• Journal of Bio-Environment Control
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• v.22 no.3
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• pp.284-290
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• 2013

This study analyzed the geometric, compressive, cutting and friction properties of oriental melons in order to design a gripper capable of soft handling and a cutter for cutting oriental melon vine among the end effector of oriental melon as a preliminary step for developing the end effector of the robot capable of harvesting oriental melons in protected cultivation. As a result, the average length, diameter at the midpoint, weight, volume and roundness of the oriental melons were 108 mm, 70 mm, 188 g, 333 mL and 3.8 mm. Nonlinear regression analysis was performed on the equation $W=L^a{\times}D_2^b$ with variation of the length (L) and diameter (D2) of the weight (W) of the oriental melons. As a result, it was shown that there was a correlation between a of 2.0279 and b of -0.9998 as a constant value. The average diameter of the oriental melon vine was 3.8 mm, and most vines were distributed within a radius of 5 mm from the center. The average yield value, compressive strength and hardness of the oriental melons were $36.5N/cm^2$, $185.7N/cm^2$ and $636.7N/cm^2$, respectively. The average cutting force and shear strength of the oriental melon vines were $2.87{\times}10^{-2}\;N$ and $5.60N/cm^2$, respectively. The maximum friction coefficient of the oriental melons was rubber of 0.609, followed by aluminium of 0.393, stainless steel of 0.177 and teflon of 0.079. It was considered possible to apply it to the size of the gripper and cutter, turning radius, dynamics of drive motor and selection of materials and their quality in light of the position error and safety factor according to the movement when designing end effector based on the analyzed data.

• Journal of the Korean Society of Food Culture
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• v.20 no.4
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• pp.426-432
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• 2005

To develop a low-temperature and long-term fermented Baechu kimchi, kimchi was prepared according to a recipe of specific ratio with major and minor ingredients and adjusted its final salinity to 3.7%. Baechu kimchi fermented at $15{\pm}1^{\circ}C$ 24 hours and transferred them into in a refrigerator only for kimchi, and then continued to ferment at $-1{\pm}1^{\circ}C$ for 30 weeks to make a low-temperature and long-term fermented kimchi. The initial cutting force of 8.45kgf dropped gradually and reached to 5.19kgf after 30 weeks of fermentation. In compression force the gumminess, hardness and chewiness of Baechu kimchi showed a great decrease during the fermentation, but the springiness and adhesiveness increased in slight. Correlation coefficient between the chewiness and gumminess was the highest(r=0.879). In spite of sensory evaluation scores of the appearance and texture were the highest on 0 day of fermentation, the saltiness was evaluated the worst to eat. Scores for sourness and carbonated flavor were the best during 18 to 22 weeks of fermentation, and overall acceptability was the best after 14 weeks of fermentation. Very high correlation coefficients were revealed between the sourness and carbonated flavor(r=0.813) and between the sourness and off-flavor(r=0.805). According to these results we concluded that the best low-temperature and long-term fermented Baechu kimchi prepared with 3.7% salinity and fermented at $15{\pm}1^{\circ}C$ for 24 hours and then transferred into a kimchi refrigerator at $-1{\pm}1^{\circ}C$, and completed the fermentation for 18 weeks.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Magazine of the Korean Society of Agricultural Engineers
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• v.8 no.2
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• pp.1124-1140
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• 1966

'This hydraulic experiment have been practised Juk an Reservoir spillway and discharge 'channel which the province Kyong Buk was constructed and designed U. hook, for seizing all state of hydraulic. As result of the experimellt planning and making the model test, it has gained the necessary data at the amendment, projection of the most rational and economical result. 1. Project (1) Experiment project....1/30 of the discharge (2) project flood....0.01945 $m^3$/sec (rapidly) 2. Design Experiment It were sighted the water level for the nine point (L. & R. sides of No. O, L. & R. of No.1, L. side of NO.2, NO.3, No. 4 and NO.5), but it appeared each other that the lowest water level was 0.63 m at spillway (No.5) and the highest water level 0.735m less than planning water level O.75 m at No. 0. It was regarded as the phenomena appearing the difference from the calculation of the rational formular and coefficient of discharge. 3. Experiment examine E. ${\circled1}$ As a table (2) it had not a difference in comparision with design and was some lower value than design experiment's. E ..${\circled2}$) !twas same table (3) in a consequence of Experiment contracted Rocky cutting. E.${\circled3}$. ${\circled4}$ It was done amend.ment Experiment by elevating G.H. in only control point, but was not sure result as a table (2)(3)(4), and so it was changed largely in ${\circled5}$ Experiment. E. ${\circled5}$ Increasing water level was understanded to be proportion to $V^2$ in consideration of centrifugal force in the curve part and showed velocity contracting in curve the effect order's being regular in consequence of 1/6 sloped extending G.H. attached from 5 No. 0 to 1. 50 m, to S No. 0+5m. (S; discharge channel number).

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.