• Korean Journal of Acupuncture
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• v.18 no.1
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• pp.165-170
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• 2001

A rapid increasing in cultivation area due to favorable price temporarily and decreasing in consumer's demands caused by economic depressions recently, lead the price of Cynanchum wilfordii Hemsley to decline sharply. Thus, it may give rises to weakening of cultivation bases in Cynanchum wilfordii Hemsley. To investigate optimal mechanical peeling conditions of Cynanchum wilfordii Hemsley, protruded rubber, plastic pad, diamond shape's steel and palstic brush were introduced as blades and artificial stone, sand and small pebble were done as abrasives. The main results obtained were summarized as follows; 1. It took 2 minutes per 1kg in mechanical peeling of Cynanchum wilfordii Hemsley's raw root whereas 36 minutes in manual peeling and values of lightness showed more higher in manual peeling than in mechanical peeling. 2. Yield in combination of diamond shape's steel blade and sand abrasive showed the lowest at 89.9% among treatments and peeling rates in combination of diamond shape's steel blade and small pebble showed the highest at 71.3% in mechanical peeling. 3. Lightness, one of the most important factors in determining quality of Cynanchum wilfordii Hemsley, showed the highest in combination of diamond shape's steel blade and small pebble brasive at 61.90 in mechanical peeling. 4. As the speed of rotation gets faster, yields tend to lower in mechanical peeling. Peeling rates and lightness showed the highest at 66.8%, 57.96 respectively among treatments at 30 r.p.m. in mechanical peeling.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.9
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• pp.487-497
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• 2020

The study examined the effects, strength, and weakness of chemical peeling and physical peeling, which are some types of peelings that are commonly used for cosmetic skin management for women. For this study, of which the study period was from November 1 to December 27, 2011, 20 female subjects with the compound skin type were investigated. Ten women were assigned to the chemical peeling group, and the other 10 were assigned to the physical peeling group. The experiment continued for six weeks, with one test session per week, totaling six tests. During each session, a skin measurement instrument was used to measure the oil, keratin, pore, wrinkles, and pigments. The results of the tests showed that, in the case of chemical peeling, both glycolic acid peeling and lactic acid peeling were effective in preserving the skin moisture. With physical peelings, crystal peeling was more effective on wrinkles, while diamond peeling was more effective in keratin and pigment improvement. A comparison of the peeling with different media revealed physical peelings to have more effect on more items, but chemical peeling was more effective in moisture and oil changes.

• The Korean Journal of Ceramics
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• v.3 no.2
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• pp.105-109
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• 1997

The effects of surface conditions of the C-2 cemented carbide substrate on the adhesion of diamond film were investigated. The substrates were pretreated for different times with Murakami's reagent and then the acid solution of an H2SO4-H2O2. The adhesion strength was estimated by a peeling area around the Rockwell-A indentation. The cutting performance of the diamond-coated tools was evaluated by measuring flank wears in dry turning of Al-17% Si alloy. The morphology of deposited diamond crystallites was dominated by (111) and (220) surfaces with a cubooctahedral shape. The diamond film quality was hardly affected by the surface conditions of the substrate. The variation of tool life with longer substrate etching times resulted from a compromies between the increase of film adhesion at the interface and the decrease of toughness at the substrate surface. The coated tools were mainly deteriorated by chipping and flaking of the diamond film form a lock of adhesion strength, differently from the wear phenomena of PCD tools.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.3
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• pp.124-128
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• 2020

Recently, many studies on growth of single crystal diamond using MPECVD have been conducted. The heteroepitaxial method is one of the methods for growing diamonds on a large-area substrate, and research on synthesis of single crystal diamonds using SrTiO₃, MgO, and sapphire substrates has been attempted. In addition, research is being conducted to reduce the internal stress generated during diamond growth and to improve the crystallinity of the diamond. The compressive stress generated therein causes peeling and bowing from the substrate. This study aimed to synthesize heteroepitaxial single crystal diamonds with high crystallinity by surface modification. A diamond thin film was first grown on a sapphire/Ir substrate by MPECVD, and then etched with H₂ gas to modified the morphology and roughness of the surface. A secondary diamond layer was grown on the surface, and the internal stress, crystallinity of the diamond were investigated. As a result, the fabrication of single crystal diamonds with improved crystallinity was confirmed.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1313-1314
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• 2006

For improvement of wear resistance property of atmospheric thermal plasma sprayed molybdenum (Mo) coating, diamond deposition on the atmospheric plasma sprayed molybdenum coating by the combustion flame chemical vapor deposition (CFCVD) has been operated. In this study, to diminish the thermal damage of the substrate during operation, a thermal insulator was equipped between substrate and water-cooled substrate holder. Consequently, diamond particles could be created on the Mo coating without fracture and peeling off. From these results, it was found that this process had a high potential in order to improve wear resistance of thermal sprayed coating.

• Journal of the Korean Ceramic Society
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• v.41 no.10 s.269
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• pp.728-734
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• 2004

The effect of microstructure of WC-Co substrates which have different WC grain sizes from submicron to 5 $\mu$m on the diamond-substrate adhesion strength was investigated. The substrates were pre-treated by two methods : chemical etching with Murakami's solution and subsequently with $H_2SO_4$, and thermal heat-treatment. The adhesion strength was estimated by degree of peeling after Rockwell indentation. Diamond films of 20 $\mu$m thickness deposited on the heat-treated substrates showed an excellent adhesion strength at the load of 100 kg, which ascribed to the large and elongated WC grains. However, the cutting edge of insert was deformed after heat treatment and the surface morphology of heat treated substrate strongly affected on the surface roughness of the deposited diamond films. On the contrary, the diamond film of 10 $\mu$m in thickness on the chemically etched substrates of average WC grain size over 2 $\mu$m showed good adhesion strength enough not to peel-off under a load of 60 kg. Especially, the substrate of average WC grain size over 5 $\mu$m exhibited much improved reliability of adhesion comparing with the substrate of average grain size under 2 $\mu$m. No substrate deformation was observed in this case after the chemical etching, which is more advantageous and more practical in terms of precious machining than the heat treatment case.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

• Tribology and Lubricants
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• v.34 no.6
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• pp.318-324
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• 2018

This study aims to visualize the friction and wear behaviors of metal coatings in real time. The main mechanism of wear is identified by observing all the processes in which wear occurs. The friction coefficients of the moments are monitored to confirm the relationship between the friction and wear characteristics of the coating. Thin Ag coatings, which are several hundred nanometers in thickness, are prepared by depositing Ag atoms on silicon substrates through a sputtering method. A pin-on-disk-type tribo-tester is installed inside a scanning electron microscope (SEM) to evaluate the friction and wear characteristics of the Ag coating. A fine diamond pin is brought into contact with the Ag coating surface, and a load of 20 mN is applied. The contact pressure is calculated to be approximately 15 GPa. The moments of wear caused by the sliding motion are visualized, and the changes in the friction characteristics according to each step of wear generation are monitored. The Ag coating can be confirmed to exhibit a wear phenomenon by gradually peeling off the surface of the coating on observing the friction and wear characteristics of the coating in real time inside the SEM. This can be explained by a typical plowing-type wear mechanism.