• 제목/요약/키워드: Cycles To Failure

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Development of new finite elements for fatigue life prediction in structural components

  • Tarar, Wasim;Scott-Emuakpor, Onome;Herman Shen, M.H.
    • Structural Engineering and Mechanics
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    • v.35 no.6
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    • pp.659-676
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    • 2010
  • An energy-based fatigue life prediction framework was previously developed by the authors for prediction of axial and bending fatigue life at various stress ratios. The framework for the prediction of fatigue life via energy analysis was based on a new constitutive law, which states the following: the amount of energy required to fracture a material is constant. In this study, the energy expressions that construct the new constitutive law are integrated into minimum potential energy formulation to develop new finite elements for uniaxial and bending fatigue life prediction. The comparison of finite element method (FEM) results to existing experimental fatigue data, verifies the new finite elements for fatigue life prediction. The final output of this finite element analysis is in the form of number of cycles to failure for each element in ascending or descending order. Therefore, the new finite element framework can provide the number of cycles to failure for each element in structural components. The performance of the fatigue finite elements is demonstrated by the fatigue life predictions from Al6061-T6 aluminum and Ti-6Al-4V. Results are compared with experimental results and analytical predictions.

Enhancement and Evaluation of Fatigue Resistance for Spine Fixation System (척추고정장치의 피로성능 평가와 향상)

  • Kim, Hyun-Mook;Kim, Sung-Kon
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.8
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    • pp.142-147
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    • 2009
  • Spinal fixation systems provide surgical versatility, but the complexity of their design reduces their strength and fatigue resistance. There is no published data on the mechanical properties of such screws. Screws were assembled according to a vertebrectomy model for destructive mechanical testing. A group of two assemblies was tested in static compression. One group was applied to surface a grit blasting method and another group was applied to surface a bead blasting method. Modes of failure, yield, and ultimate strength, yield stiffness, and cycles to failure were determined for six assembles. Static compression 2% offset yield load ranges was from 327 to 419N. Fatigue loads were determined two levels, 37.5% and 50% of the average load from static compression ultimate load. An assembly of bead blasting treatment only achieved 5 million cycles at 37.5% level in compression bending.

Thermal Shock Cycles Optimization of Sn-3.0 Ag-0.5 Cu/OSP Solder Joint with Bonding Strength Variation for Electronic Components (Sn-3.0 Ag-0.5 Cu/OSP 무연솔더 접합계면의 접합강도 변화에 따른 전자부품 열충격 싸이클 최적화)

  • Hong, Won-Sik;Kim, Whee-Sung;Song, Byeong-Suk;Kim, Kwang-Bae
    • Korean Journal of Materials Research
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    • v.17 no.3
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    • pp.152-159
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    • 2007
  • When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

Three Point Bending Fatigue Property with Heat Treatment Condition in a Powder Metallurgical High Speed Steel JYPS-23 (분말고속도공구강 JYPS-23에서 열처리조건에 따른 3점 굽힘피로특성)

  • 홍성현;배종수;김용진
    • Journal of Powder Materials
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    • v.7 no.3
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    • pp.131-136
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    • 2000
  • The effect of tempering temperature on the three point bending fatigue behavior of a P/M high speed steel JYPS-23 (1.28% C, 4.20% Cr, 6.40% W, 5.00% Mo, 3.10% V, bal. Fe) was investigated. The number of cycles to failure of the specimen austenitized at $1175^{\circ}C$ drastically increased with increasing tempering temperature. As tempering temperature increased from 500 to $620^{\circ}C$, the volume fraction and average size of carbides (MC or M6C) did not significantly changed, while hardness decreased drastically. The reduced hardness is due to the softening of matrix, which increased the resistance of the fatigue crack propagation. For a practical application, powder compacting test were also conducted with the P/M high speed steel punches tempered at 500, 580, and $620^{\circ}C$. The number of compacting cycles to failure of the punches also increased with increasing tempering temperature.

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Test methodology of acceleration life test on feeder cable assembly (Feeder Cable Assembly의 가속수명시험법 개발)

  • Han, Hyun Kak
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.17 no.8
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    • pp.62-68
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    • 2016
  • The feeder cable assembly is an automotive part used for telecommunication. If it malfunctions, the control and safety of the automobile can be put at risk. ALT (Accelerated Life Testing) is a testing process for products in which they are subjected to conditions (stress, strain, temperatures, etc.) in excess of their normal service parameters in an attempt to uncover faults and potential modes of failure in a short amount of time. Failure is caused by defects in the design, process, quality, or application of the part, and these defects are the underlying causes of failure or which initiate a process leading to failure. Thermal shock occurs when a thermal gradient causes different parts of an object to expand by different amounts. Thermal shock testing is performed to determine the ability of parts and components to withstand sudden changes in temperature. In this research, the main causes of failure of the feeder cable assembly were snapping, shorting and electro-pressure resistance failure. Using the Coffin-Manson model for ALT, the normal conditions were from Tmax = $80^{\circ}C$ to Tmin = $-40^{\circ}C$, the accelerated testing conditions were from Tmax = $120^{\circ}C$ to Tmin = $-60^{\circ}C$, the AF (Acceleration Factor) was 2.25 and the testing time was reduced from 1,000 cycles to 444 cycles. Using the Bxlife test, the number of samples was 5, the required life was B0.04%.10years, in the acceleration condition, 747 cycles were obtained. After the thermal shock test under different conditions, the feeder cable assembly was examined by a network analyzer and compared with the Weibull distribution modulus parameter. The results obtained showed good results in acceleration life test mode. For the same reliability rate, the testing time was decreased by a quarter using ALT.

Artificial oocyte activation in intracytoplasmic sperm injection cycles using testicular sperm in human in vitro fertilization

  • Kang, Hee Jung;Lee, Sun-Hee;Park, Yong-Seog;Lim, Chun Kyu;Ko, Duck Sung;Yang, Kwang Moon;Park, Dong-Wook
    • Clinical and Experimental Reproductive Medicine
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    • v.42 no.2
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    • pp.45-50
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    • 2015
  • Objective: Artificial oocyte activation (AOA) is an effective method to avoid total fertilization failure in human in vitro fertilization-embryo transfer (IVF-ET) cycles. AOA performed using a calcium ionophore can induce calcium oscillation in oocytes and initiate the fertilization process. We evaluated the usefulness of AOA with a calcium ionophore in cases of total fertilization failure in previous cycles and in cases of severe male factor infertility patients with non-motile spermatozoa after pentoxifylline (PF) treatment. Methods: The present study describes 29 intracytoplasmic sperm injection (ICSI)-AOA cycles involving male factor infertility at Cheil General Hospital from January 2006 to June 2013. Patients were divided into two groups (control, n=480; AOA, n=29) depending on whether or not AOA using a calcium ionophore (A23187) was performed after testicular sperm extraction-ICSI (TESE-ICSI). The AOA group was further split into subgroups according to sperm motility after PF treatment: i.e., motile sperm-injected (n=12) and non-motile sperm-injected (n=17) groups (total n=29 cycles). Results: The good embryo rate (52.3% vs. 66.9%), pregnancy rate (20.7% vs. 52.1%), and delivery rate (10.3% vs. 40.8%) were lower in the PF/AOA group than in the control group. When evaluating the effects of restoration of sperm motility after PF treatment on clinical outcomes there was no difference in fertilization rate (66.6% vs. 64.7% in non-motile and motile sperm, respectively), pregnancy rate (17.6% vs. 33.3%), or delivery rate (5.9% vs. 16.7%) between the two groups. Conclusion: We suggest that oocyte activation is a useful method to ensure fertilization in TESE-ICSI cycles regardless of restoration of sperm motility after PF treatment. AOA may be useful in selected patients who have a low fertilization rate or total fertilization failure.

An Experimental Study on the Failure Characteristics of Flip Chips in Cyclic Bending Test (플립칩의 반복 굽힘 시험 시 파손 특성에 관한 실험적 연구)

  • Lee, Yong-Sung;Jeong, Jong-Seol;Kim, Hong-Seok;Shin, Ki-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.4
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    • pp.362-368
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    • 2009
  • In general, circuit board assemblies experience various mechanical loadings during assembly and in actual use. The repeated cyclic bending can cause electrical failures due to circuit board cracks, solder interconnects cracks, and the component cracks. In this paper, we report on the failure characteristics of semiconductor chips under the repeated cyclic bending. We first describe a new 4-point bending tester, which is developed according to JEDEC standard No. 22B113. The performance of the tester is then estimated through actual experiments. Test results reveal that the cracks first occur on the outer balls around 20,000 cycles and gradually propagate to the inner balls where cracks are found around 70,000 cycles.

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A Study on the fatigue deformation behavior of granitic stone in Korea (국내화강석재의 피로변형거동에 관한 연구)

  • 김재동;정윤영;장보안
    • Tunnel and Underground Space
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    • v.6 no.2
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    • pp.144-156
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    • 1996
  • The deformation behaviors under uniaxial compressive cyclic loading were investigated for fresh rocks and freeze-thaw cycled samples. The Pocheon granite which is one of the most popular building stone in Korea was selected for tests. 0.5 Hz and 50% of dynamic strength were used as test conditions for frequency and fatigue span, respectively. For freezethaw procedure, sample were frozen for 3 hours under the temperature of -2$0^{\circ}C$ and then followed 3 hours thawing under the temperature of +2$0^{\circ}C$. Twenty seven samples were used as untreated and seventy three for freeze-thaw samples. No failure occurred up to 15000 cycles at the stress level of 60% of dynamic strength, indicating that the lowest strees level for fatigue failure may be around 60% of dynamic strength. Permanent strain and damping capacity curves show that there were three stages when rock behaves like under creep. Young's moduli were increased and Possion's ratios were decreased with the increase of the number of cycles. Possion's ratios varied more rapidly than Young's moduli did with the increase of the number of cycles. This may represent that most microcracks developed by fatigue stress are parallel to the axis of loading. The deformation behavior of freeze-thaw cycled samples were almost the same as that of untreated samples. However, the result of freeze-thaw cycled samples showed lower regression constant, indicating that the physical durability of rock is much lowered because of cyclic temperature variation.

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The Interfacial Reactions and Reliability of SnAgCu Solder Joints under Thermal Shock Cycles (열충격 사이클에 따른 SnAgCu 솔더별 솔더 접합부의 신뢰성 및 계면반응)

  • Oh, Chulmin;Park, Nochang;Han, Changwoon;Bang, Mansoo;Hong, Wonsik
    • Korean Journal of Metals and Materials
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    • v.47 no.8
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    • pp.500-507
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    • 2009
  • Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.

A study on the corrosion fatigue fracture behavior of ion-nitrided SM45C under alternating tension-compression loading (반복인장-압축하중을 받는 이온질화 처리한 SM45C의 부식피로 파괴거동에 관한 연구)

  • 우창기;김희송
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.13 no.3
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    • pp.451-460
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    • 1989
  • This paper dealt with the effect of the ratios N2 to H2 gas on the corrosion fatigue failure behavior of ion-nitrided SM45C steel specimens. The specimens were water cooled after ion-nitriding at 500.deg. C for 3hrs in 5 Torr, 0.8N$_{2}$ and 0.5N$_{2}$ atmospheres. As the nitrogen concentration increases, the higher compressive residual stresses developed in the surface layer and the depth of nitrided layer increased, which in turn gave rise to increases in fatigue strength and corrosion fatigue life. In the region less than 1.5 * 10$^{5}$ cycles, fatigue failure initiated at the brittle nitrided case, whereas in the region higher than 1.5 * 10$^{5}$ cycles crack initiated from the non-metallic inclusions in the subsurface. The initiation of corrosion fatigue failure was mainly attributed to pitting of case hardened surface layer.