• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.237.2-237.2
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• 2016

A pure hafnium-carbide (HfC) coating layer was deposited onto carbon/carbon (C.C) composites using a vacuum plasma spray system. By adopting a SiC buffer layer, we successfully integrated C.C composites with a $100-{\mu}m-thick$ protective coating layer of HfC. Compared to the conventional chemical vapor deposition process, the HfC coating process by VPS showed increased growth rate, thickness, and hardness. The growth behavior and morphology of HfC coatings were investigated by FE-SEM, EDX, and XRD. From these results, it was shown that the addition of a SiC intermediate layer provided optimal surface conditions during the VPS procedure to enhance adhesion between C.C and HfC (without delamination). The thermal ablation test results shows that the HfC coating layer perfectly protected inner C.C layer from thermal ablation and oxidation. Consequently, we expect that this ultra-high temperature ceramic coating method, and the subsequent microstructure that it creates, can be widely applied to improve the thermal shock and oxidation resistance of materials under ultra-high temperature environments.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.2
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• pp.67-73
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• 2016

The degradation behaviors of TiN coating layers under thermo-mechanical stress were investigated in terms of comparison of finite element analysis (FEA) and experimental data. The coating specimen was designed to quarter cylinder model, and the pulsed laser ablation was assumed as heat flux condition. The FEA results showed that heat accumulation at the center of the laser-ablated spot occurred and principle stress was concentrated at the lower region of the coating layer. The microstructural observation revealed that surface melting and decrease of the coating thickness occurred in the TiN/Inconel 617 and the interfacial cracks formed in the TiN/Si. The delamination was caused by the mechanical stress from the center to the outside of the ablated spot as the FEA results expected. It was considered that the improvement of the thermal shock resistance was attributed to higher thermal conductivity of Si wafer than that of Inconel 617.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.1
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• pp.19-23
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• 2019

The PMMA (polymethyl methacrylate)/clay nanocomposites were synthesized by in situ radical polymerizations with different clay contents (3 and 7 wt%) using microwave heating. The nanostructure, optical, and thermal properties of the synthesized PMMA/clay nanocomposites were measured by XRD, TEM, AFM, UV-vis, and TGA. It was found that the intercalated- or exfoliated structure of PMMA/clay nanocomposites was strongly dependent on the content of clay. Thus, the imposition of microwave-assisted polymerization facilitated a delamination process of layered silicates to achieve exfoliation state of interlayer distance. The PMMA/3 wt% C10A nanocomposite with well-dispersed and exfoliated clay nano-layers showed the good optical transparency similar to pure PMMA in this study. The thermal decomposition rates of the PMMA/clay nanocomposites become to be lower compared to that of the pure PMMA, indicating the intercalated- or exfoliated inorganic silicate has high thermal stability. A possible reason is that the thermally segmental motion of PMMA polymer into inorganic silicate interlayer spacing has increased the thermal stability of the PMMA/clay nanocomposites.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• Composites Research
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• v.16 no.3
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• pp.9-17
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• 2003

In order to simulate the crack connection between cords and the interply crack growth in the belt-layer of real tire, 2 ply rubber/cord laminate specimens with exposed edges were tested in 4~11mm displacement control. Measurement of the crack connection is evaluated when crack reaches the half of the length between 45$^{\circ}$ aligned cords, and the amount of the crack growth is measured by the steel probe method. 2 dimensional analytic modeling was performed to simulate the crack connection between cords at the exposed edges. Also, the theoretical life of the specimens was calculated from the crack connection life between cords(critical value) and from the critical value to the final failure by the use of Tearing energy(T); the strain energy release per unit area of one fracture surface of a crack. Then, theoretical life was compared with those of experiments. The life prediction up to the critical value has about 20% error compared to experimental life, and up to the final failure about 65% error. Therefore, total theoretical life has about 45% error compared to the experimental life, which is conceivable in the case of rubber.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.75-80
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• 2014

Nanocrystalline diamond(NCD) films on steel(SKH51) has been investigated using SiC interlayer film. SiC was deposited on SKH51 or Si wafer by RF magnetron sputter. NCD was deposited on SiC at $600^{\circ}C$ for 0.5~4 h employing microwave plasma CVD. Film morphology was observed by FESEM and FIB. Film adherence was examined by Rockwell C adhesion test. The growth rate of NCD on SiC/Si substrate was much higher than that on SiC/SKH51. During particle coalescence, NCD growth rate was slow since overall rate was determined by the diffusion of carbon on SiC surface. After completion of particle coalescence, NCD growth became faster with the reaction of carbon on NCD film controlling the whole process. In the case of SiC/SKH51 substrate, a complete NCD film was not formed even after 4 h of deposition. The adhesion test of NCD/SiC/SKH51 samples revealed a delamination of film whereas that of SiC/SKH51 showed a good adhesion. Many voids of less than 0.1 ${\mu}m$ were detected on NCD/SiC interface. These voids were believed as the reason for the poor adhesion between NCD and SiC films. The origin of voids was due to the insufficient coalescence of diamond particles on SiC surface in the early stage of deposition.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.6
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• pp.203-209
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• 2023

Cobalt sulfide nanocomposites were synthesized through a simple hydrothermal method as anode materials for sodium ion batteries (SIBs). In this work, a cobalt sulfide nanoparticle (CoS-NF) and a cobalt sulfide nanocomposite integrated with reduced graphene oxide (CoS@G-NC) were fabricated for electrochemical energy storage performance of battery. The as-prepared CoS@G-NC electrode exhibited reversible and stable cycle performance (62 % after 30 cycles at current density of 200 mA g^-1). The improved electrochemical property was attributed to the small grain growth and uniform distribution of cobalt sulfide during synthesis, which maximized the diffusion pathway for sodium ions and effectively suppressed the delamination and volume expansion of cobalt sulfide during the conversion reaction. The results provide promising anode materials for next-generation SIBs.

• Structural Engineering and Mechanics
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• v.76 no.2
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• pp.175-191
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• 2020

In this study, the effect of Nano silica (SiO2) on the buckling strength of the glass fiber reinforced laminates containing the machining process causes holes were investigated. The tests have been applied on two status milled and non-milled. To promote the mechanical behavior of the fiber-reinforced glass epoxy-based composites, Nano sio2 was added to the matrix to improve and gradation. Nano sio2 is chosen because of flexibility and high mechanical features; the effect of Nanoparticles on surface serenity has been studied. Thus the effect of Nanoparticles on crack growth and machining process and delamination caused by machining has been studied. We can also imply that many machining factors are essential: feed rate, thrust force, and spindle speed. Also, feed rate and spindle speed were studied in constant values, that the thrust forces were studied as the main factor caused residual stress. Moreover, entrance forces were measured by local calibrated load cells on machining devices. The results showed that the buckling load of milled laminates had been increased by about 50% with adding 2 wt% of silica in comparison with the neat damaged laminates while adding more contents caused adverse effects. Also, with a comparison of two milling tools, the cylindrical radius-end tool had less destructive effects on specimens.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.1
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• pp.7-18
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• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.

• Composites Research
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• v.24 no.3
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• pp.25-30
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• 2011

The studies on the non-destructive testing methods of the composite materials are very important for improving their reliability and safety. AE(Acoustic Emission) can evaluate the defects by detecting the emitting strain energy when elastic waves are generated by the generation and growth of a crack, plastic deformation, fiber breakage, matrix cleavage or delamination. In this paper, the AE signals of the filament wound composite cylinder and sandwich cylinder during the pressure test were measured and analyzed. The signal characteristics of PVDF sensors were measured, and an AE signal analyzer which had the band-pass filter and L-C resonance filter were designed and fabricated. Also, the crack detection capability of the fabricated AE signal analyzer wes evaluated during the pressure tests of the filament wound composite cylinder and the sandwich cylinder.