• Journal of the Korean Data and Information Science Society
• /
• v.19 no.2
• /
• pp.609-620
• /
• 2008

There may be several parallel equipments having the same function in a multi-stage manufacturing process, which affect the product quality differently and have significant differences in defect rate. The product quality may depend on what equipments it has been processed as well as what process variable values it has. Applying one model ignoring the presence of different equipments may distort the prediction of defect rate and the identification of important quality variables affecting the defect rate. We propose a procedure for data segmentation when constructing models for predicting the defect rate or for identifying major process variables influencing product quality. The proposed procedure is based on the principal component analysis and the analysis of variance, which demonstrates a better performance in predicting defect rate through a case study with a PDP manufacturing process.

• International Journal of Computer Science & Network Security
• /
• v.22 no.10
• /
• pp.11-16
• /
• 2022

Applying predictive analytics to predict software defects has improved the overall quality and decreased maintenance costs. Many supervised and unsupervised learning algorithms have been used for defect prediction on publicly available datasets. Most of these datasets suffer from an imbalance in the output classes. We study the impact of class imbalance in the defect datasets on the efficiency of the defect prediction model and propose a CPP method for handling imbalances in the dataset. The performance of the methods is evaluated using measures like Matthew's Correlation Coefficient (MCC), Recall, and Accuracy measures. The proposed sampling technique shows significant improvement in the efficiency of the classifier in predicting defects.

• Journal of KIISE:Computing Practices and Letters
• /
• v.15 no.8
• /
• pp.596-600
• /
• 2009

To support an efficient management of software verification and validation activities, many defect prediction models have been proposed based on object oriented metrics. They usually adopt logistic regression analysis, And, they state that the correctness of prediction is about 60${\sim}$70%, We performed a similar experiment with Eclipse 3.3 to check their prediction effectiveness, However, the result shows that correctness is about 40% which is much lower than the original results. We also found that univariate logistic regression analysis produces better results than multivariate logistic regression analysis.

• International Journal of Precision Engineering and Manufacturing
• /
• v.4 no.6
• /
• pp.12-19
• /
• 2003

This paper presents the effect of boundary conditions in various failure pressure models published for the estimation of failure pressure. Furthermore, this approach is extended to the failure prediction with the aid of a failure probability model. The first order Taylor series expansion of the limit state function is used in order to estimate the probability of failure associated with each corrosion defect in buried pipelines for long exposure period with unit of years. A failure probability model based on the von-Mises failure criterion is adapted. The log-normal and standard normal probability functions for varying random variables are adapted. The effects of random variables such as defect depth, pipe diameter, defect length, fluid pressure, corrosion rate, material yield stress, material ultimate tensile strength and pipe thickness on the failure probability of the buried pipelines are systematically investigated for the corrosion pipeline by using an adapted failure probability model and varying failure pressure model.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.10a
• /
• pp.169-172
• /
• 2009

Multiple scale modeling has been applied to predict defect shape change during the wire rod rolling process. The size difference between bloom and defect prevent using usual FEM approaches due to the enormous number of elements required to depict the defect. The newly developed multiple scale model can visualize defect shape changes during the multi stands rolling process. The defect positioned at the top and side of bloom are smoothed out but the one at the middle evolved as folding or remained as crack. This approach can be used for defect control with roll shape design and initial bloom shape.

• KIISE Transactions on Computing Practices
• /
• v.22 no.12
• /
• pp.681-686
• /
• 2016

Software defect prediction is an important factor in efficient project management and success. The severity of the defect usually determines the degree to which the project is affected. However, existing studies focus only on the presence or absence of a defect and not the severity of defect. In this study, we proposed an ensemble model using FCM based on defect severity. The severity of the defect of NASA data set's PC4 was reclassified. To select the input column that affected the severity of the defect, we extracted the important defect factor of the data set using Random Forest (RF). We evaluated the performance of the model by changing the parameters in the 10-fold cross-validation. The evaluation results were as follows. First, defect severities were reclassified from 58, 40, 80 to 30, 20, 128. Second, BRANCH_COUNT was an important input column for the degree of severity in terms of accuracy and node impurities. Third, smaller tree number led to more variables for good performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.31 no.7
• /
• pp.450-454
• /
• 2018

Because of the rapidly changing environment and high uncertainties, the semiconductor industry is in need of appropriate forecasting technology. In particular, both the cost and time in the test process are increasing because the process becomes complicated and there are more factors to consider. In this paper, we propose a prediction model that predicts a final "good" or "bad" on the basis of preconditioning test data generated in the semiconductor test process. The proposed prediction model solves the classification and regression problems that are often dealt with in the semiconductor process and constructs a reliable prediction model. We also implemented a prediction model through various machine learning algorithms. We compared the performance of the prediction models constructed through each algorithm. Actual data of the semiconductor test process was used for accurate prediction model construction and effective test verification.

• Journal of the Korea Society of Computer and Information
• /
• v.20 no.5
• /
• pp.73-81
• /
• 2015

Most of the software fault prediction studies focused on the binary classification model that predicts whether an input entity has faults or not. However the ability to predict entity fault-proneness in various severity categories is more useful because not all faults have the same severity. In this paper, we propose fault prediction models at different severity levels of faults using traditional size and complexity metrics. They are ternary classification models and use four machine learning algorithms for their training. Empirical analysis is performed using two NASA public data sets and a performance measure, accuracy. The evaluation results show that backpropagation neural network model outperforms other models on both data sets, with about 81% and 88% in terms of accuracy score respectively.

• Smart Structures and Systems
• /
• v.13 no.6
• /
• pp.901-925
• /
• 2014

The reliability of a Bridge management System depends on the quality of visual inspection and the reliable estimation of bridge condition rating. However, the current practices of visual inspection have been identified with several limitations, such as: they are time-consuming, provide incomplete information, and their reliance on inspectors' experience. To overcome such limitations, this paper presents an approach of automating the prediction of condition rating for bridges based on digital image analysis. The proposed methodology encompasses image acquisition, development of 3D visualization model, image processing, and condition rating model. Under this method, scaling defect in concrete bridge components is considered as a candidate defect and the guidelines in the Ontario Structure Inspection Manual (OSIM) have been adopted for developing and testing the proposed method. The automated algorithms for scaling depth prediction and mapping of condition ratings are based on training of back propagation neural networks. The result of developed models showed better prediction capability of condition rating over the existing methods such as, Naïve Bayes Classifiers and Bagged Decision Tree.

• Journal of Korean Institute of Industrial Engineers
• /
• v.40 no.3
• /
• pp.257-266
• /
• 2014

The semiconductor manufacturing industry is managed by a number of parameters from the FAB which is the initial step of production to package test which is the final step of production. Various methods for prediction for the quality and yield are required to reduce the production costs caused by a complicated manufacturing process. In order to increase the accuracy of quality prediction, we have to extract the significant features from the large amount of data. In this study, we propose the method for extracting feature from the cell level data of probe test process using OPTICS which is one of the density-based clustering to improve the prediction accuracy of the quality of the assembled chips that will be placed in a package test. Two features extracted by using OPTICS are used as input variables of quality prediction model because of having position information of the cell defect. The package test progress for chips classified to the correct quality grade by performing the improved prediction method is expected to bring the effect of reducing production costs.