• Journal of the Korean Data and Information Science Society
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• 제19권2호
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• pp.609-620
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• 2008

There may be several parallel equipments having the same function in a multi-stage manufacturing process, which affect the product quality differently and have significant differences in defect rate. The product quality may depend on what equipments it has been processed as well as what process variable values it has. Applying one model ignoring the presence of different equipments may distort the prediction of defect rate and the identification of important quality variables affecting the defect rate. We propose a procedure for data segmentation when constructing models for predicting the defect rate or for identifying major process variables influencing product quality. The proposed procedure is based on the principal component analysis and the analysis of variance, which demonstrates a better performance in predicting defect rate through a case study with a PDP manufacturing process.

• International Journal of Computer Science & Network Security
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• 제22권10호
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• pp.11-16
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• 2022

Applying predictive analytics to predict software defects has improved the overall quality and decreased maintenance costs. Many supervised and unsupervised learning algorithms have been used for defect prediction on publicly available datasets. Most of these datasets suffer from an imbalance in the output classes. We study the impact of class imbalance in the defect datasets on the efficiency of the defect prediction model and propose a CPP method for handling imbalances in the dataset. The performance of the methods is evaluated using measures like Matthew's Correlation Coefficient (MCC), Recall, and Accuracy measures. The proposed sampling technique shows significant improvement in the efficiency of the classifier in predicting defects.

• 한국정보과학회논문지:컴퓨팅의 실제 및 레터
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• 제15권8호
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• pp.596-600
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• 2009

검증과 확인을 통한 소프트웨어의 효율적인 관리를 지원하기 위하여 객체지향 메트릭 기반의 결함 예측 모형이 많이 제안되고 있다. 제안된 모형은 주로 로지스틱 회귀분석으로 개발하였다. 그리고 개발된 모형의 결함 예측 정확도는 60${\sim}$70%이었다. 본 논문에서는 기존 결함 예측 모형의 효과를 확인하기 위하여 이클립스 3.3을 대상으로 개발된 모형과 유사한 방법으로 실험을 하였다. 실험 결과 모형의 정확성은 약 40%이었다. 이는 주장된 예측력보다 많이 낮은 수치이었다. 또한 단순 로지스틱 회귀분석이 다중 로지스틱 회귀분석보다 높은 예측력을 보였다.

• International Journal of Precision Engineering and Manufacturing
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• 제4권6호
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• pp.12-19
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• 2003

This paper presents the effect of boundary conditions in various failure pressure models published for the estimation of failure pressure. Furthermore, this approach is extended to the failure prediction with the aid of a failure probability model. The first order Taylor series expansion of the limit state function is used in order to estimate the probability of failure associated with each corrosion defect in buried pipelines for long exposure period with unit of years. A failure probability model based on the von-Mises failure criterion is adapted. The log-normal and standard normal probability functions for varying random variables are adapted. The effects of random variables such as defect depth, pipe diameter, defect length, fluid pressure, corrosion rate, material yield stress, material ultimate tensile strength and pipe thickness on the failure probability of the buried pipelines are systematically investigated for the corrosion pipeline by using an adapted failure probability model and varying failure pressure model.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2009년도 추계학술대회 논문집
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• pp.169-172
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• 2009

Multiple scale modeling has been applied to predict defect shape change during the wire rod rolling process. The size difference between bloom and defect prevent using usual FEM approaches due to the enormous number of elements required to depict the defect. The newly developed multiple scale model can visualize defect shape changes during the multi stands rolling process. The defect positioned at the top and side of bloom are smoothed out but the one at the middle evolved as folding or remained as crack. This approach can be used for defect control with roll shape design and initial bloom shape.

• 정보과학회 컴퓨팅의 실제 논문지
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• 제22권12호
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• pp.681-686
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• 2016

소프트웨어 결함 예측은 프로젝트의 효율적인 관리와 성공에 있어 중요한 요소이다. 이 결함은 심각도에 따라 프로젝트에 영향을 미치는 정도가 다르다. 그러나 기존 연구는 결함 유무만 관심을 두고 심각도를 고려하지 않는다. 본 논문에서는 소프트웨어 관리 효율과 품질 향상을 위해 FCM을 적용한 결함 심각도 기반 앙상블 모델을 제안한다. 제안된 모델은 FCM으로 NASA PC4의 결함심각도를 재분류한다. 그리고 RF(Random Forest)로 심각도에 영향을 주는 입력 column을 선별하여 데이터 핵심 결함 요인을 추출한다. 또한 10-fold 교차검증으로 파라미터를 변경해 모델 성능을 평가한다. 실험 결과는 다음과 같다. 첫째, 결함심각도가 58,40,80에서 30,20,128로 재분류되었다. 둘째, 심각도에 영향을 주는 중요한 입력 column은 정확도와 노드 불순도 측면에서 BRANCH_COUNT였다. 셋째, 성능평가는 트리수가 작고 고려할 변수가 많을수록 좋은 성능을 보였다.

• 한국전기전자재료학회논문지
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• 제31권7호
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• pp.450-454
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• 2018

Because of the rapidly changing environment and high uncertainties, the semiconductor industry is in need of appropriate forecasting technology. In particular, both the cost and time in the test process are increasing because the process becomes complicated and there are more factors to consider. In this paper, we propose a prediction model that predicts a final "good" or "bad" on the basis of preconditioning test data generated in the semiconductor test process. The proposed prediction model solves the classification and regression problems that are often dealt with in the semiconductor process and constructs a reliable prediction model. We also implemented a prediction model through various machine learning algorithms. We compared the performance of the prediction models constructed through each algorithm. Actual data of the semiconductor test process was used for accurate prediction model construction and effective test verification.

• 한국컴퓨터정보학회논문지
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• 제20권5호
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• pp.73-81
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• 2015

소프트웨어 결함 예측 연구들의 대부분은 입력 개체의 결함 유무를 예측하는 이진 분류 모델들에 관한 것들이다. 하지만 모든 결함들이 같은 심각도를 갖지는 않으므로 예측 모델이 입력 개체의 결함경향성을 몇 개의 심각도 범주로 분류할 수 있다면 훨씬 유용하게 사용될 수 있다. 본 논문에서는 전통적인 복잡도와 크기 메트릭들을 입력으로 하는 심각도 기반 결함 예측 모델을 제안하였다. 학습 알고리즘은 많이 사용되는 네 개의 기계학습 기법들을 사용하였으며, 모델 구조는 삼진 분류 모델로 하였다. 모델 성능 평가를 위해 실험 데이터는 두 개의 NASA 공개 데이터 집합을 사용하였고, 평가 측정치는 Accuracy를 이용하였다. 평가 실험 결과는 역전파 신경망 모델이 두 데이터 집합에 대해 각각 81%와 88% 정도의 Accuracy 값으로 가장 좋은 성능을 보였다.

• Smart Structures and Systems
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• 제13권6호
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• pp.901-925
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• 2014

The reliability of a Bridge management System depends on the quality of visual inspection and the reliable estimation of bridge condition rating. However, the current practices of visual inspection have been identified with several limitations, such as: they are time-consuming, provide incomplete information, and their reliance on inspectors' experience. To overcome such limitations, this paper presents an approach of automating the prediction of condition rating for bridges based on digital image analysis. The proposed methodology encompasses image acquisition, development of 3D visualization model, image processing, and condition rating model. Under this method, scaling defect in concrete bridge components is considered as a candidate defect and the guidelines in the Ontario Structure Inspection Manual (OSIM) have been adopted for developing and testing the proposed method. The automated algorithms for scaling depth prediction and mapping of condition ratings are based on training of back propagation neural networks. The result of developed models showed better prediction capability of condition rating over the existing methods such as, Naïve Bayes Classifiers and Bagged Decision Tree.

• 대한산업공학회지
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• 제40권3호
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• pp.257-266
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• 2014

The semiconductor manufacturing industry is managed by a number of parameters from the FAB which is the initial step of production to package test which is the final step of production. Various methods for prediction for the quality and yield are required to reduce the production costs caused by a complicated manufacturing process. In order to increase the accuracy of quality prediction, we have to extract the significant features from the large amount of data. In this study, we propose the method for extracting feature from the cell level data of probe test process using OPTICS which is one of the density-based clustering to improve the prediction accuracy of the quality of the assembled chips that will be placed in a package test. Two features extracted by using OPTICS are used as input variables of quality prediction model because of having position information of the cell defect. The package test progress for chips classified to the correct quality grade by performing the improved prediction method is expected to bring the effect of reducing production costs.