• Journal of the Korean institute of surface engineering
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• v.32 no.2
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• pp.93-99
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• 1999

Surface polymer layer formed on the silicon wafer during the oxide overetching using $C_4F_8$/ helicon wave plasmas and their characteristics were investigated using spectroscopic elipsometry, X-ray photoelectron spectroscopy, and secondary ion mass spectrometry. Overetch percentage and dc-self bias voltage were varied to investigate the effects on the characteristics of the polymers remaining on the overetched silicon surface. The increase of bias voltage from -80 volts to -120 volts increased the C/F ratio and carbon bondings such as C-C, $C-CF_x$/, and C-Si in the polymer while reducing the thickness of the polymer layer. However, the increase of the overetch percentage from 50% to 100% did not change the composition of the polymer layer and the carbon bondings in the polymer layer remained same even though it increased the polymer thickness. The polymer layer formed at the higher dc-self bias voltage was more difficult to be removed by the following various post-etch treatments compared to that formed at the longer overetch percentage.

• Journal of the Korean Vacuum Society
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• v.6 no.2
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• pp.136-142
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• 1997

An/n-GaAs(100) Schottky barrier diode has been investigated by using electoreflectance(ER). From the observed Franz-Keldysh oscillatins(FKO), the internal electric field(Ei) of the sample is $5.76\times 10^{4}$V/cm at 300 K. As the modulation voltage($V_{ac}$) IS changed, the line shape of ER signal does not change but its amplitude various linerly. For increasing forward and reverse dc bias boltage($V_{bias}$), the amplitude of ER signal decreases. The internal electric field decreased from $19.3\times 10^4\sim4.39\times10^4$V/cm as $V_{bias}$ INCREASES FROM -5.0 V TO 0.6 V. For Au/n-GaAs the valve of built-in voltage($V_{bi}$) determined from the plot of $V_{bias}$ versus $E_i^2$ is 0.70 V. This value agrees with that observed in the plot of $V_{bias}$ versus amplitude of FKO peak. In addition, the carrier concentraion(N) and potential barrier($\Phi$) of the sample at 300 K are found to be about $2.4\times 10^{16}\textrm{cm}^{-3}$ and 0.78 eV, respectively.

• Transactions on Electrical and Electronic Materials
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• v.9 no.6
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• pp.260-264
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• 2008

The operational characteristics of superconducting amplifier using vortex flux flow were analyzed from an equivalent circuit in which its current-voltage characteristics for the vortex motion in YBCO microbridge were reflected. For the analysis of operation as an amplifier, dc bias operational point for the superconducting amplifier is determined and then ac operational characteristics for the designed superconducting amplifier were investigated. The variation of transresistance, which describes the operational characteristics of superconducting amplifier, was estimated with respect to conditions of dc bias. The current and the voltage gains, which can be derived from the circuit for small signal analysis, were calculated at each operational point and compared with the results obtained from the numerical analysis for the small signal circuit. From our paper, the characteristics of amplification for superconducting flux flow transistor (SFFT) could be confirmed. The development of the superconducting amplifier applicable to various devices is expected.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.3
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• pp.383-390
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• 2018

Piezoelectric micro-machined ultrasonic transducers for highly directional speaker need DC bias voltage. Most existing power amplifiers are not suitable for use in highly directional transducers because they are based on AC. In addition, since the piezoelectric micro-machined ultrasonic transducer has a large capacitive reactance, the power efficiency of the power amplifier is very low. Thus this paper proposes a new high efficiency power amplifier with DC bias voltage. In addition, by designing a matching circuit to compensate the capacitive reactance of the micro-machined ultrasonic transducer, the power efficiency of the power amplifier increases. The operating characteristics of the proposed power amplifier was verified by an experimental prototype. The proposed power amplifier is expected to be widely used in designing and implementing other related power amplifiers.

• Journal of Institute of Control, Robotics and Systems
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• v.13 no.4
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• pp.315-319
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• 2007

A technique to model plasma processes was presented. This was accomplished by combining the backpropagation neural network (BPNN) and genetic algorithm (GA). Particularly, the GA was used to optimize five training factor effects by balancing the training and test errors. The technique was evaluated with the plasma etch data, characterized by a face-centered Box Wilson experiment. The etch outputs modeled include Al etch rate, AI selectivity, DC bias, and silica profile angle. Scanning electron microscope was used to quantify the etch outputs. For comparison, the etch outputs were modeled in a conventional fashion. GABPNN models demonstrated a considerable improvement of more than 25% for all etch outputs only but he DC bias. About 40% improvements were even achieved for the profile angle and AI etch rate. The improvements demonstrate that the presented technique is effective to improving BPNN prediction performance.

• Journal of Advanced Marine Engineering and Technology
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• v.41 no.2
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• pp.146-149
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• 2017

Si clusters generated during the plasma chemical vapor deposition (CVD) process have a great influence on the quality of the fabricated films. In particular, in hydrogenated amorphous silicon thin films (a-Si:H) used for thin film solar cells, Si clusters are mainly responsible for light-induced degradation. In this study, we investigated the amount of clusters incorporated into thin films using a quartz crystal microbalance (QCM) and specially designed cluster eliminating filters, and investigated the effect of the DC grid mesh in preventing cluster incorporation. Experimental results showed that as the applied voltage of the grid mesh, which is placed between the electrode and the QCM, decreased, the number of clusters incorporated into the film decreased. This is due to the electrostatic force from the grid mesh bias, and this method is expected to contribute to the fabrication of high-quality thin films by preventing Si cluster incorporation.

• Journal of electromagnetic engineering and science
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• v.13 no.2
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• pp.137-139
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• 2013

A compact metamaterial (MTM)-based tunable phase shifter consisting of four unit cells with a simple DC bias circuit has been designed at 2.4 GHz. The variable series capacitors and shunt inductors that are required to be loaded periodically onto a host transmission line are realized employing only chip variable capacitors (varactors). In addition, the proposed phase shifter requires only one DC bias source to control the varactors, with the matching condition of the MTM line automatically satisfied. The measured phase shifting range is $285.2^{\circ}$ (from $-74.2^{\circ}$ to $211^{\circ}$). The measured insertion loss is approximately 1.5 dB. The circuit/electromagnetic-simulated and measured results are in good agreement.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.540-542
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• 2009

Phosphorus doped ZnO (PZO) thin films were deposited on $SiO_2$/n-Si substrates using DC magnetron sputtering system varying oxygen partial pressures from 0 to 40 % under Ar atmosphere. The deposited films showed reduced n-type conductivity due to the compensating donor effects by phosphorus dopant. The bias-time stability shows relatively good stability over bias and time comparing to un-doped ZnO-based TFTs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.195-198
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• 1999

A technique is investigated for achieving broadband properties by controlling the operation frequency of microstrip antennas. The control is achieved by applying DC bias to the microstrip antenna. Air gap antenna with PZT post is fabricated. by using in C-band. In the case of Air gap antenna, the variation of center frequency was about 16Mhz and the bandwidth was increased up to 123.3% at 15dB, 160.7% at 20dB than before applying DC bias respectively. The change property of frequency in air gap antenna is nearly the same the C-V property in PZT.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.10
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• pp.2237-2246
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• 2012

A bias circuit required for an oral sensor is manufactured inside the oral sensor chip to reduce its size and cost. The proposed DC-DC converter supplies the required reference and bias currents for their corresponding regulators by using IREF of the reference current generator. Their target voltages of the voltage regulators are regulated by the negative mechanism by generating their reference voltages required for their corresponding regulators. In addition, a constant current IB0/IB1 is supplied by being mirrored by a current mirror ratio and then VREF is generated. It is confirmed by measurements that the average volatge, ${\sigma}$, and $4{\sigma}$ of the designed DC-DC converter for intra oral sensors with a $0.18{\mu}m$ X-ray CMOS process are within their required ranges. And the line-pair pattern image shows a high-resolution characteristic without blurring. Also, a good oral image can be obtained.