• Journal of the Korean institute of surface engineering
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• v.46 no.1
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• pp.22-28
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• 2013

$WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.531-536
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• 2003

The electromagnetic properties and microstructures of the ferrites based on ($Ni_{0.2}$ $Cu_{0.2}$ $Zn_{0.6}$)$_{1.085}$($Fe_2$$O_3$)$_{0.915}$ were investigated by changing the amount of additive SnO$_2$and CaO and the sintering temperatures. Addition of $SnO_2$caused pores in the specimen. There was no variation of grain size by changing the amount of additives. Total loss was reduced when ($Ni_{0.2} $Cu_{0.2}$ $Zn_{ 0.6}$)$_{1.085}$ ($Fe_2$$O_3$)$_{0.915}$ composition was sintered at $1150^{\circ}C$ rather than $1300^{\circ}C$. Addition of CaO was useful to reduce the total loss because it increased the sintering density. The lowest total loss was obtained when 0.06 wt% $SnO_2$and 0.4 wt% CaO were added at the same time.

• Journal of Korea Foundry Society
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• v.17 no.5
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• pp.443-449
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• 1997

The purpose of this study is to investigate the effect of P addition and homogenizing heat treatment on the mechanical properties of Cu-Sn-Ni alloy. The addition of P was 0.025wt.%P to 0.085wt.%P and homogenizing heat-treated at 400, 500, $600^{\circ}C$ under $N_2$ gas atmosphere. Mechanical properties was investigated in this study were Rockwell hardness, tensile strength, and elongation. Tensile strength and elongation increased with P and homogenizing time. Temperature was significantly influence on mechanical properties. Hardness decreased with increasing homogenizing time and temperature, but 0.085wt.%P specimen was showed higher hardness and lower tensile strength and elongation than 0.073wt.%P specimen due to the presence of more $Cu_3P$ in matrix.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.870-876
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• 1994

In order to investigate the growth behavior of $Y_{2}Ba_{1}Cu_{1}O_{5}$(211) particles in $Y_{1}Ba_{2}Cu_{3}O_{7-\delta}$(123), 123 samples were quenched in air after heat treatment on polycrystal and single crystal MgO substrates at $1100^{\circ}C$ for various periods. 211 grains grew with the increase in holding time. The growth of 211 grains was faster on the polycrystal MgO substrate than on the single crystal MgO substrate. In the samples with the compositions of 211+xCuO($0.2\le X \le 0.8$), the growth rate of 211 grains increased with the increase in CuO content. In the sample with x=0.6 the largest 211 grains were observed. 211 grains in the $Y_{2}Ba_{1}Cu_{1.8}Sn_{0.1}O_{5+\delta}$ samples were distributed very finely and homogeneously. The retarding effect of $SnO_2$ addition on the growth of 211 grain appeared more pronounced in a CuO melt than in a $BaCuO_{2}$+ CuO melt.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.43-47
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• 2001

Sn-3Ag-8Bi-5In was developed for the intermediate melting point solder. Although In-contained solder is expensive, its melting point is lower than these of Sn-Ag-Cu alloys. Sn-3Ag-8Bi-5In solder used for this research has a melting range of 188~$204^{\circ}C$. On this study wetting characteristics of Sn-3Ag-8Bi-5In were evaluated in order to investigate its availability as a Pb-free solder. Wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-3Ag-8Bi-5In. Experimental results showed that the zero-cross-time and wetting time at $240^{\circ}C$ for the Sn-3Ag-8Bi-5In were 1.1 and 2.2 second respectively. These values are a little better than these of Sn-37Pb and Sn-3.5Ag solders. The equilibrium wetting farce of the Sn-3Ag-8Bi-5In was 5.8 mN at $240^{\circ}C$, and it was tuned out to be a little higher than that of Sn-3.5Ag and lower than that of Sn-37Pb.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.26-34
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• 2016

Automotive today has been transforming to an electronic product by adopting a lot of convenience and safety features, suggesting that joining materials and their mechanical reliabilities are getting more important. In this study, a Sn-Cu-Cr-Ca solder composition having a high melting temperature ($>230^{\circ}C$) was fabricated and its joint properties and reliability was investigated with an aim to evaluate the suitability as a joining material for electronics of engine room. Furthermore, mechanical properties change under complex environment were compared with several existing solder compositions. As a result of contact angle measurement, favorable spreadability of 84% was shown and the average shear strength manufactured with corresponding composition solder paste was $1.9kg/mm^2$. Also, thermo-mechanical reliability by thermal shock and vibration test was compared with that of the representative high temperature solder materials such as Sn-3.5Ag, Sn-0.7Cu, and Sn-5.0Sb. In order to fabricate the test module, solder balls were made in joints with ENIG-finished BGA and then the BGA chip was reflowed on the OPS-finished PCB pattern. During the environmental tests, resistance change was continuously monitored and the joint strength was examined after tests. Sn-3.5Ag alloy exhibited the biggest degradation rate in resistance and shear stress and Sn-0.7Cu resulted in a relatively stable reliability against thermo-mechanical stress coming from thermal shock and vibration.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.124.2-124.2
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.207-208
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• 2009

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.921.1-921.1
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• 2006