• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.9
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• pp.2154-2164
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• 1995

In this study, a dielectric cure monitoring system which consists of an electric circuit, a sensor and a personal computer was developed to on-line monitor the dielectric properties of carbon fiber epoxy composite materials. Also, the kinetic model of carbon fiber epoxy composite materials was developed by curve fitting of differential scanning calorimetry data. The start and end points of cure and the relationship between the dissipation factor and the degree of cure were obtained by comparing the dissipation factor from the dielectric properties with the degree of cure from the DSC data. The relationship between the dissipation factor and the degree of cure was tested under various temperature profiles.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.42-45
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• 2000

The properties of thermosetting resins are dependent on the degree of cure and consolidation quality. Since the consolidation process of thermosetting resin matrix fiber composites is much dependent on the viscosity of resin in the composites, in this study, the dissipation factor which is a function of viscosity was measured by the newly developed Lacomtech dielectrometry apparatus and sensors. Using the measured dissipation factors, the relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

• Proceedings of the Korean Society of Agricultural Engineers Conference
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• 2000.10a
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• pp.444-450
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• 2000

This study was performed to analyze the degree of consolidation by the dissipation of excessive pore water pressure and final settlement prediction methods of the very soft clay. Hyperbolic method, Asaoka method and curve fitting method were used to compute the degree of consolidation. The degree of consolidation with excessive pore water pressure were used to compute, which considered the dissipation time with embankment construction. The degree of consolidation that was obtained by the peak excessive pore water pressure was less than in the case of the dissipation excessive pore water pressure. And, the degree of consolidation by the total settlement was nearly the same value that of layer settlement. The degree of consolidation that was obtained by excessive pore water pressure was larger than in the case of the settlement.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.797-803
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• 2001

The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

• Composites Research
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• v.16 no.4
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• pp.51-58
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• 2003

Since the reliability of adhesively bonded joints is much dependent on the curing status of thermosetting adhesive, the on-line cure monitoring during the cure of adhesively joints could improve the quality of adhesively bonded joints. In this work, the dielectric method which measures the dissipation factor of the adhesive during the cure of joints and converts it into the degree of cure of the adhesive was devised. The relation between the dissipation factor and the degree of cure of adhesive was investigated, which could eliminate the temperature effect on the dissipation factor that is a strong function of the degree of cure and temperature of adhesive. From the investigation, it was found that the dissipation factor showed a trend similar to the cure rate of the adhesive.

• Journal of the Korean Society for Nondestructive Testing
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• v.23 no.5
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• pp.409-417
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• 2003

Cure monitoring can be used to improve the quality and productivity of thermosetting resin matrix composite products during their manufacturing process. In this work, the sensitivity of dielectrometry was improved by adequate separation the efforts of sensor and externals on the measured signal. A new algorithm to obtain the degree of cure during dielectric cure monitoring of glass/polyester and glass/epoxy composites was developed by employing a function of both temperature and dissipation factor, in which five cure monitoring parameters were used to calculate the degree of cure. The decreasing pattern of dissipation factor was compared with the relationships between the degree of cure and the resin viscosity. The developed algorithm might be employed for the in situ cure monitoring of thermosetting resin composites.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.219-223
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• 2001

The on-line cure monitoring during the cure process of composite materials is important for better quality and productivity. The dielectric sensor for cure monitoring consists of base film and electrodes. Because the characteristic of dielectric sensor for the on-line cure monitoring is dependent on the base material, width and number of electrode, etc, the dielectric sensor should be standardized. And the selection of base film material of sensor is very important. In order to prevent the measuring errors generated from the increase of environmental temperature, the base film material should have stable dielectric constant with respect to environmental temperature. In this study, the newly developed dielectric sensor for cure monitoring was designed and the dissipation factor which is function of degree of cure was measured using the sensor. The relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11a
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• pp.229-234
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• 2001

A practical and effective semi-active on-off control law is developed for vibration attenuation of a natural, multi-degree-of-freedom suspension system, when its operational response mode is available. It does not need the accurate system parameters and dynamics of semi-active actuator. It reduces the total vibratory energy of the system including the work done by external disturbances and the maximum energy dissipation direction of the semi-active control device is tuned to the operational response mode of the structure. The effectiveness of the control law is illustrated with a three degree-of-freedom excavator cabin model.

• Proceedings of the Korean Geotechical Society Conference
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• 1997.10a
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• pp.229-236
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• 1997

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.5
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• pp.800-805
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• 2017

The accelerated thermal ageing of CSPE (chlorosulfonated polyethylene) was carried out for 16.82, 50.45, and 84.09 days at $110^{\circ}C$, equivalent to 20, 60, and 100 years of ageing at $50^{\circ}C$ in nuclear power plants, respectively. As the accelerated thermally aged years increase, the insulation resistance and resistivity of the CSPE decrease, and the capacitance, relative permittivity and dissipation factor of those increase at the measured frequency, respectively. As the accelerated thermally aged years and the measured frequency increase, the phase degree of response voltage vs excitation voltage of the CSPE increase but the phase degree of response current vs excitation voltage decrease, respectively. As the accelerated thermally aged years increase, the apparent density, glass transition temperature and the melting temperature of the CSPE increase but the percent elongation and % crystallinity decrease, respectively. The differential temperatures of those are $0.013-0.037^{\circ}C$ and, $0.034-0.061^{\circ}C$ after the AC and DC voltages are applied to CSPE-0y and CSPE-20y, respectively; the differential temperatures of those are $0.011-0.038^{\circ}C$ and $0.002-0.028^{\circ}C$ after the AC and DC voltages are applied to CSPE-60y and CSPE-100y, respectively. The variations in temperature for the AC voltage are higher than those for the DC voltage when an AC voltage is applied to CSPE. It is found that the dielectric loss owing to the dissipation factor($tan{\delta}$) is related to the electric dipole conduction current. It is ascertained that the ionic (electron or hole) leakage current is increased by the partial separation of the branch chain of CSPE polymer as a result of thermal stress due to accelerated thermal ageing.