• International Journal of Precision Engineering and Manufacturing
• /
• 제1권2호
• /
• pp.61-66
• /
• 2000

In this paper, we discuss the machining characteristics of HDD glass. Glass is now being used globally as a data storage device, Such glasses are usually machined by lapping by this technique requires a long machining time, resulting in low productivity, For this reason, we examine the possibility of EILD grinding in HDD glass workpieces, A move to ELID grinding may result in substantial cost reduction. Our purpose is to investigate the grinding characteristics of HDD glass in ELID grinding. The bonding materials for fixing the abrasives of cast iron, cobalt and bronze are applied, and grinding conditions such as rotation speed and feeding are varied. Results show that with the use of ELID, mirror surfaces can be achieved with high efficiency.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1996년도 춘계학술대회 논문집
• /
• pp.124-131
• /
• 1996

The use of small hemispherical high-speed precision bearing has increased drastically these days in the field of computer disk driver, highteech devices as well as communication and electronic device drivers. It was suggested that the new polishing process adopting the diamond grinding wheel and polishing tool instead of multi stage lapping processes, which enables the mass production of the bearing by reduction of polishing time. Polishing mechanism was analysed and the results were applied to the design and manufacturing of the polishing system. Experiments for selection of optimal polishing conditions were carried out using the polishing system.

• 한국공작기계학회논문집
• /
• 제12권5호
• /
• pp.40-45
• /
• 2003

Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

• Journal of Astronomy and Space Sciences
• /
• 제21권2호
• /
• pp.141-152
• /
• 2004

우주망원경용 비구면 반사경 가공 공정은 고정입자 연삭, 자유입자 래핑, 연마의 순서를 따른다. 숙련공에 의한 경험적 공정조절에 의해 목표 비구면을 가공하는 전통적 연삭 공정에서는 수 ${mu}m$ 높이의 표면 밑 손상을 남기며 뒤이은 자유입자 래핑 및 연마 공정에서 이를 제거하며 가공한다. 본 연구는 컴퓨터 수치 제어 연삭 공정진화 모델을 개발하여, 연삭가공을 통해 반사경 표면조도 최소 40nm이하, 가공 예측정확도 20nm급을 이루었다. 구체적인 방법론으로 초정밀가공기의 연삭모듈을 이용하여 연삭 휠 입자의 크기, 이송속도, 공작물 회전선속도 등 연삭 변수를 변화시키며 직경 20, 100mm Zerodur 소재를 초기 연삭하였다. 초기 연삭 변수와 측정된 표면조도와의 관계를 경험적 해석과 다 변수 회귀분석 해석 방법을 통하여 공정조절용 수치 연삭 모델을 구성하였다. 정량적 공정제어는 입력된 연삭변수들로부터 가공 후 표면조도를 예측하고, 측정된 표면조도를 이용하여 수치연삭 모델을 개량한 후 다음 가공에서 측정될 표면조도를 예측하는 순으로 만복 진행되었다. 본 연구에서는 CNC 연삭공정조절로부터 최소 평균 표면조도 36nm, 예측정확도 ${pm}20nm$를 얻었다. 이 연구결과는 정량적 연삭공정제어 모델을 사용하여 자유입자 래핑 공정을 수행할 필요 없이 연삭에서 직접 연마 공정으로 진행할 수 있는 획기적인 공정 효율 향상을 의미한다.

• 마이크로전자및패키징학회지
• /
• 제18권3호
• /
• pp.25-32
• /
• 2011

초고휘도 비극성 a-GaN LED를 위한 양질의 R-면 사파이어 기판을 제조하기 위해 절단, 연마공정에 대해서 연구하였다. 사파이어는 이방성이 큰 물질로서 R-면과 c-면의 기계적인 특성의 차이에 의해 기판 제조공정 조건이 영향을 받으며, c-면에 비해서 R-면은 이방성 크며 각 결정학적인 면에서의 이방성은 연마공정에는 큰 영향을 미치지 않으나 절단공정에 큰 영향을 미치는 것으로 나타났다. R-면 잉곳의 절단방향이 a-flat에 대해 $45^{\circ}$인 경우에 절단이 가장 효과적으로 이루어졌으며 양호한 절단품질을 얻을 수 있었다. 기계적인 연마가 이루어지는 래핑과 DMP(Diamond mechanical polishing) 공정에서는 c-면 기판과 연마율이 큰 차이가 나타나지 않았으나, 화학반응이 수반되는 CMP(Chemical mechanical polishing) 공정에서는 c-면 기판의 연마율이 R-면 기판의 약 2배 이상 큰 값을 가졌으며, 이는 c-면의 수화반응층 형성에 의한 영향으로 보여진다.

• 한국정밀공학회지
• /
• 제7권3호
• /
• pp.37-47
• /
• 1990

In accordance with the high precision of mechanical elements, it has been required to high precision in surface roughness measurement and, therefore, stylus tip radius is manufa- ctured less than 2 .mu. m through ion sputter machining. In this experiment, by suing ion sputter machined stylus pf fine tip, radius and lapping machined stylus, surface roughness of standard specimens, silicon wafer were measured and then Rmax, Ra, RMS value were investi- gatedaccording to the variation of tip radius of stylus. As a result, measuring error due to the variation of stylus tip radius in surface roughness measurement was decreased by using ion sputter machined stylus and also the measuring accuracy was improved. And the measuring variation of Ra, RMS calculated from correlation coefficient lager than 0.9 on the wave of short period and amplitude using ion sputter machined stylus of fine tip radius.

• Tribology and Lubricants
• /
• 제33권3호
• /
• pp.106-111
• /
• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

• Tribology and Lubricants
• /
• 제35권6호
• /
• pp.323-329
• /
• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.

• Restorative Dentistry and Endodontics
• /
• 제23권2호
• /
• pp.597-606
• /
• 1998

The purpose of this study was to evaluate the shear bond strength of the Compoglass Carvifil bonded on the dentin surface according to etching or non-etching and two time application or three time application of single component. Human non-carious 60 extracted 3rd molar were used. The occlusal dentin surfaces of all teeth were exposed with Diamond Wheel Saw and polished with Lapping & Polishing machine(South Bay Technology Co., U.S.A). The teeth were then distributed randomly into four groups of 15 teeth each and dentin surface were conditioned as following. Control group : Non-etching, two times application of Syntac Single Component. (According to manufacture's instruction) Experimental group 1 : Non-etching, three times application of Syntac Single Component. Experimental group : 2 Etching, two times application of Syntac Single Component. Experimental group 3 : Etching, three times application of Syntac Single Component. Compoglass were bonded to exposed dentin surfaces and all samples were placed in distilled water for 7 days. The shear bond strengths were measured by universal testing machine (SHIMADAZU AUTOGRAPH, AGS-4D., Japan). The results were as follows : 1. Experimental group 3 revealed the highest value (30.75${\pm}$4.74 MPa) and control group revealed the lowest value(14.85${\pm}$2.69 MPa). There was significant difference of shear bond strength among four groups(P<0.01) 2. The acid-etching groups (experimental group 2, 3) had higher shear bond strengths than non etching groups(control group and experimental group 1). 3. The additional application of Syntac single component groups revealed a higher bond strength than two times application groups (control group and experimental group 2).

• Restorative Dentistry and Endodontics
• /
• 제22권2호
• /
• pp.680-692
• /
• 1997

New bonding agent systems have been supplied which operators can simply apply to conditioned tooth surfaces. The purpose of this study was to evaluate the shear bond strengths and the microleakages of three bonding agents and composite resins to dentin. Seventy-five extracted human maxillary and mandibular molar teeth were used in this study. For the shear bond strength test, the entire occlusal dentin surfaces of thirty teeth were exposed with Diamond Wheel Saw and smoothed with Lapping and Polishing Machine (South Bay Technology Co., U.S.A). For the microleakage test, Class V cavities were prepared in the buccal surfaces of fourtyfive teeth. They were randomly assigned into 3 groups according to dentin bonding agents ($Scotchbond^{TM}$ Multi-Purpose plus, ONE-$STEP^{TM}$ and Prime & $Bond^{TM}$)and composite resins (Z-100, $Aelitefil^{TM}$ and TPH $Spectrum^{TM}$) to be used. Bonding agents and composite resins were bonded to exposed dentin surfaces of the tooth crown and to Class V cavities on the buccal surfaces respectively according to manufacturer's directions. The shear bond strengths were measured by universal testing machine($U^{TM}$ AGS-100, Japan). In addition, the degree of micro leakage at the occlusal and gingival margin was examined by 2 % methylene blue and stereomicroscope(Olymous SZH 10, Japan). The results were as follows: 1. The shear bond strength to dentin was the highest value in SBMP-Plus group($16.68{\pm}7.38$ MPa) and the lowest value in Prime & Bond group($11.61{\pm}5.82$ MPa), but there was no significant difference of shear bond strength among three groups. 2. The degree of microleakage at both occlusal and gingival margin was showed the lowest in SBMP-Plus group and the highest in ONE-STEP group. 3. At both occlusal and gingival margin, there was significant difference of microleakage between SBMP-Plus and ONE-STEP/ Prime & Bond groups(p<0.05), but no significant difference of microleakage between ONE-STEP and Prime & Bond group(p>0.05).