• Korean Journal of Materials Research
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• v.9 no.4
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• pp.373-377
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• 1999

The cure mechanicsm and cure kinetics of diglycidyl ether of bisphenol A(DGEBA)/4,4'-methylene dianiline(MDA)/nitrile(MN, SN, GN) systems were studied by FT-IR and DSC to develop new applications in the biomedical polymer fields. The network structure of the DGEBA/MDA system was changed to the chain-extended network structure by the addition of nitriles. The reactions contributed to the chain extension were the primary amine-nitrile and hydroxyl-nitrile reactions. The chain-extended network structure could be indirectly proved by the decrement of T\ulcorner and the increment of impact strength with the increasing nitrile content. The cure rate of DGEBA/MDA/nitrile system was lower than that of DGEBA/MDA system due to the disturbance of nitrile group in the reaction of primary amine and epoxide groups.

• Korean Journal of Materials Research
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• v.7 no.9
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• pp.733-737
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• 1997

고분자 재료의 가격을 낮추거나 물리적, 열적 성질을 향상시키기 위해 고분자 복합재료 분야에서 무기 첨가제의 사용이 크게 증가하고 있다. 본 연구에서는 DBEBA/MDA/GN 계의 경화특성에 미치는 천연 Zeolite의 영향을 고찰하였다. DGEBA/MDA/GN 계의 경화 매카니즘과 DGEBA/MDA/GN/natural zeolite계의 경화 메카니즘은 매우 유사하였다. Zeolite의함량이 20phr까지 증가함에 따라 속도 상수는 증가하였으나 Zeolite의 함량이 증가함에 따라 속도 상수는 감소하였다.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1570-1572
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• 1997

Characteristics of thermal degradation on cure conditions of DGEBA/MDA/GN system were investigated. Epoxy resin system was degradated in one stage. The activation energy of DGEBA/MDA/GN system had the lowest value in the cure time of 1.0 hr at $80^{\circ}C$ before at $150^{\circ}C$ for 1.0 hr and it increased with the pre-cure time at $80^{\circ}C$.

• Korean Journal of Materials Research
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• v.5 no.5
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• pp.606-610
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• 1995

Diglycidyll ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline(MDA)계에 반응성 첨가제 malononitrile(MN)을 첨가하면 내충격성은 크게 향상되나 반응속도는 감소하게 된다. 에폭시 수지의 경화반응은 에폭시기가 개환되어 생성되는 히드록시기가 촉매로 작용하는 자촉매 반응이며, 외부에서도입된 히드록시기도 같은 효과를 나타낸다. 따라서 본 연구에서는 DGEBA/MDA/MN 계의경화 반응속도를 증가시키기 위해 히드록시기를 가진 촉매로서 hydroquinone(HQ)을 도입하였고 이들 계의경화특성 및 열적성질을 고찰하였다. HQ가 첨가됨으로 인해 활성화 에너지는 감속하고 속도상수는 증가하였으며, 발열곡선에서 반응 시작온도가 낮아졌다. 이 결과로부터 HQ가 반응 가속제로 작용하고 있음을 알 수 있다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1994.11a
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• pp.119-119
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• 1994

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.181-181
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• 1996

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.11a
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• pp.103-103
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• 1993

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.178-178
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• 1996

• Applied Chemistry for Engineering
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• v.7 no.5
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• pp.963-969
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• 1996

Cure characteristics of DGEBA(diglycidyl ether of bisphenol A)/dicy(dicyandiamide) system containing diuron(3-(3,4-dichloro phenyl) -1,1-dimethylurea) as an accelerator was investigated. The system has shelf life of six months because dicy is insoluble in liquid/solid resins at room temperature. It is generally known that dicy is an adequate curing agent for one component adhesive due to its highly latent property. With increasing the amount of added dicy, reaction heat of DGEBA/dicy system increased and degree of conversion was not varied. For DGEBA/dicy/diuron system, cure temperature decreased about $40^{\circ}C$ and cure reaction became fast by the addition of diuron which activates dicy. $T_g$ of the mixed resin decreased with the amount of accelerator. which was interpreated with molecular structure forming loose chain. Cure kinetics of DGEBA/dicy and DGEBA/dicy/diuron system were explained using Kamal's autocatalytic reaction model. The effect of acceleration was confirmed with that reaction model.

• Polymer(Korea)
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• v.31 no.6
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• pp.526-531
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• 2007

This paper reports the first results of a series of planarization film study for the stainless steel (SS) substrates for flexible displays. Diglycidyl ether of bisphenol A (DGEBA) and octa(dimethylsiloxypropylglycidylether) silsesquioxane (OG) were chosen for the organic and the hybrid epoxies respectively and diaminodiphenylmethane (DDM) was used as a curing agent at 1:2 stoichiometric ratio. These materials were spin-coated on SS substrates and thermal-cured. TGA study indicated that both the pristine and the cured OG were more thermally stable than DGEBA. AFM study showed that the smooth surfaces of $1{\sim}2\;nm$ roughness can be prepared for both DGEBA and OG when the films were thick ($>\;1\;{\mu}$). The electrical properties such as dielectric constant, capacitance and the leakage current with respect to the applied voltage were all stable even after the stress of $100\;V/100^{\circ}C$ was applied for $0{\sim}10000$ seconds indicating that the insulating properties of DGEBA and OG films were very reliable.