• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.3
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• pp.77-84
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• 2007

As a life cycle of product bas shortend, Rapid prototypiug has come into the spotlight to shortened the time of producint a prototype. But It followed in laminated directivity and of the prototype production which is decided the interference which Beccuase of invisible rough surface, some inferences have occured during an assembly hour. Consequently, This study on rapid prototyping has parameter to determine surface roughness and surface form precision of total shape. In order to improve Surface form precision, it can control parameters which are Laminate Height, Layer Hatch Overcue, Fill Cure Depth. In addition, we found the parameter which have a deep effect on surface roughness among various parameters, and then, tried to reduce the interference that can be occurred by surface roughness during assembly.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.771-773
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• 1988

The Mechanical strength and the electrical insulation properties of the Epoxy Resin vary with the formation of chemical reactions between Epoxy and curing agent. Therefore, to study their reactions is important for understanding the properties of the cured Epoxy. In this paper, to get the cured Epoxy having good electrical insulation property, it is studied the effects of the surrounding temperature during the cure process on the property of the cured Epoxy. In the experiment, Epoxy is cured with the surrounding temperature varied between -5[$^{\circ}C$] to 50[$^{\circ}C$]. As the results, it follows that the higher the temperature is, the faster the cross-link process is.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.53-81
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• 2006

A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.423-426
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• 2005

A new chip on glass(COG) technique by making use of a high power diode laser for LCD driver IC packaging of LCD has been developed. A laser joining technology of the connection of IC chip to glass panel has several advantages over conventional method such as hot plate joining: shorter process time, high reliability of joining, and better fur fine pitch joining. The reach time to cure temperature of ACF in laser joining is within 1 second. In this study, results show that the total process time of joining is reduced by halves than that of conventional method. The adhesion strength is mainly 100-250 N/cm. It is confirmed that the COG technology using high power diode laser joining can be applied to advanced LCDs with a fine pitch.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.56-62
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• 2024

By introducing curing kinetics and chemo-rheology for the epoxy resin formulation for ultra-high voltage gas insulated switchgear (GIS) Insulating Spacers, a study was conducted to simulate the curing behavior, flow and warpage analysis for optimization of the molding process in automatic pressure gelation. The curing rate equation and chemo-rheology equation were set as fixed values for various factors and other physical property values, and the APG molding process conditions were entered into the Moldflow software to perform optimization numerical simulations of the three-phase insulating spacer. Changes in curing shrinkage according to pack pressure were observed under the optimized process conditions. As a result, it was confirmed that the residence time in the solid state was shortened due to the lowest curing reaction when the curing holding pressure was 3 bar, and the occurrence of deformation due to internal residual stress was minimized.

• Elastomers and Composites
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• v.33 no.2
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• pp.93-102
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• 1998

In electric cable industries, the curing extent of the rubber materials covering the electric cores gives an significant effect on their final performance. The curing extent of rubber is controlled mostly by pull-out velocity of cable in the extrusion process. The final curing extent may be different for different radial positions inside the rubber because of the non-uniform temperature distributions during the curing process. In this contribution, the prediction of curing extent distribution throughout the radial direction of rubber is represented when the cable is passing through the steam curing zone with a fixed pull-out velocity. The prediction of the optimum pull-out velocity for the desired curing extent distribution is also reported. The steady-state heat balance was developed for the curing and cooling processes in which the pull-out rubber was cured by high temperature steam and then cooled by ambient water. A few essential material properties such as density, specific heat, and thermal conductivity were measured to analyze the temperature distribution during the curing and cooling processes. The times to reach 90% curing extent at varying temperatures were measured and used to determine the final cure extent distribution inside the rubber.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.11
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• pp.6464-6471
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• 2014

The UV curing method is a popular process for lens molding on a unit wafer. This process, however, has several drawbacks including wafer adhesion during the ejection process after curing, errors in lens shape and wafer warpage due to material shrinkage during the curing process, and lens centering errors on both sides of a wafer. Among these, the lens shape error and warpage are influenced directly by the UV curing process due to factors including the UV radiation uniformity, the degree of cure according to UV intensity, and the shrinkage characteristics of the material. Therefore, a theory is needed not only to understand the change in the material characteristics, such as the shrinkage rate due to the curing reaction, but also to establish a model. In addition, an analysis system is needed to realize the model. This study proposes a new analysis method for the wafer lens molding process by Comsol modeling. This method was verified by comparing the results with those of the actual process.

• Journal of the Korean Association of Oral and Maxillofacial Surgeons
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• v.33 no.6
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• pp.694-700
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• 2007

It is a gel type high functional toothpaste containing vitamin C, E, propolis extract and the rest of herb with a nanoemulsion state. Vitamin C, E is known as the material with an eminent anti-oxidation effect. Propolis is known as the material with an antimicrobial and anti-inflammatory effect. We have been succeeding in making nanoemulsion of vitamin C, E and propolis through the high pressure homogenizer using stable oil and lecithin and the gel type high functional tooth paste were made from nanoemulsion of vitamin C, E and propolis. We observed the process of wound protecting effect and cure effect for a wound of soft tissue, gingival tissue and mucous membrane showing ulcer and inflammation in oral cavity after applying a gel type high functional toothpaste to patient. As a result, the wound were healed very fast and any side effects were not shown. We confirmed that a gel type high functional toothpaste with nanoemulsion of vitamin C, E and propolis extract has good effect not only for wound healing but also for treatment of ulcer-like lesion in oral cavity. So we report our cases with review of literatures.

• Journal of the Korean Society of Propulsion Engineers
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• v.20 no.1
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• pp.37-42
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• 2016

In this study, we examined the burning rate of the uncured propellant (with and without a curing agent application) in order to inspect the process of the HTPB solid propellant. The burning rate of the uncured propellant, that did not contain the curing agent, was approximately 9.7 mm/s at 1000 psi. In relation to the curing time, the burning rate was constant. The propellant, with the curing agent application, was approximately 8.1 mm/s showed a tendency of slowing as it burned. When the cure reaction rate was low, in accordance to the time, there were small changes in burn rate. However, when the cure reaction rate was high, the difference in burning rate was increased. The burning rate of a fully-cured propellant was approximately 6.8 mm/s, which appeared to be the lowest in order.

• Journal of Conservation Science
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• v.28 no.2
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• pp.131-139
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• 2012

The exothermic cure kinetics of epoxy resin was controlled by hardener containing fast and slow curing agents. The epoxy risen comprises hydrogenated bisphenol A-based epoxide (HBA), fast curing agent (FH) and slow curing agent poly(propyleneglycol)bis(2-aminopropylether) (SH). Talc was used as an inorganic additive. In the process of curing, cure kinetics along with temperature was monitored by differential scanning calorimeter (DSC) and thermocouple to show that the temperature increase was well controlled by adjusting the hardener mixture. Additionally, bending and tensile strengths of the epoxy/talc composites were also measured to be lower and higher with the amount of the talc inorganic additive, respectively. It is thus concluded that the increase in the temperature during exothermic curing reaction and mechanical properties of epoxy resins are tuned by optimizing hardener mixture for successful stone conservation.