• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.107-107
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• 2012

연료전지 분리판용 모재로서 사용되고 있는 스테인레스 스틸에 대해서는 많은 연구가 진행되어 왔으나, 알루미늄은 거의 연구가 진행되지 않고 있다. 따라서 이번 연구는 DC 반응성 마그네트론 스퍼터링법으로 알루미늄 기판 위에 TiN, TiCN 박막을 반응성 가스 유량별로 증착하여, 기계적 특성 및 내부식성 특성을 비교 검토하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.162-162
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• 2012

고 해상도를 요구하는 3차원 감성터치센서의 핵심 부품인 ITO 박막은 매우 얇은 두께에서 높은 투과율과 고 전도성을 동시에 가져야 한다. 이러한 박막 물성을 함께 가지는 고품질 ITO 초박막을 제조하기 위해서 DC와 RF의 장점을 동시에 가지는 DC/RF 중첩형 마그네트론 스퍼터링과 전자기장을 인가한 마그네트론 스퍼터링 법을 이용하여 증착한 초박막 ITO의 Sn함량에 따른 물성 및 미세 구조 변화를 관찰 하였다. RF/(DC+RF) 중첩 비율 및 전자기장 파워에 따른 ITO 초박막의 물성 변화를 확인 하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.109-111
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• 2007

Pulsed DC 마그네트론 스퍼터링 장치를 이용하여 Polymer 및 Glass 기판 위에 $SiN_{\chi}$ (Silicon Nitride) 박막을 합성 시키고 이들의 구조적, 광학적 특성을 조사하였다. 막두께는 100 nm로 고정하였으며, power mode 및 질소 가스 유량비를 변수로 합성하였다.

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.165-167
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• 2019

플라즈마 스퍼터링 공정은 반도체, 디스플레이 등 다양한 분야에서 사용되어지고 있는 박막 코팅 공정이다. 플라즈마 스퍼터링 공정의 특성상 안정된 플라즈마를 공급하기 위하여 펄스 전원장치를 요구 하게 된다. 본 논문은 플라즈마 스퍼터링 공정용 DC 전원장치를 통해 안정된 플라즈마를 공급하고 증착 효율을 높이기 위한 연구를 진행한다.

• Korean Journal of Materials Research
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• v.28 no.3
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• pp.159-165
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• 2018

In order to increase the efficiency of the sputtering method widely used in thin film fabrication, a dc sputtering apparatus which supplies both high frequency and magnetic field from the outside was fabricated, and cobalt thin film was fabricated using this apparatus. The apparatus can independently control the applied voltage, the target-substrate distance, and the target current, which are important parameters in the sputtering method, so that a stable glow discharge is obtained even at a low gas pressure of $10^{-3}$ Torr. The fabrication conditions using the sputtering method were mainly performed in $Ar+O_2$ mixed gas containing about 0.6 % oxygen gas under various Ar gas pressures of 1 to 30 mTorr. The microstructure of Co thin films deposited using this apparatus was examined by electron diffraction pattern and X-ray techniques. The magnetic properties were investigated by measuring the magnetization curves. The microstructure and magnetic properties of Co thin films depend on the discharge gas pressure. The thin film fabricated at high gas pressure showed a columnar structure containing a large amount of the third phase in the boundary region and the thin film formed at low gas pressure showed little or no columnar structure. The coercivity in the plane was slightly larger than that in the latter case.

• Journal of Information Display
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• v.8 no.3
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• pp.5-10
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• 2007

Twin target sputtering (TTS) system with a configuration of vertically parallel facing Al targets and a substrate holder perpendicular to the Al target plane has been designed to realize a direct Al cathode sputtering on organic light emitting diodes (OLEDs). The TTS system has a linear twin target gun with ladder type magnet array for effective and uniform confinement of high density plasma. It is shown that OLEDs with Al cathode deposited by the TTS show a relatvely lower leakage current density $({\sim}1{\times}10^{-5}mA/cm^2)$ at reverse bias of -6V, compared to that ($1{\times}10^{-2}{\sim}10^{-3}$ $mA/cm^2$ at -6V) of OLEDs with Al cathodes grown by conventional DC magnetron sputtering. In addition, it was found that Al cathode films prepared by TTS were amorphous structure with nanocrystallines due to low substrate temperature. This demonstrates that there is no plasma damage caused by the bombardment of energetic particles. This indicates that the TTS system with ladder type magnet array could be useful plasma damage free deposition technique for direct Al cathode sputtering on OLEDs or flexible OLEDs.

• Korean Journal of Materials Research
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• v.26 no.4
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• pp.207-211
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• 2016

Ti films were deposited on glass substrates under various preparation conditions in a chamber of two-facing-target type dc sputtering; after deposition, the electric resistivity values were measured using a conventional four-probe method. Crystallographic orientations and microstructures, including the texture and columnar structure, were also investigated for the Ti films. The morphological features, including the columnar structures and surface roughness, are well explained on the basis of Thornton's zone model. The electric resistivity and the thermal coefficient of the resistivity vary with the sputtering gas pressure. The minimum value of resistivity was around 0.4 Pa for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films; the apparent tendencies are almost the same for the two films, with a small difference in resistivity because of the different film thicknesses. The films deposited at high gas pressures show higher resistivities. The maximum of TCR is also around 0.4 Pa, which is the same as that obtained from the relationship between the resistivity and the gas pressure. The lattice spacing also decreases with increasing sputtering gas pressure for both the $0.5{\mu}m$ and $3.0{\mu}m$ thick films. Because they are strongly related to the sputtering gas pressures for Ti films that have a crystallographic anisotropy that is different from cubic symmetry, these changes are well explained on the basis of the film microstructures. It is shown that resistivity measurement can serve as a promising monitor for microstructures in sputtered Ti films.

• Journal of the Korean Vacuum Society
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• v.2 no.2
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• pp.152-160
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• 1993

In this study, we have investigated the influence of sputtering conditions (Ar pressure input powers, substrates) on coercivity and microstructures of GdFe, Co, CoCr thin films produced by the method of DC magnetron sputtering. In GdFe films, we have observed that the Gd atomic ratio was decreased with the deposition rate, and deposition rate decreased with the pressure of Ar gas and the increased linearly with input power. It was also observed that the coercivity of thin films was increased with input power. In Co films, we have investigated the deposition was increased and the Co thin film became finer structure with the increase in the input power, was increased and the Co thin film became finer structure with the increase in the input power, and the deposition rate was decreased with the pressure of Ar gas. In CoCr films, we have investigated the effects of substrates on the coercivity $(H_c)$ and the microstructure. We have found that the substrates plays a crucial role in the microstructure and the coercivity $(H_c)$.

• Journal of the Korean Magnetics Society
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• v.2 no.2
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• pp.119-124
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• 1992

We have investigated the effects of sputtering Ar gas pressure on magnetic and magneto-optical properties in compositionally modulated Co/Pd superlattice thin films. The samples were prepared by dc magnetron sputtering from 2-in.-diam Co and Pd targets by alternately exposing the substrates to targets. Sputtering Ar gas pressure was varied from 2 to 30 mTorr. All samples had same bilayer thicknesses composed of 2-$\AA$-thick Co and 9-$\AA$-thick Pd sublayers. It was observed that the colum-nar structure was more distinctively developed with increasing Ar gas pressure. We observed that the intrinsic uniaxial anisotropy energy, magnetization and polar Kerr rotation were decreased with increasing Ar gas pressures. Large coercivity and perfect squareness were attained by the deposition at the high Ar gas pressure. We believe that the results are mainly ascribed the variation of micro-structure with sputtering Ar gas pressure.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1919-1921
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• 1999

AlN thin films were fabricated by sputter for the application of MIS device with Al/AlN/Si structure. We controled that sub-temperature room-temperature. Sputtering pressure 5 mTorr, flow ratio Ar:$N_2$=1:1(4sccm:4sccm), and appended hydrogen gas $0{\sim}5%$. AlN thin films thickness fabricated to maintain $2700{\AA}$ time control. Before the experiment remove to the contaminated material use the Ultrasonic every 10 minute use the acetone and ethanol, then use the HF remove oxide-substance at 10 second. To analyze characteristic of the $H_2$ gas addition period, C-V and I-V characteristic make and experiment $H_2$ gas at addition period progressive capability of I-V and C-V characteristic.