• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• Journal of Power Electronics
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• 제16권2호
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• pp.685-694
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• 2016

This paper presents a reliability assessment model for the power semiconductors used in wind turbine power converters. In this study, the thermal loadings at different timescales of wind speed are considered. First, in order to address the influence of long-term thermal cycling caused by variations in wind speed, the power converter operation state is partitioned into different phases in terms of average wind speed and wind turbulence. Therefore, the contributions can be considered separately. Then, in regards to the reliability assessment caused by short-term thermal cycling, the wind profile is converted to a wind speed distribution, and the contribution of different wind speeds to the final failure rate is accumulated. Finally, the reliability of an actual power converter semiconductor for a 2.5 MW wind turbine is assessed, and the failure rates induced by different timescale thermal behavior patterns are compared. The effects of various parameters such as cut-in, rated, cut-out wind speed on the failure rate of power devices are also analyzed based on the proposed model.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• The Journal of Advanced Prosthodontics
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• 제8권1호
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• pp.30-36
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• 2016

PURPOSE. The aim of this study was to evaluate the fracture resistance and fracture behavior of monolithic zirconia crowns in accordance with the preparation design and aging simulation method. MATERIALS AND METHODS. An upper first molar was prepared sequentially with three different preparation designs: shoulderless preparation, 0.4 mm chamfer and 0.8 mm chamfer preparation. For each preparation design, 30 monolithic zirconia crowns were fabricated. After cementation on Cr-Co alloy dies, the following artificial aging procedures were performed: (1) thermal cycling and mechanical loading (TCML): 5000 cycles of thermal cycling $5^{\circ}C-55^{\circ}C$ and chewing simulation (1,200,000 cycles, 50 N); (2) Low Temperature Degradation simulation (LTD): autoclave treatment at $137^{\circ}C$, 2 bar for 3 hours and chewing simulation; and (3) no pre-treatment (control group). After artificial aging, the crowns were loaded until fracture. RESULTS. The mean values of fracture resistance varied between 3414 N (LTD; 0.8 mm chamfer preparation) and 5712 N (control group; shoulderless preparation). Two-way ANOVA analysis showed a significantly higher fracture loads for the shoulderless preparation, whereas no difference was found between the chamfer preparations. In contrast to TCML, after LTD simulation the fracture strength of monolithic zirconia crowns decreased significantly. CONCLUSION. The monolithic crowns tested in this study showed generally high fracture load values. Preparation design and LTD simulation had a significant influence on the fracture strength of monolithic zirconia crowns.

• 전기화학회지
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• 제7권1호
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• pp.1-8
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• 2004

This paper deals with the recent development of high-voltage cathode materials of mono- and di- metal ions substituted spinel $LiMn_2O_4$ for lithium batteries. $LiCu_xMn_{2-x}O_4(0{\leq}x{\leq}0.5)$ shows reversible intercalation/deintercalation in two potential regions, $3.9\~43\;and\;4.8-5.0V$ and stable electrochemical cycling behavior but with low capacity. $LiNi_{0.5}Mn_{1.5}O_4$ obtained by a sol-gel process delivers a capacity of 127mAh $g^{-1}$ on the first cycle and sustains a value of 124 mAh $g^{-1}$ even after the 60th cycle. The $Li_xCr_yMn_{2-y}O_4(0{\leq}x{\leq}0.5)$ solid-solutions exhibit enhanced specific capacity, larger average voltage, and improved cycling behaviors for low Cr content. $LiCr_yMn_{2-y}O_4$ presents a reversible Li deintercalation process at 4.9V, whose capacity is proportional to the Cr content in the range of $0.25{\leq}x{\leq}0.5$ and delivers higher capacities. $LiM_yCr_{0.5-y}Mn_{1.5}O_4(M=Fe\;or\;Al)$ shows that the capacity retention is lowered compared with lithium manganate. The cumulative capacities obtainable with Al-substitutted materials are less than those with Fe-substituted materials. $LiCr_xNi_{0.5-x}Mn_{1.5}O_4(x=0.1)$ delivers a high initial capacity of 1$152mAh\;g^{-1}$ with excellent cycleability.

• 대한기계학회논문집A
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• 제41권10호
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• pp.991-996
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• 2017

인간의 보행에서 안정적인 디딤을 가능하게 하는 동작특성은 보행 일주기의 60%를 차지하는 긴 디딤국면이다. 본 연구에서는 이러한 보행패턴을 자전거의 크랭크 구동장치에 반영하여 직립자세에서 안정적으로 구동할 수 있는 자전거를 설계하고자 한다. 크랭크의 회전속도를 디딤국면에서는 느리게 되돌림국면에서는 빠르게 움직이도록 급속귀환 기구를 크랭크 구동시스템에 적용하였다. 이 급속귀환 크랭크기구의 설계변수를 정의하고 설계변수의 변화가 크랭크의 거동에 미치는 영향을 시뮬레이션 하였다. 또한 실험장치를 제작한 후 탑승자의 구동동작을 분석한 결과 보행패턴을 접목한 크랭크는 사용자 무게중심 안정화에 기여하는 것으로 나타났다. 향후 보행패턴을 접목한 크랭크는 서서 타는 자전거의 구동시스템에 접목 가능할 것으로 보인다.

• 대한금속재료학회지
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• 제47권11호
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• pp.707-715
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• 2009

This paper deals with cyclic stress and strain responses during isothermal low cycle fatigue (LCF) and thermo-mechanical fatigue (TMF) loadings on Nb and Mo containing 15Cr stainless steel, which is used for exhaust manifolds in automobiles. The test temperatures ($T_{i}$) of the isothermal LCF were 600 and $800^{\circ}C$. The minimum temperature of the TMF test was $100^{\circ}C$ and the maximum temperaures ($T_{p}$) were varied between 500 and $800^{\circ}C$. In both loading conditions, weak cyclic softening is observed at $T_{i}=T_{p}=800^{\circ}C$, but the transition to strong cyclic hardening is completed with the temperature decrease below $T_i=600{\sim}700^{\circ}C$ for LCF and $T_{p}=500{\sim}600^{\circ}C$ for TMF. The stress-strain hysteresis loops in the TMF loading show a significant stress relaxation during compressive (heating) half cycle at $T_{p}>500^{\circ}C$, which develops tensile mean stress during cycling. Due to the stress relaxation, the TMF test sample reveals much lower dislocation density than the isothermally fatigued sample at the same temperature with $T_{p}$. A detailed correlation between fatigue microstructure and cycling deformation behavior is discussed.

• BMB Reports
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• 제48권12호
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• pp.677-684
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• 2015

Cardiovascular function is regulated by the rhythmicity of circadian, infradian and ultradian clocks. Specific time scales of different cell types drive their functions: circadian gene regulation at hours scale, activation-inactivation cycles of ion channels at millisecond scales, the heart's beating rate at hundreds of millisecond scales, and low frequency autonomic signaling at cycles of tens of seconds. Heart rate and rhythm are modulated by a hierarchical clock system: autonomic signaling from the brain releases neurotransmitters from the vagus and sympathetic nerves to the heart's pacemaker cells and activate receptors on the cell. These receptors activating ultradian clock functions embedded within pacemaker cells include sarcoplasmic reticulum rhythmic spontaneous Ca²⁺ cycling, rhythmic ion channel current activation and inactivation, and rhythmic oscillatory mitochondria ATP production. Here we summarize the evidence that intrinsic pacemaker cell mechanisms are the end effector of the hierarchical brain-heart circadian clock system.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.700-705
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• 2007

In this study, we observe the application of shape memory alloy(SMA) into smart structures for repeatable actuation, because SMA changes its material properties and characteristics progressively under cyclic loading conditions and finally reaches stable path(state) after a certain number of stress/temperature loading-unloading cycles, so called 'training'. In this paper, SMA wires that have been in a stable state through the training are used. Stress-strain curve of the SMA wire at different temperature levels are measured. In addition, we observe other important effects such as the rate effect according to strain rates for rapid actuation response. The current work presents the experimental test using SMA wire after training completion by mechanical cycling. Through these tests, we measure the characteristics of SMA. With the estimated SMA properties and effects, we compare the experimental results with the simulation results based on the SMA constitutive equations.