• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.13 no.8
• /
• pp.704-710
• /
• 2000

Metal electrode materials for plasma display panel should have low electrical resistivity in order to maintain stable gas discharge and have fast response time. They should also hae good film uniformity adhesion and thermal stability. In this study Cr/Cu/Cr metal electrode structure is formed by DC magnetron sputtering. Cr and Cu films were deposited on ITO coated glasses with various DC power density and main pressures as the major parameters. After metal electrodes were formed a heat treatment was followed at 55$0^{\circ}C$ for 20 min in a vacuum furnace. The intrinsic stress of the sputtered Cr film passed a tensile stress maximum decreased and then became compressive with further increasing DC power density. Also with increasing the main pressure stress turned from compression to tension. After heat the treatment the electrical resistivity of the sputtered Cu film of 2${\mu}{\textrm}{m}$ in thickness prepared at 1 motor with the applied power density of 3.70 W/cm$^2$was 2.68 $\mu$$\Omega$.cm With increasing the main pressure the DC magnetron sputtered Cu film became more open structure. The heat treatment decreased the surface roughness of the sputtered Cr/Cu/Cr metal electrodes.

• Journal of the Korean Ceramic Society
• /
• v.50 no.6
• /
• pp.390-395
• /
• 2013

Nanocrystalline CrN films were deposited on Si (100) substrates by means of asymmetric pulsed DC reactive magnetron sputtering. We investigated the growth behavior, corrosion resistance and mechanical properties of CrN films with a change in the duty cycle and pulse frequency. The grain size of the CrN films decreased from 25.4 nm to 11.2 nm upon a decrease in the duty cycle. The corrosion potentials for the CrN films by DC sputtering was approximately - 0.6 V, and it increased to - 0.3 V in the CrN films which underwent pulsed sputtering. The nanoindentation hardness of the CrN films also increased with a decrease in the duty cycle. This enhancement of the corrosion resistance and mechanical properties of pulsed sputtered CrN films could be attributed to the densification and surface smoothness of the microstructure of the films.

• Journal of the Korean institute of surface engineering
• /
• v.52 no.4
• /
• pp.211-226
• /
• 2019

Optical thin films were deposited by using a reactive pulsed DC magnetron sputtering method with a high density plasma(HDP). In this study, the effect of sputtering process conditions on the microstructure and optical properties of $SiO_2$, $TiO_2$, $Nb_2O_5$ thin films was clarified. These thin films had flat and dense microstructure, stable stoichiometric composition at the optimal conditions of low working pressure, high pulsed DC power and RF power(HDP). Also, the refractive index of the $SiO_2$ thin films was almost constant, but the refractive indices of $TiO_2$ and $Nb_2O_5$ thin films were changed depending on the microstructure of these films. Antireflection films of $Air/SiO_2/Nb_2O_5/SiO_2/Nb_2O_5/SiO_2/Nb_2O_5/Glass$ structure designed by Macleod program were manufactured by our developed sputtering system. Transmittance and reflectance of the manufactured multilayer films showed outstanding value with the level of 95% and 0.3%, respectively, and also had excellent durability.

• Journal of the Semiconductor & Display Technology
• /
• v.21 no.3
• /
• pp.105-109
• /
• 2022

For the realization of higher reliable transition metal dichalcogenide layer, molybdenum disulfide was formed on sapphire substrate by direct current sputtering and subsequent rapid thermal annealing process. Unlike RF sputtered MoS₂ thin films, DC sputtered showed no irregular holes and protrusions after annealing process from scanning electron microscope images. From atomic force microscope results, it was possible to investigate that surface roughness of MoS₂ thin films were more dependent on DC sputtering power then annealing temperature. On the other hand, the Raman scattering spectra showed the dependency of significant E¹_2g and A¹_g peaks on annealing temperatures.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2002.08a
• /
• pp.842-845
• /
• 2002

We report on the properties of ITO thin films prepared by dc and pulse magnetron sputtering at low temperature. The electrical, optical, and surface properties of the films prepared by dc and pulse magnetron sputtering were compared. We discuss the role the pulse power plays in determining ITO thin film properties that are important in flat panel applications.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.311-311
• /
• 2012

Boron carbide (B-C) 박막은 높은 경도, 열적 안전성, 화학적 안전성이 우수한 하드 코팅 소재로 사용되고 있다. 우수한 특성을 가지는 B-C 박막에 대한 연구는 B4C 비전도성 타겟을 이용하여 RF Sputtering 법으로 증착 공정변수에 대해서 박막의 물성에 관해 일부 연구자들이 진행하였으나, Pulsed dc margnetron sputtering 법으로 증착 공정변수에 대한 물성의 연구는 미진하였다. 반면에, DLC 박막은 우수한 특성을 가지는 하드 코팅 소재이나 400도 이상에서는 내열성이 떨어지는 단점을 가지고 있다. 연구에서는 B-C 박막의 내열성이 우수한 특성을 이용하여 DLC 박막의 내열성을 높이기 위한 목적으로 B-C 박막과 DLC 박막을 다층막으로 제조함으로서 DLC 박막을 구조적으로 안정화를 시키고자 하였다. 그리고 비전도성 B4C 타겟으로 Pulsed dc 마그네트론 스퍼터링법을 이용하여 증착기술을 개발하기 위해서 공정압력과 인가전력에 따른 B-C 박막을 제조하여 그 물성을 조사하였고, B-C/DLC 다층막을 제조하여 DLC 박막의 내열성을 증가시키고자 하였다. B-C 박막과 B-C/DLC 다층막의 경도와 탄성율은 나노인덴테이션과 마이크로 비커스를 이용하였으며, 박막의 성장구조와 박막의 구조를 조사하기 위해 SEM과 FTIR 및 XRD 을 이용하여 측정하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2001.06a
• /
• pp.61-62
• /
• 2001

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2001.05a
• /
• pp.78-78
• /
• 2001

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1999.05a
• /
• pp.67-67
• /
• 1999

• Proceedings of the Korean Magnestics Society Conference
• /
• 2001.10a
• /
• pp.86-87
• /
• 2001