• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.74-81
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• 2003

This paper describes that the micro-cutting of WC-Co using PCD (Polycrystalline Diamond) and PcBN (Polycrystalline Cubic Boron Nitride) cutting tools are performed with SEM(Scanning Electron Microscope) direct observation method. The purpose of this study is to present reasonable cutting conditions to obtain precise finished surface and machining efficiency. Summary of the results are shown below: (1) The thrust cutting forces tend to increase more than the principal forces as the depth of cut and the cuttlllg speed are increased preferably on orthogonal microcutting. (2) The tool wear in the flank face was formed larger than that in the rake face on orthogonal micro cutting. (3) The wear appearance for PCD tools is abraded by hard WC particles of the work materials, which lead diamond grain to be detached from the bond.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.77-81
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• 2017

Pulse electroplating of Ni-P alloy was studied to fulfill the material requirement to the advanced vertical probe tip in wafer probe card. The major concerns are for the electrical conductivity and yield strength. Plating parameters such as current density, duty cycle and solution components were examined to obtain the nanocrystal structure and proper percentage of phosphorus, leading to how to control the nanocrystal grain growth and precipitation of $Ni_3P$ after heat treatment. Among the parameters, the amount of phosphorus acid was the main factor affecting on the grain size and sheet resistance, and the amount of 0.1 gram was appropriate. Since hardness in Ni-P alloy is increased by as-plated nanocrystal structure plus precipitation of $Ni_3P$, the concentration of P less than 15 at% was better choice for the grain coarsening without minus in hardness value. The following heat treatment made grain growth and dispersion of precipitates adjustable to meet the target limit of resistance of $100m{\Omega}$ and hardness number of over 1000Hv. The Ni-P alloy will be a candidate for the substitute of the conventional probe tip material.

• Korean Journal of Materials Research
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• v.28 no.5
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• pp.301-307
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• 2018

A boron-doped diamond(BDD) electrode is attractive for many electrochemical applications due to its distinctive properties: an extremely wide potential window in aqueous and non-aqueous electrolytes, a very low and stable background current and a high resistance to surface fouling. An Ar gas mixture of $H_2$, $CH_4$ and trimethylboron (TMB, 0.1 % $C_3H_9B$ in $H_2$) is used in a hot filament chemical vapor deposition(HFCVD) reactor. The effect of argon addition on quality, structure and electrochemical property is investigated by scanning electron microscope(SEM), X-ray diffraction(XRD) and cyclic voltammetry(CV). In this study, BDD electrodes are manufactured using different $Ar/CH_4$ ratios ($Ar/CH_4$ = 0, 1, 2 and 4). The results of this study show that the diamond grain size decreases with increasing $Ar/CH_4$ ratios. On the other hand, the samples with an $Ar/CH_4$ ratio above 5 fail to produce a BDD electrode. In addition, the BDD electrodes manufactured by introducing different $Ar/CH_4$ ratios result in the most inclined to (111) preferential growth when the $Ar/CH_4$ ratio is 2. It is also noted that the electrochemical properties of the BDD electrode improve with the process of adding argon.

• Korean Journal of Materials Research
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• v.31 no.12
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• pp.665-671
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• 2021

A 1.8 ㎛ thick polycrystalline diamond (PCD) thin film layer is prepared on a Si(100) substrate using hot-filament chemical vapor deposition. Thereafter, its thermal conductivity is measured using the conventional laser flash analysis (LFA) method, a LaserPIT-M2 instrument, and the newly proposed light source thermal analysis (LSTA) method. The LSTA method measures the thermal conductivity of the prepared PCD thin film layer using an ultraviolet (UV) lamp with a wavelength of 395 nm as the heat source and a thermocouple installed at a specific distance. In addition, the microstructure and quality of the prepared PCD thin films are evaluated using an optical microscope, a field emission scanning electron microscope, and a micro-Raman spectroscope. The LFA, LaserPIT-M2, and LSTA determine the thermal conductivities of the PCD thin films, which are 1.7, 1430, and 213.43 W/(m·K), respectively, indicating that the LFA method and LaserPIT-M2 are prone to errors. Considering the grain size of PCD, we conclude that the LSTA method is the most reliable one for determining the thermal conductivity of the fabricated PCD thin film layers. Therefore, the proposed LSTA method presents significant potential for the accurate and reliable measurement of the thermal conductivity of PCD thin films.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.422-427
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• 2003

Sapphire have been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing Process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.938-942
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding renditions of ceramic materials in the grinding with diamond wheel by the experimental plan method. The load on wheel by varying the feed rate was related with the surface roughness due to the minute destruction phenomenon of grains for the Si$_3$${N^4} and Zr{O_2}$. The depth of cut is related with the surface roughness because the grinding is carried out by grain shedding process due to the brittle fracture phenomenon for the ${Al_2}{O_3}$. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiments using the experimental plan method.

• Journal of Powder Materials
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• v.5 no.4
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• pp.303-311
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• 1998

Hard materials such as hardmetal, coated hardmetal, cermet, ceramics and diamond or c-BN sintered compact are a kind of grain-dispersed alloy with high volume of hard particles. These are used for cutting tools, wear-resistant tools, rock bits, high pressure apparatus, etc. The annual production in Japan is about 1.7 billion dollars (200 billion yen). This is greatly owed to the development in science and technology which has been accomplished by applying new concepts such as fine or uniform grain microstructure, orientation of crystal grains, functionally graded material, artificial lattice and coherent bonding in recent years. In this review, the development in recent years in Japan is briefly summarized.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.139-144
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• 2004

This polishing machine has many advantages to polish complicated shaped molds due to spindle header with constant pressure. But, because of new polishing machine, there is no study of the standardization of polishing by polishing conditions yet. So we want to know the relation between polishing conditions(a kind of tool, grain size) and surface roughness. The result of experimental was obtained surface roughness of 0.061${\mu}{\textrm}{m}$ Ry in case of using wood tool and grain of 6${\mu}{\textrm}{m}$ diamond.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.155-159
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• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding conditions of ceramics in the grinding with diamond wheel by Taguchi method. Feed rate was most important factor to the surface roughness. In the case of 4{Si_3}{N_4}$ and ${A1_2}{O_3}$, surface roughness value were small at 3m/min of feed rate. In the case of $ZrO_2$. surface roughness value was small at 4m/min of feed rate. Surface roughness have much influenced by major load for the :ii3N4 and $ZrO_2$. On the other hand, ${A1_2}{O_3}$ have more influenced by grain shedding of brittle fracture phenomenon. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiment using Taguchi method.

• Journal of the Korean Vacuum Society
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• v.17 no.6
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• pp.538-543
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• 2008

Recently a nano-scale diamond is possible to manufacture forms of powder(below 100 nm) by new processing of explosion or deposition method. Using a sintering of nano-scale diamond is possible to manufacture of grinding tools. We have need of a processing development of coated uniformly inorganic to prevent an abnormal grain growth of nano-crystal and bonding obstacle caused by sintering process. This paper, in order to improve the sintering property of nano-scale diamond, we coated ZnO thin films(thickness: $20{\sim}30\;nm$) in a vacuum by ALD(atomic layer deposition) Economically, in order to deposit ZnO all over the surface of nano-scale diamond powder, we used a new modified fluidized bed processing replaced mechanical vibration effect or fluidized bed reactor which utilized diamond floating owing to pressure of pulse(or purge) processing after inserted diamond powders in quartz tube(L: 20 mm) then closed quartz tube by porosity glass filter. We deposited ZnO thin films by ALD in closed both sides of quartz tube by porosity glass filter by ALD(precursor: DEZn($C_4H_{10}Zn$), reaction gas: $H_2O$) at $10^{\circ}C$(in canister). Processing procedure and injection time of reaction materials set up DEZn pulse-0.1 sec, DEZn purge-20 sec, $H_2O$ pulse-0.1 sec, $H_2O$ purge-40 sec and we put in operation repetitive 100 cycles(1 cycle is 4 steps) We confirmed microstructure of diamond powder and diamond powder doped ZnO thin film by TEM(transmission electron microscope) Through TEM analysis, we confirmed that diamond powder diameter was some $70{\sim}120\;nm$ and shape was tetragonal, hexagonal, etc before ALD. We confirmed that diameter of diamond powders doped ZnO thin film was some $70{\sim}120\;nm$ and uniform ZnO(thickness: $20{\sim}30\;nm$) thin film was successfully deposited on diamond powder surface according to brightness difference between diamond powder and ZnO.