaphragm-type pressure sensor with Cu-Ni(53:47) thin-film strain gauges. In order to improve the sensitivity and the temperature compensation two circumferential gauges are placed near the center of the diaphragm and two radial gauges are located near the edge. For all the gauges the relative change in resistance ΔR/R with pressure is of the order 10$^{-3}$ for the maximum pressure. The output is found to be linear over the entire pressure range(0-30kfg/cm$^2$)and the output sensitivity obtained is 1.6mV/V. The maximum nonlinearity observed in output characteristics is 0.35%FS for 5V excitation and the hysteresis is less than 0.1%FS.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.478-481
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• 1995

This paper presents the system demonstrator for an optical fiber sensor system developed as a technological evaluator suitable for generic sensric sensing applications. The new type of fiber-optic sensor employed a diaphragm displacement transforms pressure into optical intensity. Form this sensing technique, we can know the variation of source intensity, the loss of a optical fiber, and the reflectivity of the diaphragm surface. Experimental results are applied to the low-pressure transducer suitable for measuring miniature pressure.

• Journal of the Semiconductor & Display Technology
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• v.7 no.1
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• pp.1-5
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• 2008

In this paper, we fabricated pressure difference type gas flow sensor using only dry etching technology by ICP-RIE(inductive coupled plasma reactive ion etching). The sensor's structure consists of a common shear stress type piezoresistive pressure sensor with an orifice fabricated in the middle of the sensor diaphragm. Generally, structure like diaphragm is fabricated by wet etching technology using TMAH, but we fabricated diaphragm by only dry etching using ICP-RIE. To equalize the thickness of diaphragm we applied insulator($SiO_2$) layer of SOI(Si/$SiO_2$/Si-sub) wafer as delay layer of dry etching. Size of fabricated diaphragm is $1000{\times}1000{\times}7\;{\mu}m^3$ and overall chip $3000{\times}3000{\times}7\;{\mu}m^3$. We measured the variation of output voltage toward the change of gas pressure to analyze characteristics of the fabricated sensor. Sensitivity of fabricated sensor was relatively high as about 1.5mV/V kPa at 1kPa full-scale. Nonlinearity was below 0.5%F.S. Over-pressure range of the fabricated sensor is 100kPa or more.

• Journal of Sensor Science and Technology
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• v.28 no.3
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• pp.177-181
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• 2019

Pressure sensors are used in various industries such as automobiles, airplanes, medical equipment, and coolers. Even if the ambient temperature changes, the measurement is reliable and stable. In this study a diaphragm-type pressure sensor was used to derive a temperature-compensated pressure estimation equation for accurate pressure measurement at $100^{\circ}C$ and $-40^{\circ}C$. To understand the characteristics of the pressure sensor diaphragm with respect to temperature and pressure, experiments were conducted in temperature-variable chamber using FEM analysis to confirm that the influence of temperature effect was nonlinear. Based on the experimental results, a nonlinear method for calculating the pressure by compensating for the error due to temperature was derived. The calculated pressure value is lower than 0.5 % at low and high temperatures, and lower than 0.4 % at $22^{\circ}C$, thereby eliminating the effect of temperature.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.7
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• pp.82-88
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• 1993

This paper describes fabrication of relative type capacitive pressure sensor to be in great demand for many fields. The fabricated sensor consists of two parts` a sensing diaphragm and a pyrox glass cover. The sensor size is 4.5${\times}3.4mm$^{2})$ and 400$\mu$m thick. To improve the nonlinearity, this sensor is designed a rectangular silicon diaphragm with a center boss structure, and in order to improve the temperature characteristics of the sensor in a packaging process, the sensing element is mounted on the pyrex glass support. Some suggestions toward the design and fabrication of improved sensors have been presented. The zero pressure capacitance, Co of sensor is 26.57pF, and the change of capacitance, ${\Delta}$C is 1.55pF from 0Kgf/Cm$^{2}$ to 1Kgf/Cm$^{2}$ at room temperature. The nonlinearity of the sensor output with center boss diaphragm is 1.29%F.S., and thermal zero shift and thermal sensitivity shift is less than 1.43%F.S./$^{\circ}C$and 0.14% F.S./$^{\circ}C$, respectively.

• Journal of Sensor Science and Technology
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• v.24 no.3
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• pp.208-213
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• 2015

The purpose of this study is to optimize the design of a capacitive pressure sensor element using the simulation of electrical characteristics. The simulation of the ceramic sensor diaphragm ($Al_2O_3$) was performed by permitting pressure to change the curvature of the diaphragm. The pressure capacitance ($C_P$) was increased from 19.63 pF to 15.26 pF by applying pressure because the distance between the electrodes has been changed from $30{\mu}m$ to $15{\mu}m$. When the thickness of the diaphragm was changed to 0.46~0.52 mm, a larger capacitance change showed in accordance with the reduced thickness, which means an increase of sensitivity. However, considering the viewpoint of the signal linearity, it was selected for the optimum thickness of the diaphragm to 0.50 mm. The designed sensor element based on simulated results was tested to measure the output characteristics. Comparing of simulated and measured results, there was a margin of error of approximately 2%.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1872-1874
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• 2001

This paper presents an implantable telemetry LC resonance-type pressure sensor to measure the cerebral ventricle pressure. The sensor consists of an inductor and a capacitor. The LC resonant circuit consists of the sensor and an external antenna coil that are coupled magnetically. The resonance frequency of the circuit decreases as the applied pressure increases the capacitance of the sensor. The sensor is designed in consideration of the biocompatibility and long lifetime for continuous monitoring of the ventricle pressure. The sensor is simple to fabricate and small in comparison with others reported previously. The inductor is fabricated by electroplating and the variable capacitor is constructed with a flexible p+ diaphragm. Also, the deflection of the diaphragm, the variation of the capacitance and the resonance frequency are analyzed and calculated.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.198-201
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• 2006

In this paper, we fabricated drag force type and pressure difference type gas flow sensor with dry etching technology which used Deep RIE(reactive ion etching) and etching stop technology which used SOI(silicon-on-insulator). we fabricated four kinds of sensor, which are cantilever, paddle type, diaphragm, and diaphragm with orifice type. Both cantilever and paddle type flow sensors have similar sensitivity as 0.03mV/V kPa. Sensitivity of the fabricated diaphragm and diaphragm with orifice type sensor were relatively high as about 3.5mV/V kPa, 1.5mV/V kPa respectively.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.3
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• pp.307-314
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• 1988

The thin, square-diaphragm silicon pressure sensor utilizing shear piezoresistance effect was designed and fabricated and its characteristics were examined. The sensor has only one diffused resistor, whereas conventional full-bridge sensor has four. Sensitivity is somewhat lower but temperature compensation is easier than the latter. The proposed sensor was fabricated with only one p-type diffused resistor of the dimension of 113x85\ulcorner\ulcornerlocated near the center of the edge of the diaphragm. The resistor was at 45\ulcornerwith the edge of the diaphragm. The sensitivity of the sensor was 36\ulcorner/V\ulcornermHg and was linear in the pressure range from 0 to 300 mmHg. The temperature coefficient without temperature compensation was 55 ppm/\ulcorner and it was decreased to about 0.17 mmHg/\ulcorner with compensation in the range from 10 to 60\ulcorner.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.790-793
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• 2005

In these days, the piezoresistive material has been applied to various sensors in order to measure the change of physical quantities. But the relationship between the sensitivity of a sensor and the position and size of piezoresistor has rarely been studied. Therefore, this paper was focused on the effect of residual stress induced in piezoresistor on the distribution of resistance change ratio and supposed the feasible position of piezoresistor. The resulting are following; The tensile residual stress in the vicinity of piezoresistor decreased the value of resistance change ratio and could not effect on all the area of diaphragm but local area around the piezoresistor. Also, the piezoresistor in the diaphragm type pressure sensor with boss should fabricate in the edge of boss in order to increase the sensitivity of pressure sensor.