• 제목/요약/키워드: Cuprous oxide

검색결과 26건 처리시간 0.025초

아산화동과 황산간의 고속 화학반응에 의한 미세 Cu 입자의 합성과 삼본밀에 의한 분산성 개선 (Synthesis of Cu Nanoparticles through a High-Speed Chemical Reaction between Cuprous Oxide and Sulfuric Acid and Enhancement of Dispersion by 3-Roll Milling)

  • 오상주;이종현;현창용
    • 마이크로전자및패키징학회지
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    • 제23권4호
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    • pp.125-133
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    • 2016
  • 도전 페이스트의 필러로 사용되기 위한 미세 Cu 입자를 제조하기 위하여 아산화동 분말과 황산간의 고속 화학 반응을 이용한 증류수 기반의 습식 공정으로 Cu 입자의 합성을 실시하였다. $7^{\circ}C$에서 48%의 황산과 30 g의 $Cu_2O$를 사용한 조건에서 미반응 $Cu_2O$ 입자들이 제거되면서 입자들간의 응집이 개선된 순수 Cu 나노입자들이 제조되었다. 이후 최적 첨가제의 선택을 통하여 입자들간의 응집이 가장 억제된 224 nm 크기의 Cu 입자들을 제조할 수 있었다. 이러한 미세 Cu 입자 시료에서는 응집된 형태의 조대 입자들이 다소 존재하였고 입자들간의 연결부도 일부 관찰되었으나, 삼본밀을 사용한 레진 포물레이션과의 혼합 후에는 응집된 형태의 조대 입자들이 파괴되고 입자들간의 연결부들이 탈착되어 입자들의 응집이 풀리는 거동을 관찰할 수 있었다.

Reductive Dissolution of Spinel-Type Iron Oxide by N2H4-Cu(I)-HNO3

  • Won, Hui Jun;Chang, Na On;Park, Sang Yoon;Kim, Seon Byeong
    • 한국세라믹학회지
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    • 제56권4호
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    • pp.387-393
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    • 2019
  • A N2H4-Cu(I)-HNO3 solution was used to dissolve magnetite powders and a simulated oxide film on Inconel 600. The addition of Cu(I) ions to N2H4-HNO3 increased the dissolution rate of magnetite, and the reaction rate was found to depend on the solution pH, temperature, and [N2H4]. The dissolution of magnetite in the N2H4-Cu(I)-HNO3 solution followed the contracting core law. This suggests that the complexes of [Cu+(N2H4)] formed in the solution increased the dissolution rate. The dissolution reaction is explained by the complex formation, adsorption of the complexes onto the surface ferric ions of magnetite, and the effective electron transfer from the complexes to ferric ions. The oxide film formed on Inconel 600 is satisfactorily dissolved through the successive iteration of oxidation and reductive dissolution steps.

산성황산동 용액 내에서 동판위에 녹청 형성에 관한 기초적 조사 (An Investigation on the Patination of Copper in Acidic Copper Sulfate Solution)

  • 윤승열
    • 한국표면공학회지
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    • 제5권3호
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    • pp.77-85
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    • 1972
  • A method of preparation of synthetic ignorgaic coating on copper (patina) has been presented . An Eh--pH diagram was constructed for the present Cu-H2O-SO$_4$ system using the most recently available thermodynamic data. In the path of the patination at room temperature the general behaviour of copper in acidic copper sulfate solutions with potassium chlorate as an oxidizing agent appeared to follow those predictable in this Eh-pH diagram. In the presence 0.05 molar cupric sulfate at a temperature of about 28$^{\circ}C$ a green brochantite (CuSO$_4$$.$3Cu(OH)$_2$) layer was formed on copper sheet in 20 days. In a solution having an initial pH of 3.5 the development of a brochantite coating has been observed to take place in two stages. In the first, a layer of cuprous oxide formed on the copper at a relatively rapid rate. In the ensuing step the outer layer of cuptrite was oxidized at much slower rate to form brochantite. The syntetic coatings appeared to consist of crystal-lites of brochanitite growing perpendicular to the cuprose oxide surface. The outer tips of the -crystallites were reasily broken off and gave to the layer a rather chalky character. Underneath, at the brochantite Cu$_2$O interface, however, the green layers were firmely attached. The effect of reagent concentration , solution agitation , and moderate temperature increase were investigated to improve the quality of coating. So also in a qualitative way were the effect of light.

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DV-X$\alpha$ 분자궤도법을 이용한 CuO 및 Cu_2O$에서의 화학 결합 및 전자상태 (Chemical bonding and electronic state in cuprous and cupric oxide using DV-X$\alpha$ method)

  • 김영하;김양수;한영희;한상철;성태현;노광수
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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    • pp.220-220
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    • 2003
  • 최근, Cu기판 위에 YBaCuO$_{7-x}$ 초전도체를 입혀 초전도 선재를 제작하려는 연구가 이루어지고 있으며 이 과정에서 CuO와 Cu$_2$O가 생성된다는 보고가 있다. CuO 및 Cu$_2$O의 생성은 초전도 선재의 전기전도적 특성 및 기계적 특성에 상당한 영향을 끼칠 수 있다. 따라서 CuO와 Cu$_2$O에 대한 연구가 필요하다고 할 수 있다. 본 연구에서는 DV-X$\alpha$ 분자궤도법을 통해 CuO와 Cu$_2$O에 대한 (Cu$_{29}$ O$_{58}$ )$^{58-}$ , (Cu$_{52}$ O$_{19}$ )$^{14+}$ 모델을 이용하여 전자상태계산을 하였다. CuO, Cu$_2$O의 valence orbital level 구조 및 DOS (Density of State)를 통해 Cu원자와 O원자간의 공유결합 세기를 측정하였으며 CuO, Cu$_2$O 서로간의 차이점을 분석하였다.

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무산소동의 표면부식 방지기술 적용에 관한 연구 (A Study on the Application of Anti-Corrosion Techniques on the Surface of Oxygen Free Copper)

  • 주형건;이대영;장다콴;이강용;아잠카미스
    • 대한기계학회논문집A
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    • 제33권4호
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    • pp.425-429
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    • 2009
  • The protection for copper tarnish was developed by surface treatment method and volatile corrosion inhibiting (VCI) technology. The performance of surface treatment and VCI material is also examined in simulated test environment. Benzotriazole (BTAH) solution that contained molybdate showed best performance than others. Usage of VCI materials with surface treatment was more effective. The protection film foamed on the surface of copper was investigated by auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). Molybdate does not participate in the formation of the protective film but promotes the passivation effect. This facilitates the stabilization of the cuprous oxide film, and strengthens the adsorption of BTAH.

다결정 산화구리의 반도성에 관한 연구 (A Study of the Semiconductivity of Polycrystalline Cuprous Oxide)

  • 최재시;여철현
    • 대한화학회지
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    • 제16권2호
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    • pp.74-79
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    • 1972
  • The semiconductivity of polycrystalline $Cu_2O$ has been studied between $220^{\circ}C$ and $680^{\circ}C under partial pressures of oxygen from $4.06{\times}10^{-3}\;to\;10^{-5 }\;mmHg$. The plots of log conductivity vs 1/T at constant oxygen pressure were found to be linear, and the activation energies obtained from the slopes of these plots above the first transition point showed that the energies were greater under high oxygen pressure than under low pressure. The transition points between the stable range and the unstable range of $Cu_2O$ were found from the curves. The dependence of the semiconductivity on the $O_2$ pressure, in the above temperature range, is shown hysteresis.

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Copper Ion from Cu2O Crystal Induces AMPK-Mediated Autophagy via Superoxide in Endothelial Cells

  • Seo, Youngsik;Cho, Young-Sik;Huh, Young-Duk;Park, Heonyong
    • Molecules and Cells
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    • 제39권3호
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    • pp.195-203
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    • 2016
  • Copper is an essential element required for a variety of functions exerted by cuproproteins. An alteration of the copper level is associated with multiple pathological conditions including chronic ischemia, atherosclerosis and cancers. Therefore, copper homeostasis, maintained by a combination of two copper ions ($Cu^+$ and $Cu^{2+}$), is critical for health. However, less is known about which of the two copper ions is more toxic or functional in endothelial cells. Cubic-shaped $Cu_2O$ and CuO crystals were prepared to test the role of the two different ions, $Cu^+$ and $Cu^{2+}$, respectively. The $Cu_2O$ crystal was found to have an effect on cell death in endothelial cells whereas CuO had no effect. The $Cu_2O$ crystals appeared to induce p62 degradation, LC3 processing and an elevation of LC3 puncta, important processes for autophagy, but had no effect on apoptosis and necrosis. $Cu_2O$ crystals promote endothelial cell death via autophagy, elevate the level of reactive oxygen species such as superoxide and nitric oxide, and subsequently activate AMP-activated protein kinase (AMPK) through superoxide rather than nitric oxide. Consistently, the AMPK inhibitor Compound C was found to inhibit $Cu_2O$-induced AMPK activation, p62 degradation, and LC3 processing. This study provides insight on the pathophysiologic function of $Cu^+$ ions in the vascular system, where $Cu^+$ induces autophagy while $Cu^{2+}$ has no detected effect.

후막 구리도체용 유리에 관한 연구 (A study on the Glass Frit for Thick Film Copper Conductor)

  • 이준;이상원
    • 공업화학
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    • 제2권3호
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    • pp.289-299
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    • 1991
  • 후막 구리도체에 적합한 유리를 얻기 위하여 연붕규산계 및 무연 붕규산계 유리를 기반으로 하는 9종의 유리를 제조하고 후막 구리도체에의 적합성을 시험하였다. 그 결과 모든 유리들이 후막 구리도체의 쉬트 저항치, 납땜성 및 땜납 침식저항에는 양호하게 기여하는 것을 확인하였다. 그러나 후막과 알루미나 기판간의 노화후의 부착강도는 연붕규산계 유리로 만들어진 구리 도체막 만이 유용한 값을 가졌고, 그 외의 유리로 만들어진 구리 도체막의 노화후 부착강도는 사용하기에 부적합할 정도로 낮은 것이었다. 특히 $Cu_2O$ 가 첨가된 연붕규산계 유리가 후막 구리도체 제조에 가장 양호한 것으로 확인되었다.

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Al-황동의 분극특성에 미치는 응력의 영향 (Effect of Stress on the Polarization Characteristic of Al-brass)

  • 임우조;정해규;심경태
    • 한국안전학회지
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    • 제19권2호
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    • pp.1-5
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    • 2004
  • Al-brass is the raw material of mnufacturing tubes for heat exchanger of vessel where seawater is used to coolant because it has high level of heat coductivity and excellent mechanical properties and high level of corrosion resistance due to cuprous oxide($Cu_2O$) layer against seawater. However, damage of Al-brass tubes for heat exchanger of vessel is reported that local corrosion such as stress corrosion cracking occurred by synergism effect between mechanical factor and corrosion environment. In this study, to investigate on the effect of stress on the polarization characteristics of Al-brass. At the stress of 0% and 95% yield strength by constant displacement tester, in 3.5% NaCl + 0.1% $NH_4OH$ solution, the polarization tests were carried out. And thus open circuit potential, corrosion current density, anodic polarization, cyclic polarization and dezincification behavior of Al-brass are investigated.

선박용 Al-황동세관의 SCC에 미치는 부식환경의 영향 (Effect of corrosion environment on the SCC of Al-brass tube for vessel)

  • 임우조;정해규
    • 수산해양기술연구
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    • 제39권4호
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    • pp.291-297
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    • 2003
  • Al-brass is usually used as the tube material of vessel's heat exchanger for seawater cooling system because it has high thermal conductivity and good mechanical properties and high corrosion resistance due to cuprous oxide (Cu20) layer against seawater. However, Al-brass tubes of heat exchanger for vessel at the actual environment is reported that local corrosion such as stress corrosion cracking occurred by synergism effect between mechanical factor and corrosion environment In this paper, the effect of corrosion environment on the stress corrosion cracking of Al-brass in various NH4OH of 3.5% NaCl solution, under flow by constant displacement tester. Based on the test results, the behavior of polarization, stress corrosion crack propagation and dezincification phenomenon of Al-brass are investigated. The main results are as follows:(1) Increasing range of potential from open circuit potential to repassivation gets lower, as the contain rate of NH4OH gets higher. (2) As contain rate of NH4OH gets higher, SCC of Al-brass is become activation but the protection film(Cu20) of Al-brass is created in 3.5% NaCl solution. (3) According as content of NH4OH increases in 3.5% NaCl solution, the dezincifiction area is spread. It is concluded that dezincification occurred by localized preferential anodic dissolution at stress focusing region.