• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2001.10a
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• pp.587-591
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• 2001

This paper deals with inspect algorithm using visual system. One of the major problems that arise during polymer production is the estimation of the noise of the color product.(bad pallets) An erroneous output can cause a lot of losses (production and financial losses). Therefore new methods for real-time inspection of the noise are demanded. For this reason, we have presented a development of vision system algorithm for the defect inspection of PE color pallets. First of all, in order to detect the edge of object, the differential filter is used. And we apply to the labelling algorithm for feature extraction. This algorithm is designed for the defect inspection of pallets. The labelling algorithm permits to separate all of the connected components appearing on the pallets. Labelling the connected regions of a image is a fundamental computation in image analysis and machine vision, with a large number of application. Also, we suggested vision processing program in window environment. Simulations and experimental results demonstrate the performance of the proposal algorithm.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.3
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• pp.18-23
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• 2006

The formation degree of sustain (ITO pattern) determines the quality of a PDP (Plasma Display Panel). Thus, in the present study, we attempt to detect 100% of the defects that are larger than $30{\mu}m$. Currently, the inspection method in the PDP manufacturing process is dependent upon the naked eye or a microscope in off-line mode. In this study, a prototype inspection system for PDP ITO patterned glass is developed. The developed system, which is based on a line-scan mechanism, obtains information on the defects and sorts the defects by type automatically. The developed inspection system adopts a multi-vision method using slit-beam formation for minimum inspection time and the detection algorithm is embodied in the detection ability. Characteristic defects such as pin holes, substances, and protrusions are extracted using the blob analysis method. Defects such as open, short, spots and others are distinguished by the line type inspection algorithm. It was experimentally verified that the developed inspection system can detect defects with reliability of up to 95% in about 60 seconds for the 42-inch PDP panel.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.10
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• pp.982-987
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• 2015

The inspection machine in SMT (Surface Mount Technology) line detects the assembly defects such as missing, misalignment, loosing, or tombstone. We propose a new method to classify the defect types of chip components by processing the image of PCB. Two original images are obtained from horizontal lighting and vertical lighting. The image of the component is divided into two soldering regions and one packaging region. The features are extracted by appling the PCA (Principle Component Analysis) to each region. The MLP (Multilayer Perceptron) and SVM (Support Vector Machine) are then used to classify the defect types by learning. The experimental results are presented to show the usefulness of the proposed method.

• Journal of Korean Society of Water and Wastewater
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• v.27 no.6
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• pp.731-741
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• 2013

CCTV inspection method has been used in Korea for more than 20 years, but there is no proper assessment system for sewer failure severity that considers the domestic circumstances. This study classified the defects caused by the overburden load of reinforced concrete sewer pipes depending on severity and developed defect code by analyzing the domestic CCTV inspection videos. The defect score was assigned to each defect code, and it was classified into 5 grades for the decision-making of repair and rehabilitation. The result of this study is expected to be useful for domestic CCTV inspectors to assess the sewer condition and helpful for managers to make a decision of repair and rehabilitation.

• Proceedings of the KIEE Conference
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• 2002.07d
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• pp.2521-2524
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• 2002

In this paper, We propose an Image processing algorithm for a paper-cup inner defect inspection. First, we devide a cup image to four sections considering the characteristic of a cup and filter noises limit by using the flood-fill algorithm and median filter. Second, to obtain the clearer inspection result of the edge point inner cup, We apply the sharpening convolution filer to the objected inspect the edge points by using the LOG edge detector. Third, executing sub-pixel operation with the orignal image, we find the defect parts in the cup. Finally, denoting the inspected defect parts as rectangular, we recompose the images of the defected ones.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.2
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• pp.171-176
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• 2013

X-ray cross-sectional image-based inspection technique is one of the most useful methods to inspect the brazing joints of heat exchanger. Through X-ray cross-sectional image acquisition, image processing, and defect inspection, the defects of brazing joints can be detected. This paper presents a method to judge the type of detected defects automatically, and to display them three-dimensionally. The defect type is classified as unconnected defect, void, and so on, based on location, size, and shape information of defect. Three-dimensional display which is realized using OpenGL (Open Graphics Library) will be helpful to understand the overall situation including location, size, shape of the defects in a test object.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.3
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• pp.256-261
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• 2013

In the steel manufacturing area, researches for defect inspection receive a big attention for quality control. This paper proposes an algorithm to detect a scratch defect on steel billets. This algorithm takes ROIs (Regions of Interest), and extracts 11 features which represent properties of defect on a ROI. SVM (Support Vector Machine) is used to classify defect and normal ROIs. The algorithm classifies a frame image of a Billet as a defect image if there is one or more defect ROIs. In the experiments, the proposed algorithm had reliable classifying accuracy.

• IE interfaces
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• v.21 no.2
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• pp.151-160
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• 2008

Defect size distribution is a probability density function for the defects that occur on wafers or glasses during semiconductor/LCD fabrication. It is one of the most important information to estimate manufacturing yield using well-known statistical estimation methods. The defects are detected by automatic optical inspection (AOI) facilities. However, the data that is provided from AOI is not accurate due to resolution of AOI and its defect detection mechanism. It causes distortion of defect size distribution and results in wrong estimation of the manufacturing yield. In this paper, I suggest a size conversion method and a maximum likelihood estimator to overcome the vague defect size information of AOI. The methods are verified by the Monte Carlo simulation that is constructed as similar as real situation.

• International conference on construction engineering and project management
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• 2013.01a
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• pp.7-13
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• 2013

Recently, defect management have been considered as one of the major issues for more large-sized and complicated in domestic construction industry. However, the defect management have not been performed systematically because of special manpower, excessive amount of documents, 2D based inspection work, unclear traditional checklists, complicated work process and difficulty in communicating construction information. Therefore, the construction field manager could not performed the quality inspection and defect management work on time as well as the reliability of recorded quality and defect factors was decreased. The primary objective of this study is develop a Construction Defect Management Application CDMA) using a mobile (smartphone). The application can be sharing a huge information and communication technology based on RFID (Radio-Frequency Identification), BIM (Building Information Modeling) which enables field mangers to efficiently gather the information of defection in construction on-site.