Prediction of Post-Deformation for Plastic Component Considering Residual Stress and Viscoelasticity

판류응력 및 점탄성을 고려한 플라스틱 부품의 후면형 예측

Plastics is commonly used in consumer electronics because of it is high strength per unit mass and good productivity. But. using, transporting, and keeping of plastic component was happened post-deformation. As time goes by and temperature is changed, the post-deformation causes the problems of exterior design and performance. But, it is difficult to estimate the post-deformation by only thermal deformation analysis. Also, the estimation technique of the pest-deformation must be easily applied to product development and it should be reliable because development time of product is limited. In the paper. the process to predict the post deformation under cyclic thermal loadings was suggested. The process was applied to the real panel, and the deformation predicted by the analysis was compared with that of real test, which showed the possibility of applying the suggested process to predict the post deformation of plastic product under thermal loadings.