• 한국자동차공학회논문집
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• 제18권4호
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• pp.121-126
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• 2010

The automotive weather strip has functions of isolating of water, dust, noise and vibration from outside. To achieve good sealing performance, weather strip should be designed to have the high contact force and wide contact area. However, these design causes excessive permanent deformation of weather strip. The causes of permanent deformation is generally explained to be the chemical material detrioration and physical variation and cyclic loading, etc. This paper introduces a numerical method to predict the permanent deformation using the time dependent viscoelastic model which is represented by Prony series in ABAQUS. Uniaxial tension and creep tests were conducted to obtain the material data. And the lab. test for the permanent deformation was accelerated during shorter time, 300 hours. The permanent deformation of weather strip was successfully predicted under the different loading conditions and different section shapes using the suggested numerical process.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.341-344
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• 2008

Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But. using, transporting, and keeping of plastic component was happened post-deformation. As time goes by and temperature is changed, the post-deformation causes the problems of exterior design and performance. But, it is difficult to estimate the post-deformation by only thermal deformation analysis. Also, the estimation technique of the pest-deformation must be easily applied to product development and it should be reliable because development time of product is limited. In the paper. the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.

• 대한기계학회논문집A
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• 제33권10호
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• pp.1177-1186
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• 2009

High temperature steam pipes of thermal power plant are subject to a severe thermal range and usually operates well into the creep range. Cyclic operation of the plant subjects the piping system to mechanical and thermal fatigue damages. Also, poor or malfunctional supports can impose massive loads or stress onto the piping system. In order to prevent the serious damage and failure of the critical piping system, various inspection methods such as visual inspection, computational analysis and on-line piping displacement monitoring were developed. 3-dimensional piping displacement monitoring system was developed with using the aluminum alloy rod and rotary encoder sensors, this system was installed and operated on the high temperature steam piping of "Y" thermal power plant successfully. It is expected that this study will contribute to the safety of piping system, which could minimize stress and extend the actual life of critical piping.

• 대한기계학회논문집A
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• 제27권10호
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• pp.1676-1685
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• 2003

Tensile and low cycle fatigue tests on prior cold worked 3l6L stainless steel were carried out at various temperatures ftom room temperature to 650$^{\circ}C$. Fatigue resistance was decreased with increasing temperature and decreasing strain rate. Cyclic plastic deformation, creep, oxidation and interactions with each other are thought to be responsible for the reduction in fatigue resistance. Currently favored life prediction models were examined and it was found that it is important to select a proper life prediction parameter since stress-strain relation strongly depends on temperature. A phenomenological life prediction model was proposed to account for the influence of temperature on fatigue life and assessed by comparing with experimental result. LCF failure mechanism was investigated by observing fracture surfaces of LCF failed specimens with SEM.

• 대한기계학회논문집A
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• 제38권10호
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• pp.1185-1191
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• 2014

가스터빈 블레이드는 증기터빈 블레이드와 달리 냉각홀 및 냉각유로를 포함한 복잡한 형상으로 되어 있으며 복합화력의 운전특성에 따라 반복적이거나 지속적인 열-기계 하중 조건 하에서 운전된다. 따라서 블레이드는 운전시간에 따라 균일하지 못한 온도 분포나 응력 분포를 보이며, 이는 크리프나 열-기계피로 손상을 유발하며, 결국 가스터빈 블레이드의 수명을 단축시킨다. 결국 다양한 운전 조건에 따라 발생하는 응력을 정확하게 계산하는 것은 설비의 신뢰성을 보장하고 나아가 블레이드와 같은 고온 부품의 정확한 수명을 평가하는데 무엇보다 중요하다. 최근 들어 컴퓨터 기능이 좋아지고 상용 소프트웨어의 성능이 향상되어 실증 시험에 대한 대안으로 유동, 열 및 구조해석을 연결하는 전산해석이 많이 사용되고 있다. 본 논문에서는 가스터빈 실 운전조건을 고려하여 유동-열-구조 해석 기법을 연계하는 유체-구조 연성해석을 통해 블레이드 온도 및 응력분포를 계산하였다. 또한 해석 결과를 토대로 대표적인 손상기구인 크리프 및 열-기계 피로 손상 모델을 이용하여 블레이드의 수명을 평가하였다.

• 대한기계학회논문집A
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• 제41권8호
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• pp.765-770
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• 2017

Ni기 초내열합금인 GTD111 DS는 가스터빈 블레이드에 사용된다. 본 논문에서는 실제 운전조건과 유사한 조건을 설정하여 GTD111 DS의 저주기 피로시험을 실시하였다 상온, $760^{\circ}C$, $870^{\circ}C$의 온도범위와 다양한 변형률에서 저주기 피로시험을 수행하였다. 실험결과 총 변형률이 증가함에 따라 피로수명은 감소하였다. 상온 및 $760^{\circ}C$에서는 주기적 경화반응이 나타났으며 $870^{\circ}C$에서는 주기적 연화반응이 나타났다. $870^{\circ}C$에서 응력완화 현상은 유지시간에 따른 크리프의 영향으로 나타났다. 피로수명과 총 변형률의 관계는 Coffin-Manson 식을 통해 얻었다. 파단면은 SEM을 통해 초기균열 및 피로진전지역을 관찰하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 터널과지하공간
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• 제27권3호
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• pp.121-131
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• 2017

본 연구에서는 암석과 콘크리트의 정적 및 동적 장기강도시험을 통해 이들 재료의 시간 의존적 거동에 대해 연구했으며, 특히 장기강도시험 중 발생한 미소파괴음 신호를 분석하여 장기 안정성 평가에 활용하고자 하였다. 정적 장기강도시험의 경우 임계하 균열성장시험을 활용하여 Mode I과 Mode II에 대한 장기거동과 미소파괴음 발생특성을 분석하였으며, 동적 장기강도시험의 경우, 반복재하 4점 굴곡시험을 통한 장기강도의 한계와 미소파괴음 발생특성을 분석하였다. 미소파괴음 분석결과, 미소파괴음 히트 누적곡선 대 시간에 따른 곡선은 1차, 2차, 3차 구간이 있는 크립곡선의 모양과 유사한 모양을 보였다. 선형구간에 해당하는 미소파괴음 히트 누적곡선의 2차 구간의 기울기와 지연파괴시간과의 로그-로그 관계로부터 암석과 콘크리트의 정적 및 동적 장기 안정성을 평가하는 방안에 대한 가능성을 제시하였다.