• 제목/요약/키워드: Defect free single crystalline

검색결과 7건 처리시간 0.026초

1차원 InN 단결정 나노선의 구조특성에 대한 고찰 (Structural Characteristic of One Dimensional Single Crystalline of InN Nanowires)

  • 변윤기;정용근;이상훈;최성철
    • 한국세라믹학회지
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    • 제44권4호
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    • pp.202-207
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    • 2007
  • High-Quality 1-Dimensional InN single crystalline have been grown by Halide Vapor-Phase Epitaxy on the Au catalyst coated Si substrate using the vapor-liquid-solid growth mechanism. We have been grown 1-dimension InN nanowires having controlled the growth conditions for substrate temperature and gases flow rate. The grown InN nanowire of characteristics for morphologies, crystal structure, and element analysis were carried out by SEM, HR-TEM, and EDS respectively. And the defects of InN crystalline were analyzed by indexing of selective area diffraction pattern with attached HR-TEM. We have successfully obtained the defect-free 1-dimensional InN single crystalline nanowire at the atmosphere pressure.

열화학기상증착법을 이용한 Si 기판 위의 $SnO_2$ 나노와이어 제작 및 물성평가 (Synthesis and characterization of $SnO_2$ nanowires on Si substrates in a thermal chemical vapor deposition process)

  • 이득희;박현규;이삼동;정순욱;김상우
    • 한국결정성장학회지
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    • 제17권3호
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    • pp.91-94
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    • 2007
  • Vapor liquid solid 기구에 의한 열화학기상증착법을 이용하여 Si (001) 기판 위에 $SnO_2$ 나노와이어를 성장시켰다. Au 박막 (3 nm)을 성장을 위한 촉매로 사용하여 Si(001) 기판 이에 순수 SnO powder (purity, 99.9%)를 반응 원료로 대기압 하 $950{\sim}100^{\circ}C$ 온도 범위, $750{\sim}800\;sccm$ 아르곤 분위기에서 $SnO_2$ 나노와이어를 성장시켰다. X-ray diffraction 분석을 통해 성장한 $SnO_2$ 나노와이어가 tetragonal rutile 구조임을 확인하였고, transmission electron microscopy 분석을 통해 단일 나노와이어의 결정 특성을 분석하였다. 또한, 상온 photoluminescence 분석을 통해 나노와이어 샘플로부터 600 nm 부근에서 나타나는 defect level 천이에 의한 넓은 emission band를 확인함으로써 성장한 나노와이어 $SnO_2$임을 확인하였다.

대구경 연속성장 초크랄스키법에서 고품질 잉곳 생산을 위한 연구 (Research for High Quality Ingot Production in Large Diameter Continuous Czochralski Method)

  • 이유리;정재학
    • Current Photovoltaic Research
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    • 제4권3호
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    • pp.124-129
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    • 2016
  • Recently industry has voiced a need for optimally designing the production process of low-cost, high-quality ingots by improving productivity and reducing production costs with the Czochralski process. Crystalline defect control is important for the production of high-quality ingots. Also oxygen is one of the most important impurities that influence crystalline defects in single crystals. Oxygen is dissolved into the silicon melt from the silica crucible and incorporated into the crystalline a far larger amount than other additives or impurities. Then it is eluted during the cooling process, there by causing various defect. Excessive quantities of oxygen degrade the quality of silicone. However an appropriate amount of oxygen can be beneficial. because it eliminates metallic impurities within the silicone. Therefore, when growing crystals, an attempt should be made not to eliminate oxygen, but to uniformly maintain its concentration. Thus, the control of oxygen concentration is essential for crystalline growth. At present, the control of oxygen concentration is actively being studied based on the interdependence of various factors such as crystal rotation, crucible rotation, argon flow, pressure, magnet position and magnetic strength. However for methods using a magnetic field, the initial investment and operating costs of the equipment affect the wafer pricing. Hence in this study simulations were performed with the purpose of producing low-cost, high-quality ingots through the development of a process to optimize oxygen concentration without the use of magnets and through the following. a process appropriate to the defect-free range was determined by regulating the pulling rate of the crystals.

Morphology-Controlled Fabrication of ZnS Nanostructures with Enhanced UV Emission

  • 김연호;장두전
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.587-587
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    • 2013
  • ZnS is well-known direct band gap II-VI semiconductor, and it attracts intense interest due to its excellent properties of luminescence which enable ZnS to have promising materials for optical, photonic and electronic devices. Especially, the emission wavelength of ZnS falls in the UV absorption band of most organic compoundsand biomolecules, thus it is envisaged that ZnS based devices may find applications in increasingly important fluorescence sensing. We have developed a facile and effective one-step process for the fabrication of single-crystalline and pure-wurtzite ZnS nanostructures possessing sharp band-edge emission at room-temperature having diverse length-to-width ratios. Each of nanostructures was composed of chemically pure, structurally uniform, single-crystalline, and defect-free ZnS. These features not only suppress trap or surface states emission centered at 420 nm, but also enhance UV band-edge emission centered at 327 nm, which give as-synthesized our ZnS nanostructures possible sharp UV emission at room temperature. The reaction medium consisting of mixed solvents such as hydrazine, ethylenediamine, and water as well as proper reaction time and temperature have played an important role in the crystallinity and optical properties of ZnS nanostructures. As-synthesized our ZnS nanostructures possessing sharp UV emission guarantee high potential for both fundamental research and technological applications.

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무결정결함영역을 유지하면서 에너지를 절감하는 초크랄스키 실리콘 단결정 성장로 수냉관 최적 설계 (Optimal Water-cooling Tube Design for both Defect Free Process Operation and Energy Minimization in Czochralski Process)

  • 채강호;조나영;조민제;정현준;정재학;성수환;육영진
    • Current Photovoltaic Research
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    • 제6권2호
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    • pp.49-55
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    • 2018
  • Recently solar cell industry needs the optimal design of Czochralski process for low cost high quality silicon mono crystalline ingot. Because market needs both high efficient solar cell and similar cost with multi-crystalline Si ingot. For cost reduction in Czochralski process, first of all energy reduction should be completed because Czochralski process is high energy consumption process. For this purpose we studied optimal water-cooling tube design and simultaneously we also check the quality of ingot with Von mises stress and V(pull speed of ingot)/G(temperature gradient to the crystallization) values. At this research we used $CG-Sim^{(R)}$ S/W package and finally we got improved water-cooling tube design than normally used process in present industry. The optimal water-cooling tube length should be 200mm. The result will be adopted at real industry.

New Approaches for Overcoming Current Issues of Plasma Sputtering Process During Organic-electronics Device Fabrication: Plasma Damage Free and Room Temperature Process for High Quality Metal Oxide Thin Film

  • Hong, Mun-Pyo
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.100-101
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    • 2012
  • The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

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GaAs 기판위에 성장된 단결정 AlAs층의 선택적 산화 및 XPS (X-ray photonelectron spectroscopy) 분석 (Selective Oxidation of Single Crystalline AlAs layer on GaAs substrate and XPS(X-ray photoelectron spectroscopy) Analysis)

  • 이석헌;이용수;태흥식;이용현;이정희
    • 센서학회지
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    • 제5권5호
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    • pp.79-84
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    • 1996
  • $n^{+}$형 GaAs 기판위에 MBE로 $1\;{\mu}m$ 두께의 GaAs층과 AlAs층 및 GaAs cap 단결정층을 차례로 성장시켰다. AlAs/GaAs epi층을 $400^{\circ}C$에서 각각 2시간 및 3시간동안 $N_{2}$로 bubbled된 $H_{2}O$ 수증기(水蒸氣)($95^{\circ}C$)에서 산화시켰다. 산화시간에 따른 산화막의 XPS 분석결과, 작은 양의 $As_{2}O_{3}$ 및 AlAS 그리고 원소형 As들이 2시간동안 산화된 시편에서 발견되었다. 그러나 3시간동안 산화시킨 후에는, 2시간동안 산화시켰을 때 산화막내에 존재하던 소량의 As 산화물과 As 원자들은 발견되지 않았다. 따라서 As-grown된 AlAs/GaAs epi층은 3시간동안 $400^{\circ}C$의 산화온도에서 선택적으로 $Al_{2}O_{3}/GaAs$으로 변화되었다. 그러므로 산화온도 및 산화시간은 AlAs/GaAs 계면에서 결함이 없는 표면을 형성하고 기판쪽으로 산화가 진행되는 것을 멈추기 위해서는 매우 결정적으로 작용하는 것으로 조사되었다.

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