Shear Strength of the ${Cu_6}{Sn_5}$ -dispersed Sn-Pb Solder Bumps Fabricated by Screen Printing Process
(${Cu_6}{Sn_5}$ 를 분산시켜 스크린 프린팅법으로 제조한 Sn-Pb 솔더범프의 전단강도)
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- Korean Journal of Materials Research
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- v.10 no.12
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- pp.799-806
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- 2000