• 제목/요약/키워드: DC Sputtering

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Bipolar pulsed DC magnetron sputtering에서 정적 증착과 동적 증착에 의한 박막 특성 변화 (Thin film characteristics variation of static deposition and dynamic deposition by bipolar pulsed DC magnetron sputtering)

  • 양원균;주정훈
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2009년도 춘계학술대회 논문집
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    • pp.149-149
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    • 2009
  • 실제 산업에서 가장 많이 사용하고 있는 in-line type system에서 Al-doped ZnO (AZO) 막을 bipolar pulsed DC sputtering을 이용해 증착하였다. 약 30 nm/sec의 속도로 기판을 타겟 좌우로 swing 하면서 동적 증착 공정을 한 AZO 박막의 columnar structure가 정적 증착일 때와 다른 형태의 zigzag-type columnar structure가 형성되었다. 투명전도막의 가장 중요한 특성인 비저항과 투과도가 동적 증착 공정일 때의 박막과 정적 증착 공정일 때의 박막이 각각 $2.5{\times}10^{-3}{\Omega}{\cdot}cm$, 78.5%와 $1.65{\times}10^{-3}{\Omega}{\cdot}cm$, 83.9% 였다. 이렇게 성장하는 막의 구조 형태에 따라 달라지는 특성 변화는 양산하는 현장에서 매우 중요한 것이며, 동적 증착 공정에서의 박막 특성 개선에 정적 증착 공정과는 다른 방법의 연구가 필요할 것이다.

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DC 스퍼터법과 유도결합형 플라즈마 스퍼터법으로 증착된 HfN 코팅막의 물성 비교연구 (A Comparative Study of Nanocrystalline HfN Coatings Fabricated by Direct Current and Inductively Coupled Plasma Assisted Magnetron Sputtering)

  • 전성용;이소연
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2017년도 춘계학술대회 논문집
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    • pp.103.1-103.1
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    • 2017
  • Nanocrystalline HfN coatings were prepared by reactively sputtering Hf metal target with N2 gas using a magnetron sputtering system operated in DC and ICP (inductively coupled plasma) condition with various powers. The effects of ICP power, ranging from 0 to 200 W, on the coating microstructure, corrosion and mechanical properties were systematically investigated with FE-SEM, AFM, potentiostat and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of HfN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Average grain size and nano hardness of HfN coatings were also investigated with increasing ICP powers.

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Ion Beam Assisted DC Planar Magnetron Sputtering 장치에 의한 PDP용 방전전극 형성에 관한 연구 (A Study on Discharge Electrode Formation for PDP with Ion Beam Assisted DC Planar Magnetron Sputtering Device)

  • 김준호;손진부;신중홍;조정수;박정후
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 E
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    • pp.1791-1793
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    • 1998
  • The thin film metal electrode for PDP needs low resistivity and strong adhesion. But the sputtered copper film is weak, in the adhesion between copper and glass. In this paper, we investigated the characteristics of resistivity and adhesion about Cu thin film using Ion Beam Assisted DC Planar Magnetron Sputtering(DCPM) Device.

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High performance thin film transistor with ZnO channel layer deposited by DC magnetron sputtering

  • Moon, Yeon-Keon;Moon, Dae-Yong;Lee, Sang-Ho;Park, Ki-Hoon;Jeong, Chang-Oh;Park, Jong-Wan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.849-852
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    • 2007
  • We studied ZnO thin films deposited with DC magnetron sputtering for channel layer of TFTs. After analyzing of the basic physical and chemical properties of ZnO thin films, we fabricated a TFTunit test cell. The field effect mobility of $1.8\;cm^2/Vs$ and threshold voltage of -0.7 V were obtained.

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비대칭 펄스 DC 반응성 마그네트론 스퍼터링으로 증착된 나노결정질 TiN 박막의 성장거동 (Growing Behavior of Nanocrystalline TiN Films by Asymmetric Pulsed DC Reactive Magnetron Sputtering)

  • 한만근;전성용
    • 한국세라믹학회지
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    • 제48권5호
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    • pp.342-347
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    • 2011
  • Nanocrystalline TiN films were deposited on Si(100) substrate using asymmetric pulsed DC reactive magnetron sputtering. We investigated the growing behavior and the structural properties of TiN films with change of duty cycle and pulsed frequency. Grain size of TiN films were decreased from 87.2 nm to 9.8 nm with decrease of duty cycle. The $2{\theta}$ values for (111) and (200) crystallographic planes of the TiN films were also decreased with decrease of duty cycle. This shift in $2{\theta}$ could be attributed to compressive stress in the TiN coatings. Thus, the change of plasma parameter has a strong influence not only on the microstructure but also on the residual stresses of TiN films.

IC소자용 질화 텅스텐 박막의 면저항 특성 (The Sheet Resistance Properties of Tungsten Nitride Thin films for Intergrated Circuit)

  • 이우선;정용호;김남오;정종상;유병수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1997년도 추계학술대회 논문집
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    • pp.94-97
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    • 1997
  • We investigated the sheet resistance properties of tungsten nitride thin films deposited by RF and DC sputtering system. It deposited at various conditions that determine the sheet resistance. The properties of the sheet resistance of these films were measured under various conditions. Sheet resistance analysed under the flow rate of the argon gas and contents of nitrogen from nitrogen-argon gas mixtures. We found that these sheet resistance were largely depend on the temperature of substrate, gas flow rate and RF power. Very high and low sheet resistance of tungsten films obtained by DC sputtering. As the increase of contents of nitrogen gas obtained from nitrogen-argon gas mixture, tungsten nitride thin films deposited by the reactive DC sputtering and the sheet resistance of these films were increased.

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기판바이어스 변화에 따른 반응성 마그네트론 스퍼터링에 의한 TiN 코팅 (TiN coatings by reactive magnetron sputtering under substrate bias)

  • 서평섭;한만근;박원근;전성용
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2008년도 추계학술대회 초록집
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    • pp.45-46
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    • 2008
  • Hard coatings of TiN which exhibit a large variation in their electrical resistivities, have been prepared in magnetron sputtering system using bipolar pulsed DC generator. TiN coatings have also been prepared using a DC generator in the same sputtering system under identical deposition conditions. Microstructural, Mechanical, Crystallographic properties of TiN films using continuous and bipolar pulsed DC generators were examined. Field emission scanning microscope and Nanoindenter have been used to characterize the coatings.

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유기물 광전소자 제작을 위한 박스 캐소드 스퍼터 기술 (Box Cathode Sputtering Technologies for Organic-based Optoelectronics)

  • 김한기
    • 한국전기전자재료학회논문지
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    • 제19권4호
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    • pp.373-378
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    • 2006
  • We report on plasma damage free-sputtering technologies for organic light emitting diodes (OLEDs), organic thin film transistor (OTFT) and flexible displays by using a box cathode sputtering (BCS) method. Specially designed BCS system has two facing targets generating high magnetic fields ideally entering and leaving the targets, perpendicularly. This target geometry allows the formation of high-density plasma between targets and enables us to realize plasma damage free sputtering on organic layer without protection layer against plasma. The OLED with Al cathode prepared by BCS shows electrical and optical characteristics comparable to OLED with thermally evaporated Mg-Ag cathode. It was found that OLED with Al cathode layer prepared by BCS has much lower leakage current density ($1{\times}10^{-5}\;mA/cm^2$ at -6 V) than that $(1{\times}10^{-2}{\sim}-10^0\;mA/cm^2)$ of OLED prepared by conventional DC sputtering system. This indicates that BCS technique is a promising electrode deposition method for substituting conventional thermal evaporation and DC/RF sputtering in fabrication process of organic based optoelectronics.

직류와 양극성 펄스직류에 의한 스퍼터링시 타겟 표면의 온도 분포와 그 영향 (Effect by Temperature Distribution of Target Surface during Sputtering by Bipolar Pulsed Dc and Continuous Dc)

  • 양원균;주정훈;김영우;이봉주
    • 한국진공학회지
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    • 제19권1호
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    • pp.45-51
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    • 2010
  • 마그네트론 타겟에서 일어나는 다양한 물리적 현상에 의한 결과로 인해 발생하는 타겟 표면의 온도를 측정함으로써 그 분포가 플라즈마, 혹은 증착되는 박막에 영향을 줄 수 있는 가능성을 분석하였다. 마그네트론 스퍼터링의 타겟은 크게 원형 타겟과 사각 타겟으로 구분되는데, 사각 타겟에서는 자기장에 의한 corner effect 등에 의해 전자 집중 방전 영역이 발생하고 그것에 의해 타겟 표면에서 불균일한 온도분포가 생성됨을 확인했다. 국부적으로 온도가 높게 올라가는 지역은 비스퍼터링 지역에 비해 $10{\sim}20^{\circ}C$ 정도 높았으며, 스퍼터링 공정 시 문제점 중에 하나인 particle이 발생하면 그 부분에서 온도가 $20^{\circ}C$ 정도 더 상승함을 알 수 있었다. 이런 영향은 증착되는 박막의 균일도에도 적지 않은 영향을 주었으며 세라믹 타겟의 경우, 균열의 원인이 될 수 있고, 불균일한 타겟 침식으로 타겟의 수명을 단축시키는 문제를 유발하기도 한다.

The comparative study of pure and pulsed DC plasma sputtering for synthesis of nanocrystalline Carbon thin films

  • Piao, Jin Xiang;Kumar, Manish;Javid, Amjed;Wen, Long;Jin, Su Bong;Han, Jeon Geon
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.320-320
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    • 2016
  • Nanocrystalline Carbon thin films have numerous applications in different areas such as mechanical, biotechnology and optoelectronic devices due to attractive properties like high excellent hardness, low friction coefficient, good chemical inertness, low surface roughness, non-toxic and biocompatibility. In this work, we studied the comparison of pure DC power and pulsed DC power in plasma sputtering process of carbon thin films synthesis. Using a close field unbalanced magnetron sputtering system, films were deposited on glass and Si wafer substrates by varying the power density and pulsed DC frequency variations. The plasma characteristics has been studied using the I-V discharge characteristics and optical emission spectroscopy. The films properties were studied using Raman spectroscopy, Hall effect measurement, contact angle measurement. Through the Raman results, ID/IG ratio was found to be increased by increasing either of DC power density and pulsed DC frequency. Film deposition rate, measured by Alpha step measurement, increased with increasing DC power density and decreased with pulsed DC frequency. The electrical resistivity results show that the resistivity increased with increasing DC power density and pulsed DC frequency. The film surface energy was estimated using the calculated values of contact angle of DI water and di-iodo-methane. Our results exhibit a tailoring of surface energies from 52.69 to $55.42mJ/m^2$ by controlling the plasma parameters.

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