• 한국정보시스템학회지:정보시스템연구
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• 제32권3호
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• pp.205-224
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• 2023

Purpose This study investigates the impact of organizational characteristics on organizational performance through case studies of smart factory implementation in the context of Korean small and medium Enterprises (SMEs). To achieve this goal, this study adopts the smart factory index of KOSMO (Korea Smart Manufacturing Office) established by Korean Ministry of SMEs and Startups. We visited 3 firms implemented smart factory projects. This study presents the results of field study in detail with evaluation criteria on how organizational competences like AI technology adoption and facility automation can be exploited to positively influence organizational performance through smart factory implementation. Design/methodology/approach There are not so many results of empirical studies related to smart factories in Korea. This is because organizational support and user involvement are required for facility AI platform service beyond factory automation after the start of the 4th Industrial Revolution. Korean government's KOSMO (Korean Smart Manufacturing Office) has developed and proposed a level measurement index for smart factory implementation. This study conducts case studies based on the level measurement method proposed by KOSMO in the process of conducting case studies of three companies belonging to the root and mechanic industries in Korea. Findings The findings indicate that organizational competences, such as facility AI platform adoption and user involvement, are antecedents to influence smart factory implementation, while smart factory implementation has significant relationship with organizational performance. This study provides a better understanding of the connection between organizational competences and organizational performance through smart factory case studies. This study suggests that SMEs should focus on enhancing their organizational competences for improving organizational performance through implementing smart factory projects.

• 한국실내디자인학회논문집
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• 제19권5호
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• pp.21-28
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• 2010

This study is purposed to understand the spacial usage of the furniture in detail for interior architecture. Many documents have prescribed the spacial furniture at random. While modernist have been interested in the spacial usage of the furniture, the importance of the spacial furniture stands out in architectural space. Since long ago, a great deal of effort has been put into creating a relational harmony between the space and furniture. The villa, the weekend home of the Savoye family, was built between 1928 and 1931. Particularly, the villa Savoye was focused for this study. Le Corbusier viewed desks and case pieces for storage as architecture, and the unite furniture and architecture by developing cabinets in standard modules that could be painted either the wall color to become part of the wall or in contrasting colors to stand out as furniture. Spacial furniture was used architecturally in the interior as well, it gives the space an unexpected playfulness with the color of the finishing materials. The various usage of the Spacial furniture constitute an element of great architectural richness. They have a unique principle based on emotional order and make the man move to another space and experience the spacial connection. In particular, the furniture that was considered by Corbuisier have rational function, division of the space, leaning the structure, and so on. The furniture as the element of the space composition can change the architectural space and view as well as connecting each other. Spacial furniture appear as physical ones called wall, floor, column, and existential value as a living space.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Journal of Information Processing Systems
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• 제12권4호
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• pp.612-630
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• 2016

As mobile augmented reality technologies are spreading these days, many users want to produce augmented reality (AR) contents what they need by themselves. To keep pace with such needs, we have developed a mobile AR contents builder (hereafter referred to as MARB) that enables the user to easily connect a natural marker and a virtual object with various interaction events that are used to manipulate the virtual object in a mobile environment so that users can simply produce an AR content using natural photos and virtual objects that they select. MARB consists of five major modules-target manger, virtual object manager, AR accessory manager, AR content manager, and AR viewer. The target manager, virtual object manager and AR accessory manager register and manage natural target markers, various virtual objects and content accessories (such as various decorating images), respectively. The AR content manger defines a connection between a target and a virtual object with enabling various interactions for the desired functions such as translation/rotation/scaling of the virtual object, playing of a music, etc. AR viewer augments various virtual objects (such as 2D images, 3D models and video clips) on the pertinent target. MARB has been developed in a mobile application (app) format in order to create AR contents simply using mobile smart devices without switching to a PC environment for authoring the content. In this paper, we present the detail organizations and applications of MARB. It is expected that MARB will enable ordinary users to produce diverse mobile AR contents for various purposes with ease and contribute to expanding the mobile AR market based on spread of a variety of AR contents.

• 한국학교수학회논문집
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• 제11권4호
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• pp.677-694
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• 2008

본 연구에서는 도구 교과인 수학을 중심으로 과학 교과를 수학 교과와 체계적으로 연결하는 방안을 제시하기 위한 목적으로 연구를 진행하였다. 이를 위해 첫째, 수학 교과를 중심으로 수학 교과와 과학 교과의 상호연계성에 대해 고찰하였다. 둘째, 수학 학습이 과학 학습에 미치는 경향을 살펴보기 위해 설문 조사를 실시하여 그 결과를 분석하였다. 설문 조사 및 결과 분석은 수학을 과학보다 상당시간 일찍 학습하는 경우, 수학을 과학과 거의 동시에 학습하는 경우, 과학을 수학보다 일찍 학습하는 경우로 나누어 수학 학습이 과학 학습에 미치는 경향을 분석하였다. 셋째, 수학 교과와 과학 교과를 체계적으로 연결하기 위한 구체적인 방안을 개발하였다. 이러한 연구 결과를 통해 수학학습이 과학학습에 긍정적인 영향을 주어 학업성취 능력의 향상과 학생들이 수학의 가치를 깨닫는데 도움이 되리라 기대한다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2009년도 제40회 하계학술대회
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• pp.2219_2220
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• 2009

The characteristics of the Superconducting Magnetic Energy Storage (SMES) system are faster response, longer life time, more economical, and environment friendly than other Uninterruptible Power Supply (UPS) using battery. Fast charge and discharge time of SMES system can provide powerful performance of improving power quality in the grid. In order to demonstrate the effectiveness of SMES, the authors make a 10kJ SMES system for connection with RTDS (Real Time Digital Simulator). Because the characteristics of superconducting magnet are very important in SMES system, the necessary items such as thermal characteristic, mechanical stress and protection circuit should be considered. In this paper, the authors experimented thermal characteristics of the 10kJ SMES system. The experiment was accomplished using a simulation coils made of aluminium. It has same dimension of the 10kJ class HTS SMES coil. The coil was cooled with GM (Gifford -McMahon) cryocooler through the OFHC (Oxgen Free High thermal Conductivity) conduction bar. The test results of cool down and heat loads characteristics of the simulation coils are described in detail.

• Journal of Power Electronics
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• 제15권6호
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• pp.1609-1618
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• 2015

DC microgrids are considered as prospective systems because of their easy connection of distributed energy resources (DERs) and electric vehicles (EVs), reduction of conversion loss between dc output sources and loads, lack of reactive power issues, etc. These features make them very suitable for future industrial and commercial buildings' power systems. In addition, the bipolar-type dc system structure is more popular, because it provides two voltage levels for different power converters and loads. To keep voltage balanced in such a dc system, a bidirectional dual buck-boost voltage balancer with direct coupling is introduced based on P-cell and N-cell concepts. This results in greatly enhanced system reliability thanks to no shoot-through problems and lower switching losses with the help of power MOSFETs. In order to increase system efficiency and reliability, a novel burst-mode control strategy is proposed for the dual buck-boost voltage balancer. The basic operating principle, the current relations, and a small-signal model of the voltage balancer are analyzed under the burst-mode control scheme in detail. Finally, simulation experiments are performed and a laboratory unit with a 5kW unbalanced ability is constructed to verify the viability of the bidirectional dual buck-boost voltage balancer under the proposed burst-mode control scheme in low-voltage bipolar-type dc microgrids.

• 한국지진공학회논문집
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• 제10권1호
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• pp.25-32
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• 2006

본 연구에서는 1994년 미국 노스리지 지진 이전에 건설된 기존 철골 건물의 용접형 철골 박스기둥과 보 접합부의 내진성능을 반복재하 실험에 의해 평가하였다. 실험결과에 의하면 노스리지 지진 이전 접합상세를 갖는 박스기둥과 보 접합부에서도 H-형강 기둥과 보 접합부 실험결과와 유사하게 취성파단이 발생하였다. 하지만, 박스기둥과 보 접합부에서의 플랜지 응력전달 경로가 H-형강 기둥과 보 접합부에서의 것과 상당한 차이가 있고 또한 박스기둥의 형상에 따라 균열 전파의 형태가 다를 수 있다는 것이 밝혀졌다. 따라서 용접형 철골 박스기둥과 보 접합부의 내진성능을 향상시키기 위해서는 H-형강 기둥과 보 접합부에 대한 기존 연구결과를 그대로 적용하기보다는 박스기둥에 적합한 접합부의 보강상세 개발이 요구된다.

• 한국ITS학회 논문지
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• 제7권5호
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• pp.147-158
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• 2008

ITS 근거법인 교통체계효율화법의 제정으로 ITS시스템이 활발히 구축, 개발되고 있다. 하지만 교통정보시스템의 상호 연계성을 고려하지 않아 교통정보서비스의 통합을 위한 활성화를 유도하지 못하였고, 이에 따라 국토해양부에서는 ITS 기술기준을 제정 고시하였다. 이에 본 연구에서는 센터와 단말기간의 정보교환에 대한 기본교통정보교환 기술기준 II 에 대하여 적합성 시험에 관한 연구를 실시하였다. 기술기준에 고시된 통신절차 분석을 수행하여 시험 항목을 정보요청시험과 정보제공시험으로 구분하였으며, 각 항목별로 세부시험 시나리오를 구성하였다 이에 대한 시험평가는 정보교환절차의 적합성과 데이터패킷 메시지의 정확도 등으로 구성하였으며, 기 제정된 기술기준에 의거하여 시험 횟수는 각 세부항목별 30회, 성공률은 95%를 기준으로 하였다. 본 연구는 ITS기술기준에 대한 적합성시험방법을 연구하여 국내 ITS시스템의 교통정보통합관리에 기여함을 목적으로 한다.

• 한국지반공학회논문집
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• 제15권1호
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• pp.53-62
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• 1999

블럭식 보강토 옹벽이 매우 활발히 적용되고 있음에도 불구하고 아직까지 블럭식 보강토 옹벽을 구성하는 블럭 벽체, 보강재, 뒤채움흙, 블럭/뒤채움흙 접촉면 등의 구성요소가 옹벽의 거동에 어떠한 영향을 미치는지에 대한 정확한 이해가 부족하며, 보다 안전하고 경제적인 설계를 위해서는 이에 대한 심도 있는 연구가 필요한 실정이다. 따라서 본 연구에서는 유한요소해석을 이용하여 뒤채움흙의 전단특성 및 보강재의 강성이 블럭식 보강토 옹벽의 거동에 미치는 영향을 고찰하였다. 해석에서는 블럭식 보강토 옹벽의 각 구성요소 및 단계별 시공과정을 상세히 모델링하였으며, 해석결과를 토대로 뒤채움흙의 전단특성 및 보강재의 강성에 따른 벽체 변위 및 토압, 보강토체 저면 연직응력, 그리고 보강재 유발인장력 및 블럭/보강재 연결력 분포 경향을 고찰하고 현재 적용하고 있는 설계기준의 타당성을 검토하였다.