• Title/Summary/Keyword: Design Alterations

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Effects of Design Alterations on the Vibration Suppression of a Machine Tool Structure (공작기계의 진동억제를 위한 설계개선 효과)

  • Kim, Young Jo;Ro, Seung Hoon;Shin, Ho Beom;Shin, Yun Ho;Jung, Keun Sup;Nam, Kyu Dong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.3
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    • pp.122-129
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    • 2016
  • In modern industries, in whichwhere high productivity is one of the most important concerns, machine tools are facing difficulties to satisfy the high high-speed operation, while and at the same time achieve the precision machining. Generally, the vibrations of the structure increase proportionally to the square of the operating speed so that the precision machining is severely damaged with increased speed. which is a must for the high productivity. Therefore, the suppression of the structural vibrations of the machine tools is the a major concern in the machine tool industry in order to achieve the high productivity and the precision machining simultaneously. In this study, the dynamic properties of a machining center structure were analyzed through the experiment and the computer simulations, and furthermore the results from those were compared to confirm the validity of the simulation model. The design alterations were deduced from the analysis and applied to the simulation model to investigate the effects of those alterations to suppress the vibrations of the machine. The result shows that the relatively simple design alterations, without redesigning the main structure of the machine, can suppress the vibrations effectively.

Design Alteration of a All in One PC for the Improved Stability (일체형 컴퓨터의 구조 안정화를 위한 설계 개선)

  • Kim, Dong Wook;Ro, Seung Hoon;Kim, Geon Hyeong;Yang, Yong Jun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.6
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    • pp.109-116
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    • 2013
  • Vibrations are generally recognized as the biggest concern in maintaining part' longevity of an All-in-one PC. The vibrations in PCs originate from excitation sources such as the HDD and the cooling fan. In this study, the vibrations from these sources were investigated in order to analyze the individual effects of the parameters on the structural vibrations of the PC; further, we attempted to establish design alterations that could successfully suppress vibrations, in order to achieve improved stability and part' longevity. The results show that relatively simple design alterations can substantially improve the stability of PCs.

Design of a Controller for the Semiconductor Fabricator with Improved Stability (반도체 전용기용 컨트롤러의 구조 안정화 설계)

  • Ro, Seung-Hoon;Shon, Jae-Yul;Lim, Yo-Han;Lee, Jae-Yul
    • Journal of the Korean Society of Industry Convergence
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    • v.12 no.1
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    • pp.43-50
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    • 2009
  • The manufacturing process of the semiconductor is guided by the controller, which is supposed to sense the unexpected shocks and/or vibrations to shutdown the hard disk and the whole system in order to prevent the malfunction. This feature of controller would shutdown the system due to the instability of the controller itself as well as the instability of the manufacturing system. And consequently will cause significant losses. In this study the structure of a controller has been investigated to find ways to suppress the vibrations from the structure. The frequency response test and the computer simulation has been implemented to find the structure with improved stability. The result of the study shows that the relatively simple design alterations can eliminate most of the vibrations.

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Design Alterations of a Packing Box for the Semiconductor Wafer to Improve Stability (Wafer Packing Box 안정화 설계)

  • Yoon, Jae-Hoon;Hur, Jang-Wook;Yi, Il-Hwan
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.1
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    • pp.62-66
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    • 2022
  • Semiconductor is one of the most internationally competitive areas among domestic industries, the major concern of which is the stability of the wafer manufacturing processes. The packaging process is the final step in wafer manufacturing. Problems in the wafer packaging process cause large losses. The vibrations are supposed to be the most important factors for the packaging quality. In this study, the structure of a packaging box was analyzed through experiments and computer simulations, and further the effects of design alterations to suppress the vibrations have been investigated. The final result shows that the vibrations can be reduced substantially to improve the stability of the structure.

Design Modifications of a Glass Cutting Machine for the Improved Stability (가공정도 향상을 위한 Glass Cutting Machine의 설계 개선)

  • Kwon, In-Hwan;Ro, Seung-Hoon;Park, Yu-Ra;Yi, Il-Hwan;Kil, Sa-Geun;Park, Keun-Woo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.3
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    • pp.6-14
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    • 2014
  • Touch panels are widely used in the modern display industry as the cover glass of smart mobile phones and tablet PCs. Glass cutting machines are commonly used to cut the panels into their proper sizes. Vibration of these glass cutting machines is assumed to be the main factor leading to the creation of burrs, notches, cracks, scratches and chips on the cut surfaces, eventually causing defects of the cover glass. In this study, the vibrations of a glass cutting machine used for the shearing of cover glass components were analyzed through an experiment and a computer simulation. The structural properties leading to vibration were also analyzed in an effort to determine design alterations which can suppress these vibrations. Moreover, each design alteration was applied to a computer simulation model to determine the effect of different alteration on suppressing vibration. The results show that simple design alterations can substantially suppress vibrations of glass cutting machines.

Design of a Laser Welding Machine for the Precision Improvement (용접 정밀도 향상을 위한 레이저 용접기의 구조개선)

  • Ro, Seung-Hoon;Jeong, Pyeung-Soo;An, Jae-Woo;Kang, Hee-Tae;Lee, Tae-Hoon
    • Journal of the Korean Society of Industry Convergence
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    • v.13 no.4
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    • pp.197-203
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    • 2010
  • Laser welding is widely used for precision welding because of superior mechanical properties and high productivity. Generally the accuracy of the welding is determined by the distribution of the bead which is affected by the structural vibrations of the equipment. This study was originated to stabilize a laser welding machine to minimize the bead distribution for the precise joining. The structural properties of the laser welding machine have been investigated to analyze the major factors of the vibrations to cause the bead distribution. The ideas for the design improvement have been applied to the simulation model to identify the effects and further to achieve the stability design and to minimize the bead distribution. The result shows that a few simple design alterations can substantially suppress the structural vibrations and improve the welding accuracy. The procedure used for this study can also be applied to similar welding equipments for improving the structural stability and the welding accuracy.

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Stability Design of a Machining Center for Ceramic Materials (세라믹 가공 장비(MCT)의 구조 안정화 설계)

  • Yoon, Jae Hoon;Han, Dae Sung;Yoon, Hyun Jin;Yi, Il Hwan
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.3
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    • pp.133-139
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    • 2019
  • The utilizations of ceramics in the modern industries are increasing due to the desirable combinations of electrical, mechanical and physical properties found in ceramics. Ceramic materials are brittle, hard, strong in compression, weak in shearing and tension which is prone to affect the defects such as scratch, crack and breakage during the machining. Generally, the defects of the ceramic machining are generated from the structural vibrations of the machine. In this study, the dynamic characteristics of a machining center for ceramic machining were investigated to analyze the structural vibrations for the improved stability. Frequency response test and computer simulation have been conducted for the analysis and the design improvement. The improved design is suggested to suppress vibrations for the higher stability of the machine and further to reduce vibrations. And the result shows that simple design alterations without any change of major parts of the machine can reduce the vibration of the machine effectively.

A Case Study on the Interior Design Remodeling of Apartment according to the Floors Space in Seoul (서울지역 아파트의 규모별 실내디자인 리모델링에 대한 심층 사례 연구)

  • Shin Kyung-Joo;Rhee Ji-Young;Jang Sang-Ock
    • Journal of the Korean housing association
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    • v.16 no.2
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    • pp.1-10
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    • 2005
  • The purpose of this study is providing useful information for consumer-friendly house plan by investigating remodeling apartments according to the area type and size. In order to achieve this aim, case study was applied. The case study was conducted of five small, medium, and large size apartments through depth-interviews, actual survey, and questionnaires on the remodeling behavior, interior design, and interior atmosphere. The results of the study are as follows: Structural alterations were frequent in communal area, and then in private and household areas. Changing lighting fixtures was frequent in all area types, and especially, in communal areas installing extra decoration was frequently observed. Besides, alterations of doors and window frames were carried out in communal, private, housework and service areas by using wood, aluminum sashes, double-glazing, and paint coating. Finally, in housework areas the material and color of counters were changed into wooden and achromatic.

Design of the Supporting Structure of a Wire Saw for the Solar Cell Wafer (태양전지 웨이퍼용 Wire Saw안정화를 위한 지지구조 개선)

  • Yi, Il Hwan;Ro, Seung Hoon;Kim, Dong Wook;Park, In Kyu;Kil, Sa Geun;Kim, Young Jo
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.3
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    • pp.59-64
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    • 2018
  • In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

Design Alterations of a Chamfering Machine Structure for the Improved Surface Quality (가공 제품 품질 향상을 위한 면취장비의 설계 개선)

  • Yi, Il Hwan;Ro, Seung Hoon;Han, Dae Sung;Kim, Young Jo;Kil, Sa Geun;Park, In Kyu
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.117-122
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    • 2019
  • Pipes are widely used in various industries such as automobile, anti-vibration devices, factories and ship building. Chamfering is one of the most critical processes in pipe manufacturing which removes burrs of the pipes for better surface quality. In most cases, the defects of the chamfered surface are originated from the structural vibrations of the chamfering machine. In this study, the dynamic characteristics of a chamfering machine have been analyzed though the experiment and the computer simulation. And the effects of the design parameters affecting the stability of the machine have been investigated to stabilize the machine structure and further to reduce structural vibrations. The result shows that design alterations to stabilize the machine can suppress the defects of the machined surface as well as the vibrations during chamfering.