• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• Journal of information and communication convergence engineering
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• v.10 no.1
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• pp.85-90
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• 2012

A 40-MS/sec 10-bit pipelined analog to digital converter (ADC) with a 1.2 Vpp differential input signal is proposed. The implemented pipelined ADC consists of eight stages of 1.5 bit/stage, one stage of 2 bit/stage, a digital error correction block, band-gap reference circuit & reference driver, and clock generator. The 1.5 bit/stage consists of a sub-ADC, digital to analog (DAC), and gain stage, and the 2.0 bit/stage consists of only a 2-bit sub-ADC. A bootstrapped switch with a constant resistance is proposed to improve the linearity of the input switch. It reduces the maximum VGS variation of the conventional bootstrapped switch by 67%. The proposed bootstrapped switch is used in the first 1.5 bit/stage instead of a sample-hold amplifier (SHA). This results in the reduction of the hardware and power consumption. It also increases the input bandwidth and dynamic performance. A reference voltage for the ADC is driven by using an on-chip reference driver without an external reference. A digital error correction with a redundancy is also used to compensate for analog noise such as an input offset voltage of a comparator and a gain error of a gain stage. The proposed pipelined ADC is implemented by using a 0.18-${\mu}m$ 1- poly 5-metal CMOS process with a 1.8 V supply. The total area including a power decoupling capacitor and the power consumption are 0.95 $mm^2$ and 51.5 mW, respectively. The signal-to-noise and distortion ratio (SNDR) is 56.15 dB at the Nyquist frequency, resulting in an effective number of bits (ENOB) of 9.03 bits.

• Journal of Power Electronics
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• v.16 no.3
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• pp.1110-1121
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• 2016

The mathematical model of a three phase PWM converter under the stationary αβ reference frame is deduced and constructed based on a Proportional-Resonant (PR) regulator, which can replace trigonometric function calculation, Park transformation, real-time detection of a Phase Locked Loop and feed-forward decoupling with the proposed accurate calculation of the inductance voltage vector. To avoid the parallel resonance of the LCL topology, the active damping method of the proportional capacitor-current feedback is employed. As to current vector error elimination, an optimized PR controller of the inner current loop is proposed with the zero-pole matching (ZPM) and cancellation method to configure the regulator. The impacts on system's characteristics and stability margin caused by the PR controller and control parameter variations in the inner-current loop are analyzed, and the correlations among active damping feedback coefficient, sampling and transport delay, and system robustness have been established. An equivalent model of the inner current loop is studied via the pole-zero locus along with the pole placement method and frequency response characteristics. Then, the parameter values of the control system are chosen according to their decisive roles and performance indicators. Finally, simulation and experimental results obtained while adopting the proposed method illustrated its feasibility and effectiveness, and the inner current loop achieved zero static error tracking with a good dynamic response and steady-state performance.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.1
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• pp.63-72
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• 2020

As the design complexity and performances are increased in satellite electronic board, noise related problems are also increased. To minimize the noise issues, various design improvements are performed by power integrity and signal integrity analysis in this research. Static power and dynamic power design are reviewed and improved by DC IR drop and power impedance analysis. Signal integrity design is reviewed and improved by time domain signal wave analysis and PCB(Printed Circuit Board) design modifications. And also power planes resonance modes are checked and mitigation measures are verified by simulation. Finally, it is checked that radiated noise is reduced after design improvements by EMC(Electro Magnetic Compatibility) RE(Radiated Emission) measurement results.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.1
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• pp.53-60
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• 2004

This work describes a l0b 150 MSample/s CMOS pipelined A/D converter (ADC) based on advanced bootsuapping techniques for higher input bandwidth than a sampling rate. The proposed ADC adopts a typical multi-step pipelined architecture, employs the merged-capacitor switching technique which improves sampling rate and resolution reducing by $50\%$ the number of unit capacitors used in the multiplying digital-to-analog converter. On-chip current and voltage references for high-speed driving capability of R & C loads and on-chip decimator circuits for high-speed testability are implemented with on-chip decoupling capacitors. The proposed AU is fabricated in a 0.18 um 1P6M CMOS technology. The measured differential and integral nonlinearities are within $-0.56{\~}+0.69$ LSB and $-1.50{\~}+0.68$ LSB, respectively. The prototype ADC shows the signal-to-noise-and-distortion ratio (SNDR) of 52 dB at 150 MSample/s. The active chip area is 2.2 mm2 (= 1.4 mm ${\times}$ 1.6 mm) and the chip consumes 123 mW at 150 MSample/s.