• Title/Summary/Keyword: Cutting Device

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CUTTING EFFICACY OF Er:YAG LASER AND CONVENTIONAL BUR IN DECIDUOUS AND PERMANENT TEETH (Er:YAG laser와 Conventional bur의 유치와 영구치 치아삭제효과 비교)

  • Park, In-Cheon;Lee, Chang-Seop;Lee, Nan-Young;Lee, Sang-Ho
    • Journal of the korean academy of Pediatric Dentistry
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    • v.30 no.2
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    • pp.272-285
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    • 2003
  • This study was conducted to observe the microscopic structures of cavities formed after ablation of primary teeth, permanent teeth, enamel and dentin in using a bur and cavities formed after ablation using laser and the following results were obtained after comparing the effects of ablation. Using a #330 bur and Er:YAG laser irradiated at 150 mJ, 200 mJ, 250 mJ and 300 mJ all at the frequency of 5 Hz, 1 mm enamel and dentin samples were ablated and the ablation time was measured. In order to measure the surfaces ablated, 5 each of primary teeth and permanent teeth were ablated using a #330 bur and Er:YAG laser at 150 mJ, 200 mJ, 250 mJ and 300 mJ for 1 sec and the cross section and vertical section were observed. The following results were obtained : 1. Cutting time of Er:YAG laser was longer than that of conventinal high-speed bur regardless of teeth type. 2. Cutting on enamel, Cutting time of conventional high-speed bur in deciduous teeth was longer than in permanent teeth(P<0.05). But Er:YAG laser was not showed any difference between the deciduous and permanent teeth(P>0.05). 3. Cutting on dentin, Cutting time of conventional high-speed bur in permanent teeth was longer than deciduous teeth. Er:YAG laser of 150 mJ, 5 Hz in permanent teeth was longer than in deciduous teeth(p<0.05). But laser of other power did not showed mean difference. 4. The cavity surface treated with the convetional high-speed bur revealed a relatively flat appearance, almost covered with a debris-like smear layer. Cavity wall showed striped appearance because of blade of bur. 5. The cavity surface treated by the Er:YAG laser system was irregular or rough surface with the absence charring, carbonization, or cracking of the dentin. In addition, there was an absence of a smear layer. Cavity floor was round and relatively smooth. According to these results, cutting time of Er:YAG laser was almostly same in permanent and deciduous teeth, but more effective in dentin than enamel. Cutting the sample, Er:YAG laser was needed more time than conventional bur. But SEM findings suggested that laser device produced favorable surface characteristic(i.e, no smear layer, irregular surface, cracking).

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A study of ultra-precision interrupt machining for an polygon mirror (초정밀 단속 절삭을 이용한 다각형 미러의 절삭특성에 관한 연구)

  • Park, Soon-Sub;Lee, Ki-Young;Kim, Hyoung-Mo;Lee, Jae-Seol
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.6 no.3
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    • pp.65-70
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    • 2007
  • Generally, the core component of small precise optical device demands high accuracy of manufacturing processes. Although, the geometry of it is simple, the manufacturing technique to materialize is categorized as the ultra-precision machining and it must be done with the specialized machines and by the trained operator. Typical examples of small precise optical device are laser printer and phone camera. As a core part of laser printer, polygon mirror is used in laser scanning unit(LSU). It couldn't be fabricated with conventional machine but specified machine for polygon mirror machining. In this study, Polygon mirror with 16 surfaces was manufactured in the process of ultra-precision fly-cutting with Al material and investigated optimum machining conditions in terms of feedrate, pitch per cycle and depth of cut. Owing to process of polishing has bad influence on reflection angle, surface roughness, $R_{max}$=10nm, and form error, $Ra={\lambda}/10({\lambda}=632nm)$, are prerequisites for polygon mirror.

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Study on Analytic of Opening Angles for Muffler Variable Valve of Automobile (자동차 머플러 내의 가변밸브의 열림 각에 관한 해석적 연구)

  • Park, Chungyeol;Kim, Kwonse;Kim, Jongil;Choi, Dooseuk
    • Transactions of the Korean Society of Automotive Engineers
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    • v.22 no.2
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    • pp.190-196
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    • 2014
  • Exhaust system by reinforcement of environment regulation came to the foe study necessity. And Exhaust system has necessary to increase the engine performance and silence. From this cause, Automobile has significantly considered production expense. this study makes process for checking the characteristics about Exhaust variable valve within muffler. Variable valve might reduce the baffle within muffler, It was possible to remove the front muffler. Therefor, To miniaturize a size of muffler might be increased by performance through cost-cutting effect and controling of back pressure. Because the Study on Variable valve installed within muffler, to measure the real data was hardly resulted one of the assignments. From manufactured conduct device, might measure data one of piece which was up-graded of problem. Considering to these point, stressed pressure distribution has analyzed on cross section, floating characteristics about velocity distribution around variable valve using analysis as computational fluid dynamics of Ansys with completed measurement data.

Mechanism of Mulch Film Cutter on Transplanting System for Mulching Cultivation of Early Season Culture Rice in Japan

  • Hiyoshi, Kenji;Nagata, Masateru;Wan, Hong-Yong;Umezaki, Teruhisa;Tadeo, Bernardo-D.
    • Proceedings of the Korean Society for Agricultural Machinery Conference
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    • 1996.06c
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    • pp.1021-1030
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    • 1996
  • The mechanism of the mulch film cutter assembly designed as an integral part of a rice transplanting device was developed for mulching cultivation of early season culture rice. This mulch film cutter assembly was directly attached to the transplanting device of the rotary type Japanese transplanter. The principle is that the knife cut a planting slit on the polyethylene film while the planting finger immediately plants seedling into the soil through the planting slit. Computer results implied that the knife of the mulch film cutter assembly can make appropriate planting slit on the polyethylene film as the planting finger effectively plants the seedlings into the paddy soil through the same planting slits.

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Research on Multi-precision Multiplication for Public Key Cryptography over Embedded Devices (임베디드 장비 상에서의 공개키 기반 암호를 위한 다중 곱셈기 최신 연구 동향)

  • Seo, Hwajeong;Kim, Howon
    • Journal of the Korea Institute of Information Security & Cryptology
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    • v.22 no.5
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    • pp.999-1007
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    • 2012
  • Multi-precision multiplication over public key cryptography should be considered for performance enhancement due to its computational complexity. Particularly, embedded device is not suitable to execute high complex computation, public key cryptography, because of its limited computational power and capacity. To overcome this flaw, research on multi-precision multiplication with fast computation and small capacity is actively being conducted. In the paper, we explore the cutting-edge technology of multi-precision multiplication for efficient implementation of public key cryptography over sensor network. This survey report will be used for further research on implementation of public key cryptography over sensor network.

Fabrication of Paper-based Biosensor Chip Using Polydimethylsiloxane Blade Coating Method (PDMS 블레이드 코팅법을 이용한 종이-기반 바이오센서칩 제작)

  • Jeong, Heon-Ho;Park, Chami
    • Korean Chemical Engineering Research
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    • v.59 no.1
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    • pp.100-105
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    • 2021
  • This paper proposes the polydimethylsiloxane (PDMS) blade coating method for fabrication of paper-based analytical device (PAD) that is able to monitor the disease diagnosis and progress without special analytical equipment. The mold that has PAD design is easily modified by using laser cutting technique. And the fabricated mold is used for hydrophobic barrier formation by blade coating. We have optimized the stable formation of PDMS hydrophobic barrier as blade coating condition, which is established by analyzing the structure of the PDMS hydrophobic barrier and change of hydrophilic channel size as thickness of the ink and contact time with the chromatography paper. Based on optimal condition, we demonstrate that PAD as biosensor can apply to detect protein, glucose, and metal ion without special analysis equipment.

Effect of Bundle icing Forces on the Shattering Loss of Grains (바인다의 효출력이 곡물탈립손실에 미치는 영향)

  • 백풍기;정창주
    • Journal of Biosystems Engineering
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    • v.3 no.1
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    • pp.20-36
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    • 1978
  • The effect of binder kicking forces on the shattering losses of paddy rice, which has been widely understood as an outstanding loss factor in harvesting with a binder, were experimentally assessed in this thesis.Through the field tests the optimum time of harvest, in terms of grain moisture contents, was found by considering harvesting losses for two rice varieties, harvested by two different binders, at four or five grain moisture levels.A device was designed and manufactured to apply various kicking forces to the bundles and was used in the bundle kicking tests. It was intended to find out the optimum range of kicking force to minimize the kicking losses. Based on the study, modification of the existing binder kicking mechanism was suggested. The following is a summary of the results of this thesis. 1. In Suweon 258 variety, as the grain moisture content is reduced, so the cutting loss and the kicking loss increase. The grain losses range from 0.77 to 0.82 percent of total field yield for the cutting loss, from 1.83 to 2.01 percent for the kicking loss, and from 2.60 to 2.83 percent for the field loss, when the moisture content is about 22 percent. 2. In Jinheung variety , the field losses increased as the grain moisture content decreased . When the moisture content was 20 percent, the field loss, cutting loss and kicking loss was 0.42-0.49 % , 0.30-0.35, and 0.12 -0.14% of the total field yield, respectively. 3. The difference in the field loss , cutting loss, and kicking loss for the two binders was 0.23% , 0.05% and 0.18% respectively in Suweon 258 variety, and 0.07% , 0.02% and 0.05% respectively ini Jinheung variety. The grain losses for binder B were slightly higher than those for binder A. 4. In the statistical analysis of each variety , the kicking force and the moisture content of the grain, and its interaction were all highly significant at 1% level by T test .The optimum kicking force was found to be in the 3.0-0.4kg range. This does not interrupt the binder operation, while ioses are kept to an acceptale level. 5. To reduce the kicking force of the eXlstmg binder mechanism, the speed of rotation of the kicking arm needs to be redued by increasing the number of driving sprocket teeth, and the position and gear ratio of the knotter-bill and driving bevelgear have to be change to give a !motter-bill speed of 1110 rpm. It is also desirable to attach a belt conveyor which smoothly carries the bundle to the ground. 6. The optimum harvesting time cased on maximum field yield was found to be at a grain moisture content of around 22 percent for Suweon 258 variety, and 20 percent for Jinheung variety. Tota] field yield and field yield at the time amounted to 9, 812.5 kg/ha, 9, 302. 5kg/ha respectively for the Suweon 258, and 7, 819.5 kg/ ha, 7, 158.7 kg/ha respectively for the Jinheung variety.

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Development of a Pavement Cutter for Eco-friendly Road Excavation Construction (친환경 도로굴착 시공을 위한 도로절단기 개발)

  • Kim, Kyoontai
    • Korean Journal of Construction Engineering and Management
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    • v.23 no.6
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    • pp.111-118
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    • 2022
  • Recently, as underground facilities buried under roads in Korea are aging, the amount of underground facility maintenance work is rapidly increasing. For the maintenance and management of such underground facilities, the cutting work of the road pavement should be preceded. However, the conventional road pavement cutters used in Korea are not eco-friendly, and the reality is that they generate a lot of noise and cutting sludge (scattering dust). Therefore, in this study, the concept of the cutting sludge recovery device was derived, and an eco-friendly pavement cutter including this function was designed and manufactured. The developed equipment took about 20 to 30 seconds to cut 1m to a depth of 100 to 150mm. Also, the sludge suction performance was good in most sections, and the noise level of the equipment briefly measured at a distance of 2m was 82.7dB on average. However, due to the limitation that the developed equipment was at the level of the first prototype, the driving stability was somewhat low, and equipment abnormalities such as engine shutdown and sludge recovery performance decreased in some cases. The cutting performance and sludge recovery function will be more stable through tuning and improvement of the developed prototype in the future. In addition, we plan to quantitatively compare and analyze productivity by applying the improved prototype to actual field conditions.

The New Generation Laser Dicing Technology for Ultra Thin Si wafer

  • Kumagai, Masayoshi;Uchiyama, N.;Atsumi, K.;Fukumitsu, K.;Ohmura, E.;Morita, H.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2006.10a
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    • pp.125-134
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    • 2006
  • Process & mechanism $\blacklozenge$ The process consists from two steps which are laser processing step and separation steop. $\blacklozenge$ The wavelength of laser beam is transmissible wavelength for the wafer. However, inside of Si wafer is processed due to temperature dependence of optical absorption coefficient Advantage & Application $\blacklozenge$ Advantages are high speed dicing, no debris contaminants, completely dry process, etc. $\blacklozenge$ The cutting edges were fine, The lifetime and endurances did not degrade the device characteristics $\blacklozenge$ A separation of a wafer with DAF was introduced as an application for SiP

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Measurement of Temperature Field in the Primary Deformation Zone in 2-D Orthogonal Machining Using IR (Infra-Red) Thermography (순수 2 차원 절삭에서 적외선 열화상을 이용한 주변형 영역의 온도 분포 측정)

  • Kim, Myung-Jae;Jung, Hyun-Gi;Hwang, Ji-Hong
    • Journal of the Korean Society for Precision Engineering
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    • v.29 no.8
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    • pp.853-862
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    • 2012
  • The present study develops a method for directly measuring the temperature field in the primary deformation zone with a high spatial resolution during 2-D orthogonal machining. This is enabled by the use of a high-speed, charge-coupled device (CCD) based, infra-red (IR) imaging system which allows characteristics of the temperature field such as the location and magnitude of the highest temperature and temperature gradient in the primary deformation zone to be identified. Based on these data, the relation between the machining temperature and the cutting conditions is investigated.