• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1865-1868
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• 2003

This paper provides a new method for hybrid machining, particularly suited to micro fabrication applications such as micro point, micro line, micro structure, micro partition and so on. Developed micro fabrication process by electrical discharge machining (EDM) and electrical discharge deposition (EDD) with metal powder (Ti, Fe) has been studied to build TiC or FeC structure. Titanium powder or iron powder is supplied from working fluid (kerosene or de-ionized water with powder) and adheres on a workpiece by the heat and electric power caused by the electrical discharge. The use of a tool electrode is expected to keep powder concentration high in the gap between a workpiece and a tool electrode and to accrete powder material on the workpiece. The deposition is tried under various electrical conditions (workpiece. tool electrode, working fluid, discharge current, voltage and powder etc.). On the other hand. using electrical discharge machining (EDM) with the same tool electrode, it can be used as a removal process (cutting) by electro erosion at the same time. Therefore. this new method can do a hybrid machining to build up and down a structure with the workpiece.

• Journal of ILASS-Korea
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• v.16 no.2
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• pp.104-109
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• 2011

The present study investigated experimentally the spreading characteristics of a single liquid impinging on the inclined micro-textured aluminum (Al 6061) surfaces manufactured by using a micro computerized numerical control (${\mu}$-CNC) milling machine. The textured surfaces were composed of patterned micro-holes (diameter of $125\;{\mu}m$ and depth of $125\;{\mu}m$). In our experiment, the de-ionized (DI) water droplet of $4.3\;{\mu}l$ was impinged normally on the non-textured and textured surfaces at two different Weber numbers, and the droplet impinged on the inclined surfaces with different angles. A high speed camera was used to capture sequential digital images for measurement of the maximum spreading distance. It was found that for the textured surface, the measured apparent equilibrium contact angle (ECA) increased up to $105.8^{\circ}$, higher than the measured ECA of $87.6^{\circ}$ for the non-textured (bare) surface. In addition, it is conjectured that the spreading distance decreased because of a liquid penetration during droplet spreading through the holes, the increase in hydrophobicity, and viscous dissipation during impact process.

• Progress in Superconductivity
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• v.7 no.1
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• pp.52-57
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• 2005

[ $YBa_{2}Cu_{3}O_y$ ] superconducting films were prepared on $LaAlO_3$(100) single crystal substrate by spray pyrolysis method. The precursor solution was prepared by dissolving nitrate powders in de-ionized water. Both of ultrasonic and concentric nebulizers were used in order to generate fine droplets of precursor solution. C-axis oriented films were obtained at deposition temperature of $750\~850^{\circ}C$ and working pressure of 100 Torr and 500 Torr. In case of ultrasonic nebulizer, films showed rough and porous surface morphology due to formation of enormous droplets, while smooth and dense films were obtained for concentric nebulizer. A transport $J_c$ value of $0.43\;MA/cm^2$ at 77 K and self field was achieved on $LaAlO_3$(100) single crystal substrate.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.35-40
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• 2000

Teflon-like fluorocarbon thin film was deposited on various substrates by vapor deposition using PFDA (perfluorodecanoic acid). The fluorocarbon films were characterized by static/dynamic contact angle analysis, VASE (Variable-angle Spectroscopic Ellipsometry) and AFM/LFM (Atomic/Lateral Force Microscopy). Based on Lewis Acid/Base theory, the surface energy ($S_{E}$) of the films was calculated by the static contact angle measurement. The work of adhesion (WA) between de-ionized water and substrates was calculated by using the static contact data. The fluorocarbon films showed very similar values of the surface energy and work of adhesion to Teflon. All films showed larger hysteresis than that of Teflon. The roughness and relative friction force of films were measured by AFM and LFM. Even though the small reduction of surface roughness was found on film on $SiO_2$surface, the large reduction of relative friction farce was observed on all films. Especially the relative friction force on TEOS was decreased a quarter after film deposition. LFM images showed the formation of "strand-like"spheres on films that might be the reason far the large contact angle hysteresis.

• Journal of the Korean Ceramic Society
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• v.46 no.6
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• pp.685-688
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• 2009

Surface Texturing is very important process for high cell efficiency in crystalline silicon solar cell. Anisotropic texturing with an alkali etchant was known not to be able to produce uniform surface morphology in multi-crystalline silicon (mc-Si), because of its different etching rate with random crystal orientation. In order to reduce surface reflectance of mc-Si wafer, the general etching tendency was studied with HF/HN$O_3$/De-ionized Water acidic solution. And the surface structures of textured mc-Si in various HF/HN$O_3$ ratios were compared. The surface morphology and reflectance of textured silicon wafers were measured by FE-SEM and UVvisible spectrophotometer, respectively. We obtained average reflectance of $16{\sim}19$% for wavelength between 400 nm and 900 nm depending on different etching conditions.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.747-750
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• 2007

This study proposes that chlorine residue after metal etch as the source of metal corrosion, and charges should be removed by optimizing etch, PR strip and cleaning condition. Charges distributed along the metal line acts as a source of tungsten (W) plug corrosion when associated with following cleaning solution. In cleaning process after metal etch and PR strip, chemical selection is significantly important in terms of metal corrosion. Optimal corrosion preventive PH, no metal attack (choice of optimal inhibitants), high by product removal efficiency and optimal de ionized water treatment condition is critical to the metal corrosion prevention.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.438-438
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• 2012

은(Ag) 또는 금(Au) 입자를 촉매로 이용하여 습식식각을 통해 선택적으로 짧은 시간동안 단결정 실리콘 웨이퍼의 표면을 텍스쳐링하여 반사방지막 특성을 효과적으로 얻을 수 있다. 일반적으로 금속입자는 주로 금속 이온이 포함된 용액이나, 전기증착법을 통해서 실리콘 웨이퍼 표면에 형성시켰지만, 금속입자의 크기와 분포를 조절하기 어려웠다. 하지만, 최근 진공장비를 이용하여 열증발증착법(thermal evaporation)과 급속열처리법(rapid thermal annealing)을 통해서 금속입자를 대면적으로 크기와 분포를 균일하게 조절할 수 있다. 이러한 현상은 열적 비젖음(thermal dewetting) 현상에 의해 실리콘 표면위에 증착된 금속 박막으로부터 나노입자로 형성할 수 있다. 본 연구에서는 실리콘 (100)기판위에 다양한 크기의 은 또는 금 나노입자를 형성시켜 식각용액에 짧은 시간동안 담그어 식각하여, 텍스쳐링 효과와 반사방지(antireflection) 특성을 분석하였다. 실험을 위해 각각 은 또는 금 박막을 열증발증착법을 이용하여 ~3-8 nm의 두께로 형성시켰으며, 급속가열장치를 이용하여 $500^{\circ}C$에서 5분 동안 열처리하였다. 그리고 탈이온수(de-ionized water)에 불화수소와 과산화수소가 혼합된 식각용액에 1-5분 동안 습식식각을 하였다. 각각의 텍스쳐링 된 샘플의 식각의 상태와 깊이를 관찰하기 위해 field emission scanning electron microscopy (FE-SEM)을 이용하여 측정하였으며, UV-vis-NIR spectrophotometer를 이용하여 300 nm에서 1,200 nm의 반사특성을 분석하였다. 또한 RCWA (rigorous coupled wave analysis) 시뮬레이션을 이용하여 텍스쳐링 된 기하학적구조에 대하여 반사방지막 특성을 이론적으로 분석하였다.

• Journal of Powder Materials
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• v.23 no.6
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• pp.409-413
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• 2016

Electrical wire explosion in liquid media is a promising method for producing metallic nanopowders. It is possible to obtain high-purity metallic nanoparticles and uniform-sized nanopowder with excellent dispersion stability using this electrical wire explosion method. In this study, Ni-Fe alloy nanopowders with core-shell structures are fabricated via the electrical explosion of Ni-Fe alloy wires 0.1 mm in diameter and 20 mm in length in de-ionized water. The size and shape of the powders are investigated by field-emission scanning electron microscopy, transmission electron microscopy, and laser particle size analysis. Phase analysis and grain size determination are conducted by X-ray diffraction. The result indicate that a core-shell structured Ni-Fe nanopowder is synthesized with an average particle size of approximately 28 nm, and nanosized Ni core particles are encapsulated by an Fe nanolayer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.541-541
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• 2008

반도체 소자가 차세대 초미세 공정 기술 도입의 가속화를 통해 고속화 및 고집적화 되어 감에 따라 나노(Nano) 크기의 회로 선폭 미세화를 극복하고자 최적의 CMP (Chemical Mechanical Polishing) 공정이 요구되어지고 있다. 이처럼 CMP 공정이 반도체 제조 공정에 적용됨으로써 공정 마진 확보에 진일보 하였으나 CMP 장비의 공정 조건, 슬러리의 종류, 연마패드의 종류 등에 의해 CMP 성능이 결정된다. 특히 슬러리는 연마 공정의 성능에 중요한 영향을 미치는 요인이다. 고가의 슬러리가 차지하는 비중이 40% 이상을 넘고 있어 슬러리 원액의 소모량을 줄이기 위한 연구들이 현재 활발히 진행되고 있다. 본 연구에서는 새로운 연마제의 특성을 알아보기 위해 탈이온수(De-ionized water; DIW) 에 $CeO_2$, 연마제를 첨가한 후 분산시간에 따른 연마 특성과 AFM, EDX, XRD, TEM분석을 통해 그 가능성을 알아보았다.

• Journal of the Korean Society of Propulsion Engineers
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• v.14 no.2
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• pp.63-70
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• 2010

A construction process of hydrogen peroxide supply system was investigated to use hydrogen peroxide as an oxidizer of bi-propellant liquid rocket engine. To use hydrogen peroxide as a rocket propellant, it has to be in high concentration over 90%. It is very important to make the supply system free of pollutants, because highly concentrated hydrogen peroxide has a characteristic of hypersensitive reaction to pollutants such as dust and oil sludge. We suggested the cleaning and passivation process of main components to minimize pollutants of the supply system. In conclusion, we verified stability of the constructed supply system by leak test and hot test.