Study on the Effect of a Pressurizing Head on the Shape of a Wafer in Mechanical Lapping of Sapphire (랭핑공정의 헤드가압방식에 따른 사파이어 웨이퍼 형상 변화 특성 연구)
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- Proceedings of the Korean Society of Precision Engineering Conference
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- 2011.06a
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- pp.233-234
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- 2011