• Title/Summary/Keyword: Daisy Chain

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Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders (Sn3.5Ag와 Sn0.7Cu 무연솔더에 대한 고온 진동 신뢰성 연구)

  • Ko, Yong-Ho;Kim, Taek-Soo;Lee, Young-Kyu;Yoo, Sehoo;Lee, Chang-Woo
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.3
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    • pp.31-36
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    • 2012
  • In this study, the complex vibration reliability of Sn-3.5Ag and Sn-0.7Cu having a high melting temperature was investigated. For manufacturing of BGA test samples, Sn-3.5Ag and Sn-0.7Cu balls were joined on BGA chips finished by ENIG and the chips were mounted on PCB finished OSP by using reflow process. For measuring of resistance change during complex vibration test, daisy chain was formed in the test board. From the results of resistance change and shear strength change, the reliability of two solder balls was compared and evaluated. During complex vibration for 120 hours, Sn-0.7Cu solder was more stable than Sn-3.5Ag solder in complex vibration test.

Vibration Fracture and Microstructural Behavior with respect to Pb-free Solders (Lead-free Solder의 진동특성 평가)

  • Jin, Sang-Hun;Kang, Nam-Hyun;Lee, Chang-Woo;Yoo, Se-Hoon;Hong, Won-Sik
    • Proceedings of the KWS Conference
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    • 2010.05a
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    • pp.76-76
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    • 2010
  • 무연솔더 재료를 자동차 전장품에 적용하기 위해서는 고온환경에 대한 내구성 및 진동 인자에 대한 영향을 고려해야한다. 특히, ELV(End of Life Vehicles) 지침이 개정됨에 따라 고온용 무연솔더 재료에 대한 재평가가 반드시 필요한 시점이다. 이에 대해 본연구에서는 현재 상용화 된 Pb-free솔더의 재료들 중 총 4종의 Solder을 선정하여 자동차 환경에 부합하는 진동조건하에서 시험해보았다. 그리고 미세조직의 특성, 접합부 형성시의 기계적 강도 및 접합부의 신뢰성을 평가하여 보았다. 각각의 조성에 대한 CHIP type과 QFP type의 실장부품을 준비하였으며, 각각의 조성별로 솔더 페이스트로 Daisy Chain PCB에 접합하여 조성에 따른 비교 데이터를 구축할 수 있었다. 리플로우 공정후 초기의 미세조직 및 전당강도, 저항값을 측정하여 진동시험에 따른 데이터와 비교하였다. 주파수는 10Hz~1,000Hz였으며, 진동가속도는 $29.4m/s^2$, 20시간의 랜덤진동이 적용되는 동안 챔버내의 온도는 상온으로 유지되었다. 진동시험과 이에 따른 저항측정을 통하여 진동 주파수와 시간에 따른 실장 부품이 받는 진동 영향과 실시간 저항값을 측정하였으며, 이때의 미세조직 비교를 통해 진동특성을 평가하였다. 진동 주파수에 따른 저항값의 변화가 있었으며, 진동전후 전단강도에도 영향을 주었다. QFP type에서는 SAC105가 진동에 가장 취약하였으며, CHIP type에서는 SACX0307이 진동에 가장 취약하였다.

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Influence of complex environment test on lead-free solder joint reliability (온도변화에 따른 진동의 무연솔더 접합부 신뢰성에 미치는 영향)

  • Sa, Yoon-Ki;Yoo, Se-Hoon;Kim, Yeong-K.;Lee, Chang-Woo
    • Proceedings of the KWS Conference
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    • 2009.11a
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    • pp.77-77
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    • 2009
  • ELV(; End of Life Vehicles)를 비롯한 최근 환경 동향은 자동차 전장 모듈에 대하여 다양한 무연 솔더 적용을 요구하고 있다. 특히 자동차 엔진룸과 트랜스미션은 가동 중 고온 및 진동의 지속적인 영향을 받기 때문에 이와 유사한 환경에서의 신뢰성 연구가 필요한 시점이다. 이에 본 연구에서는 Sn3.5Ag, Sn0.7Cu, Sn5.0Sb 솔더 조성에 대하여 복합환경 조건하에서 접합부 신뢰성을 평가하였다. 복합환경을 구현하기 위하여 $-40{\sim}150^{\circ}C$ 범위의 온도 사이클과 랜덤 진동을 동시에 인가하였으며, 진동 가속도 3G, 진동주파수는 10~1000Hz 로 설정하여 자동차 환경을 충족하였다. 복합시험의 1 cycle 은 20 시간이며, 총 120 시간의 시험 동안 진동의 영향 및 진동과 고온이 동시에 작용하였을 경우의 영향에 대해 비교하였다. 테스트 모듈 제작을 위해 450 um 의 솔더볼이 적용되었으며, 각 조성의 솔더볼을 이용하여 BGA test chip 제작하였고, 제작된 BGA test chip 은 다시 daisy chain PCB 위에 실장 및 리플로우 공정을 통해 접합되었다. 테스트 동안 In-situ 로 저항의 변화를 관찰하여 파단의 유무를 판단하였고 전자주사현미경을 통해 파괴 기전을 평가하였다. 복합시험 시간에 따른 전단강도를 측정하였으며, 각 조성에 대하여 상이한 전단강도 변화를 관찰하였다. 계면 IMC 형상은 전단강도 변화에 영향을 주었으며, 특히 높은 온도가 IMC 성장을 촉진시켜 전단강도 감소에 영향을 주었다. 본 복합환경 시험 조건에서는 Sn0.7Cu 가 가장 안정적이었으며, 파단면을 관찰한 결과 연성파괴 모드가 관찰되었다.

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Stretchable Deformation-Resistance Characteristics of the Stiffness-Gradient Stretchable Electronic Packages Based on PDMS (PDMS 기반 강성도 경사형 신축 전자패키지의 신축변형-저항 특성)

  • Park, Dae Ung;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.47-53
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    • 2019
  • Stiffness-gradient stretchable electronic packages of the soft PDMS/hard PDMS/PTFE structure were processed using the polydimethylsiloxane (PDMS) as the base substrate and the more stiff polytetrafluoroethylene (PTFE) as the island substrate, and their stretchable deformation-resistance characteristics were characterized. The flip-chip joints, formed by bonding the chip bumps of 50 ㎛-diameter onto the PDMS/PTFE substrate pads, exhibited an average contact resistance of 96 mΩ. When the stretchable package of the soft PDMS/hard PDMS/PTFE structure was deformed to 30% elongation, the strain on the PTFE was restrained to 1%, resulting in a negligible resistance increase of 1% in the daisy-chain circuit formed on the PTFE island substrate. The circuit resistance increased for 1.7% after 2,500 cycles of 0~30% stretchable deformation.

Power Distribution Optimization of Multi-stack Fuel Cell Systems for Improving the Efficiency of Residential Fuel Cell (주택용 연료전지 효율 향상을 위한 다중 스택 연료전지 시스템의 전력 분배 최적화)

  • TAESEONG KANG;SEONGHYEON HAM;HWANYEONG OH;YOON-YOUNG CHOI;MINJIN KIM
    • Journal of Hydrogen and New Energy
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    • v.34 no.4
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    • pp.358-368
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    • 2023
  • The fuel cell market is expected to grow rapidly. Therefore, it is necessary to scale up fuel cells for buildings, power generation, and ships. A multi-stack system can be an effective way to expand the capacity of a fuel cell. Multi-stack fuel cell systems are better than single-stack systems in terms of efficiency, reliability, durability and maintenance. In this research, we developed a residential fuel cell stack and system model that generates electricity using the fuel cell-photovoltaic hybrid system. The efficiency and hydrogen consumption of the fuel cell system were calculated according to the three proposed power distribution methods (equivalent, Daisy-chain, and optimal method). As a result, the optimal power distribution method increases the efficiency of the fuel cell system and reduces hydrogen consumption. The more frequently the multi-stack fuel cell system is exposed to lower power levels, the greater the effectiveness of the optimal power distribution method.

A Study on Lightweight Block Cryptographic Algorithm Applicable to IoT Environment (IoT 환경에 적용 가능한 경량화 블록 암호알고리즘에 관한 연구)

  • Lee, Seon-Keun
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.3
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    • pp.1-7
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    • 2018
  • The IoT environment provides an infinite variety of services using many different devices and networks. The development of the IoT environment is directly proportional to the level of security that can be provided. In some ways, lightweight cryptography is suitable for IoT environments, because it provides security, higher throughput, low power consumption and compactness. However, it has the limitation that it must form a new cryptosystem and be used within a limited resource range. Therefore, it is not the best solution for the IoT environment that requires diversification. Therefore, in order to overcome these disadvantages, this paper proposes a method suitable for the IoT environment, while using the existing block cipher algorithm, viz. the lightweight cipher algorithm, and keeping the existing system (viz. the sensing part and the server) almost unchanged. The proposed BCL architecture can perform encryption for various sensor devices in existing wire/wireless USNs (using) lightweight encryption. The proposed BCL architecture includes a pre/post-processing part in the existing block cipher algorithm, which allows various scattered devices to operate in a daisy chain network environment. This characteristic is optimal for the information security of distributed sensor systems and does not affect the neighboring network environment, even if hacking and cracking occur. Therefore, the BCL architecture proposed in the IoT environment can provide an optimal solution for the diversified IoT environment, because the existing block cryptographic algorithm, viz. the lightweight cryptographic algorithm, can be used.

Analysis of Network Topology for Distributed Control System in Railroad Trains (철도차량용 분산형 제어시스템을 위한 네트워크 토폴로지 분석)

  • Hwang, Hwanwoong;Kim, Jungtai;Lee, Kang-Won;Yun, Ji-Hoon
    • Journal of the Institute of Electronics and Information Engineers
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    • v.52 no.10
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    • pp.21-29
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    • 2015
  • For higher reliability against component failures in railroad trains with many electronic sensors and actuators, a distributed control system with which all electronic components are connected via a network is being considered. This paper compares and analyzes various topologies of Ethernet network for a railroad train in the aspects of (1) failure recovery, (2) the number of ports per device, (3) the number of cable connections between vehicles, and (4) performance. Especially, the unique characteristic of a train system that the number of vehicles changes is considered through analysis. Various combinations of in- and inter-vehicle topologies are considered. In addition, we introduce a hybrid of star and daisy-chain topology for inter-vehicle connection when the maximum number of inter-vehicle connections is limited to reduce possible failures of inter-vehicle connections. Simulation results show performance comparison between different topology combinations; the hybrid topology is shown to enhance delay performance even with a highly limited number of inter-vehicle connections.

Improved drop impact reliability of Sn-Ag-Cu solder joint using Cu-Zn solder wetting layer (Cu-Zn 합금 젖음층을 이용한 Sn-Ag-Cu 솔더 접합부의 낙하 충격 신뢰성 향상 연구)

  • Kim, Yeong-Min;Kim, Yeong-Ho
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.35.2-35.2
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    • 2009
  • 최근 본 연구실에서 무연 솔더를 위한 새로운 Cu-Zn 합금 젖음층을 개발하였다. 전해도금을 통하여 Cu-Zn 합금층을 형성한 뒤 그 위에 Sn-4.0wt% Ag-0.5wt% Cu (SAC 405) 솔더를 리플로 솔더링을 통해 솔더접합부를 형성하였으며 계면에서 생성된 금속간 화합물의 형성 및 성장 거동을 연구하였다. SAC/Cu 시스템의 경우, $150^{\circ}C$에서 시효 처리를 실시하는 동안 솔더와 도금된 Cu 계면에서 $Cu_6Sn_5$ 상과 미세한 공공이 형성된 $Cu_3Sn$ 상이 발견되었다. 반면에 SAC/Cu-Zn 시스템에서는 계면에서 $Cu_6Sn_5$ 상만이 형성되었다. 또한 큰 판상형의 $Ag_3Sn$ 상이 SAC/Cu 시스템에 비해 현저하게 억제되었다. SAC/Cu-Zn 계면에서의 금속간 화합물의 성장 속도가 SAC/Cu 계면에서 형성된 금속간 화합물의 성장 속도보다 느리게 나타났다. Cu-Zn 젖음층의 Zn가 솔더와 Cu-Zn 층 사이에서 Cu와 Sn 원자의 상호 확산을 방해하기 때문이다. 본 연구에서는 Cu와 Cu-Zn 층을 이용한 솔더 접합부의 낙하 충격 신뢰성을 연구하였다. 낙하 충격 시험 시편은 두 개의 인쇄 회로 기판을 SAC 405 솔더볼을 이용하여 리플로를 통해 상호연결 하여 제조되었다. 이 때, 각각의 인쇄 회로 기판의 패드에는 Cu 층과 Cu-Zn층을 전해도금을 통하여 각각 $10{\mu}m$두께의 젖음층을 형성하였다. 낙하 시험 시편을 제조한 뒤, 시효 처리에 대한 낙하 저항 신뢰성의 특성을 연구하기 위해 250, 500 시간동안 시효처리를 한 후 각 조건에서 계면에 형성된 금속간 화합물의 성장 거동을 관찰하였으며, 낙하 충격 시험을 실시하였다. 낙하 시험은 daisy chain으로 연결된 시편의 저항이 100 Ohm 이상 측정되었을 때 중단되도록 하였다. Cu-Zn/SAC/Cu-Zn 시편의 경우 초기 리플로를 하였을 때 불량이 발생하는 평균 낙하 수는 350이며, Cu/SAC/Cu 시편의 평균 낙하수는 200 미만으로 나타났다. Cu/SAC/Cu 시편의 경우, 시효처리 시간이 증가함에 따라 평균 낙하수는 큰 폭으로 감소하였지만, Cu-Zn/SAC/Cu-Zn 시편은 불량이 발생하는 평균 낙하수의 감소폭이 보다 완만하게 나타났다. Cu 층에 Zn를 첨가함으로써 솔더와 젖음층 사이에서 형성된 금속간 화합물의 성장 및 미세 공공의 형성이 억제되었고, 솔더 접합부의 과냉을 감소시킴으로써 큰 판상형의 $Ag_3Sn$ 상의 형성을 억제함으로써 Cu-Zn/SAC/Cu-Zn 솔더 접합부에서 Cu/SAC/Cu 솔더 접합부보다 낙하 충격에 대한 저항성 및 신뢰성이 향상되었다. 이는 무연 솔더에 Zn를 첨가하여 낙하 충격 신뢰성을 향상시킨 것과 동일한 효과를 나타냈음을 확인하였다. 본 연구는 한국 과학 기술 재단의 전자패키지 재료 연구 센터(CEPM)와 지식 경제부의 부품 소재 기술 개발 사업의 지원을 받아 수행되었습니다.

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Wedelolactone Promotes the Chondrogenic Differentiation of Mesenchymal Stem Cells by Suppressing EZH2

  • Wei Qin;Lin Yang;Xiaotong Chen;Shanyu Ye;Aijun Liu;Dongfeng Chen;Kunhua Hu
    • International Journal of Stem Cells
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    • v.16 no.3
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    • pp.326-341
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    • 2023
  • Background and Objectives: Osteoarthritis (OA) is a degenerative disease that leads to the progressive destruction of articular cartilage. Current clinical therapeutic strategies are moderately effective at relieving OA-associated pain but cannot induce chondrocyte differentiation or achieve cartilage regeneration. We investigated the ability of wedelolactone, a biologically active natural product that occurs in Eclipta alba (false daisy), to promote chondrogenic differentiation. Methods and Results: Real-time reverse transcription-polymerase chain reaction, immunohistochemical staining, and immunofluorescence staining assays were used to evaluate the effects of wedelolactone on the chondrogenic differentiation of mesenchymal stem cells (MSCs). RNA sequencing, microRNA (miRNA) sequencing, and isobaric tags for relative and absolute quantitation analyses were performed to explore the mechanism by which wedelolactone promotes the chondrogenic differentiation of MSCs. We found that wedelolactone facilitates the chondrogenic differentiation of human induced pluripotent stem cell-derived MSCs and rat bone-marrow MSCs. Moreover, the forkhead box O (FOXO) signaling pathway was upregulated by wedelolactone during chondrogenic differentiation, and a FOXO1 inhibitor attenuated the effect of wedelolactone on chondrocyte differentiation. We determined that wedelolactone reduces enhancer of zeste homolog 2 (EZH2)-mediated histone H3 lysine 27 trimethylation of the promoter region of FOXO1 to upregulate its transcription. Additionally, we found that wedelolactone represses miR-1271-5p expression, and that miR-1271-5p post-transcriptionally suppresses the expression of FOXO1 that is dependent on the binding of miR-1271-5p to the FOXO1 3'-untranscribed region. Conclusions: These results indicate that wedelolactone suppresses the activity of EZH2 to facilitate the chondrogenic differentiation of MSCs by activating the FOXO1 signaling pathway. Wedelolactone may therefore improve cartilage regeneration in diseases characterized by inflammatory tissue destruction, such as OA.

Performance of Uncompressed Audio Distribution System over Ethernet with a L1/L2 Hybrid Switching Scheme (L1/L2 혼합형 중계 방법을 적용한 이더넷 기반 비압축 오디오 분배 시스템의 성능 분석)

  • Nam, Wie-Jung;Yoon, Chong-Ho;Park, Pu-Sik;Jo, Nam-Hong
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.46 no.12
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    • pp.108-116
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    • 2009
  • In this paper, we propose a Ethernet based audio distribution system with a new L1/L2 hybrid switching scheme, and evaluate its performance. The proposed scheme not only offers guaranteed low latency and jitter characteristics that are essentially required for the distribution of high-quality uncompressed audio traffic, and but also provide an efficient transmission of data traffic on the Ethernet environment. The audio distribution system with a proposed scheme consists of a master node and a number of relay nodes, and all nodes are mutually connected as a daisy-chain topology through up and downlinks. The master node generates an audio frame for each cycle of 125us, and the audio frame has 24 time slotted audio channels for carrying stereo 24 channels of 16-bit PCM sampled audio. On receiving the audio frame from its upstream node via the downlink, each intermediate node inserts its audio traffic to the reserved time slot for itself, then relays again to next node through its physical layer(L1) transmission - repeating. After reaching the end node, the audio frame is loopbacked through the uplink. On repeating through the uplink, each node makes a copy of audio slot that node has to receive, then play the audio. When the audio transmission is completed, each node works as a normal L2 switch, thus data frames are switched during the remaining period. For supporting this L1/L2 hybrid switching capability, we insert a glue logic for parsing and multiplexing audio and data frames at MII(Media Independent Interlace) between the physical and data link layers. The proposed scheme can provide a good delay performance and transmission efficiency than legacy Ethernet based audio distribution systems. For verifying the feasibility of the proposed L1/L2 hybrid switching scheme, we use OMNeT++ as a simulation tool with various parameters. From the simulation results, one can find that the proposed scheme can provides outstanding characteristics in terms of both jitter characteristic for audio traffic and transmission efficiency of data traffics.