• Title/Summary/Keyword: DPCD

Search Result 4, Processing Time 0.016 seconds

A Link Layer Design for DisplayPort Interface

  • Jin, Hyun-Bae;Yoon, Kwang-Hee;Kim, Tae-Ho;Jang, Ji-Hoon;Song, Byung-Cheol;Kang, Jin-Ku
    • Journal of IKEEE
    • /
    • v.14 no.4
    • /
    • pp.297-304
    • /
    • 2010
  • This paper presents a link layer design of DisplayPort interface with a state machine based on packet processing. The DisplayPort link layer provides isochronous video/audio transport service, link service, and device service. The merged video, audio main link, and AUX channel controller are implemented with 7,648 LUTs(Loop Up Tables), 6020 register, and 821,760 of block memory bits synthesized using a FPGA board and it operates at 203.32MHz.

Fast Auxiliary Channel Design for Display Port (디스플레이 포트를 위한 고속 보조 채널 설계)

  • Jin, Hyun-Bae;Moon, Yong-Hwan;Jang, Ji-Hoon;Kim, Tae-Ho;Song, Byung-Cheol;Kang, Jin-Ku
    • Journal of IKEEE
    • /
    • v.15 no.2
    • /
    • pp.113-121
    • /
    • 2011
  • This paper presents the design of a fast auxiliary channel bus for DisplayPort 1.2 interface. The fast auxiliary channel supports Manchester transactions at 1Mbps and fast auxiliary transactions at 780Mbps. The Manchester transaction is used for managing the main link and auxiliary channel and the fast auxiliary transaction is for data transfer via the auxiliary channel. Simplified serial bus architecture is proposed to be implemented in fast auxiliary channel. The fast auxiliary channel transmitter and receiver are implemented with 7,648 LUTs and 6,020 slice register synthesized in Xilinx Vertex4 FPGA and can be operated at 72MHz to support 720Mbps.

A Design of DisplayPort AUX Channel (디스플레이포트 인터페이스의 AUX 채널 설계)

  • Cha, Seong-Bok;Yoon, Kwang-Hee;Kim, Tae-Ho;Kang, Jin-Ku
    • Journal of IKEEE
    • /
    • v.14 no.1
    • /
    • pp.1-7
    • /
    • 2010
  • This paper presents an implementation of the DisplayPort AUX(Auxiliary) Channel. DisplayPort uses Main link, AUX Channel and Hot Plug Detect line to transfer the video & audio data. For isochronous transport service, source device converts to image and audio data which are to be transported through the Main Link and transports the restructured image and audio data to sink device. The AUX Channel provides link service and device service for discovering, initializing and maintaining the Main link. Hot Plug Detect line is used to confirm the connection between source device and sink device. The AUX Channel is implemented with 3315 LUTs(Look Up Table), 1466 Flip Flops and 168.782MHz max speed synthesized using Xilinx ISE 9.2i at SoC Master3.

Evaluation of Bond Performance of Self-Healing Agents Using Single lap Shear Test (Single Lap 전단시험을 적용한 자가치료제의 접착성능 평가)

  • 윤성호;박희원;허광수
    • Composites Research
    • /
    • v.17 no.4
    • /
    • pp.40-46
    • /
    • 2004
  • A single lap shear test was used to investigate the effects of the ratio of a catalyst to a self-healing agent and curing temperature on the bond performance of autonomic polymer composites. DCPD (dicyclopentadiene), ENB (5-ethylidene-2-norbornene), and their mixture were used as self-healing agents and bis(triclohexylphosphine) benzyllidine ruthenium (IV) dichloride Grubbs' catalyst was used as a catalyst. During the experiments, the catalyst ratios of 1.0wt% and 0.5wt% were applied to DCPD, the catalyst ratio of 0.lwt% was applied to ENB, and the catalyst ratio of 0.5wt% was applied to the mixtutes of DPCD and ENB. In addition, the curing temperatures of $25^{\circ}C$, $60{\circ}C$, and $80^{\circ}C$ were considered. According to the results, the higher catalyst ratio and the longer curing time were required to obtain more stabilized bond shear strength of DCPD. ENB with a lower catalyst ratio was cured faster than DCPD. Unlike DCPD, ENB stabilized after a steady fall from its peak as the curing time increased. Moreover, the mixtures of DCPD and ENB revealed similar curing behavior to ENB, but the increase in mixture ratio of ENB to DCPD caused curing process to be faster. Also the increase in curing temperature caused the bond shear strength to be higher and the curing time to be quicker.