• 제목/요약/키워드: CuNi alloy

검색결과 317건 처리시간 0.021초

Fe/Ni 합금전착에 의한 다공성 그물군조 방열재료의 제조 연구 (Fabrication of Porous Reticular Metal by Electrodeposition of Fe/Ni Alloy for Heat Dissipation Materials)

  • 이화영;이관희;정원용
    • 전기화학회지
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    • 제5권3호
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    • pp.125-130
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    • 2002
  • 다공성 그물구조 금속을 반도체 칩 방열재료로써 활용하기 위한 실험을 실시하였다. 이를 위해 다공성 그물구조 구리와 반도체 칩 사이의 열팽창 차이를 최소화하기 위한 시도로써 다공성 구리에 대한 Fe/Ni 합금전착을 수행하였다. Fe/Ni 합금전착 실험으로 표준 Hull Cell을 구성하고 전류밀도 분포에 따른 Fe/Ni 합금층 내의 조성변화를 관찰하였으며, 실험결과 합금전착시 이상공석현상으로 인하여 전해액의 교반정도에 따라 합금층 조성이 크게 영향을 받는 것으로 나타났다. 본 실험에서는 paddle type 교반기를 사용하여 전해질의 확산을 제어하는 방법으로 원하는 조성의 Fe/Ni 합금층을 얻을 수 있었으며, 얻어진 Fe/Ni 후막을 대상으로 TMA 열분석을 실시한 결과 구리에 비해 훨씬 낮은 열팽창율을 보이는 것으로 나타났다. 또한, 본 실험에서 Fe/Ni 합금전착을 통하여 제작한 다공성 그물구조 금속을 대상으로 방열성능을 측정한 결과 구리 평판 대비 최대 2배 이상의 방열성능을 보여 반도체 칩 방열재료로의 활용 가능성을 높여 주었다.

플라즈마분체 오버레이법에 의한 알루미늄합금 표면의 경화특성에 관한 연구( II ) -후막 표면 합금화층의 경화특성과 내마모성- (Hardening Characteristics of Aluminum Alloy Surface by PTA Overlaying with Metal Powders (II) -Hardening charactersteristics and wear resistance of thicker surface alloyed layer-)

  • 이규천;;강원석;이영호
    • Journal of Welding and Joining
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    • 제12권4호
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    • pp.102-109
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    • 1994
  • The thick and hard alloyed layer was formed on the surface of Aluminum Cast Alloy(AC2B) by PTA overlaying process with Cr, Cu and Ni metal powders under the condition of overlaying current 150A, overlaying speed 150mm/min and different powder feeding rate 5-20g/min. The characteristics of hardening and were resistance of alloyed layer have been investigated in relation to microstructure of alloyed layer. As a result, it was made clear that Cu powder was the most superier one in three metal powders used due to an uniform hardness distribution of Hv 250-350, good wear resistance and freedom from cracking in alloyed layer of which microstructure consisted of hypereutectic. On the contrary, irregular hardness distribution was usually obtained in Cr or Ni alloyed layers of which hardness was increased as Cr or Ni contents and reached to maximum hardness of about Hv 400-850 at about 60wt% Cr or 40wt% Ni in alloyed layer. However the cracking occurred in these alloyed layers with higher hardness than Hv 250-300 at more than 20-25wt% of Cr or Ni contents in alloyed layer. Wear rate of alloyed layer was decreased to 1/10 in Cu alloyed layer and 1/5 or 1/3 in Cr or Ni alloyed layer with same hardness of about Hv 300 in comparison with that of base metal at higher sliding speed.

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커넥터용 Cu-Ni-Mn-Sn계 합금의 가공성에 미치는 Zr 첨가효과 (The effects of Zr on the mechanical workability in Cu-Ni-Mn-Sn connector alloys)

  • 한승전;공만식;김상식;김창주
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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    • pp.246-249
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    • 2000
  • The effects of Zr on the mechanical workability and tensile strength of Cu-Ni-Mn-Sn-Al alloys have been investigated and the following results were obtained. The mechanical workability of Cu-Ni-Mn-Sn-Al alloys are increased with addition of Zr. And the surface cracks of specimen were not produced in Zr added Alloys. Especially in condition of hot-worked beyond the 90% working ratio, Zr contained specimen showed intra-granule crack propagation but Zr-free specimen showed inter-granule mode. The tensile strength have maximum value in 0.05% Zr contained alloy. The aging mechanism of Cu-Ni-Mn-Sn-Al alloys were varied by Zr addition.

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리플로우 시간에 따른 Pb-free 솔더/Ni 및 Cu 기판 접합부의 전단강도 평가 (Evaluation of Shear Strength for Pb-free Solder/Ni and Cu Plate Joints due to Reflow Time)

  • 하벼리;유효선;양성모;노윤식
    • 한국자동차공학회논문집
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    • 제21권3호
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    • pp.134-141
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    • 2013
  • Reflow soldering process is essential in electronic package. Reflow process for a long time results from the decrease of reliability because IMC is formed excessively. Solder alloys of Sn-37Pb and Sn-Ag with different kinds of Cu contents (0, 0.5 and 1 wt.%) as compared with Ni and Cu plate joints are investigated according to varying reflow time. The interfaces of solder joints are observed to analyze IMC (intermetallic compound) growth rate by scanning electron microscope (SEM). Shear test is also performed by using SP (Share-Punch) tester. The test results are compared with the solder joints of two different plates (Ni and Cu plate). $Cu_6Sn_5$ IMCs are formed on Cu plate interfaces after reflows in all samples. Ni3Sn4 and $(Cu,Ni)_6Sn_5$ IMCs are also formed on Ni plate interfaces. The IMC layer forms are affected by reflow time and contents of solder alloy. These results show that mechanical strength of solder joints strongly depends on thickness and shape of IMC.

벌크비정질합금의 액상 성형성 평가 (Evaluation on Liquid Formability of Bulk Amorphous Alloys)

  • 주혜숙;강복현;김기영
    • 한국주조공학회지
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    • 제26권5호
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    • pp.227-231
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    • 2006
  • Liquid formability of bulk amorphous alloys is known to be very poor due to their high viscosity comparing with conventional metallic materials. It is important to have the fabricating technology of bulk amorphous alloys in order to make the components with complicated shape. Liquid formability includes the mold cavity filling ability and the hot tear(crack) resistance during solidification. A mold made of a commercial tool steel for the formability test was designed. Melting was performed by the arc melting furnace with melting capacity of 200 g in an argon atmosphere. Liquid formability and glass forming ability of Cu base and Ni base bulk amorphous alloys were measured and evaluated. Mold filling ability of Ni-Zr-Ti-Si-Sn alloy was better than that of Cu-Ni-Zr-Ti alloy, however the reverse is the hot tear resistance. Bulk amorphous alloy is very susceptible to crack if partial crystallization occurs during solidification. Crack resistance was thought to be closely related with the glass forming ability.

시료에 따른 Sn1.8Bi0.8Cu0.6In솔더의 미세구조 (Micorstructure of Sn1.8Bi0.8Cu0.6In alloy during thermal aging)

  • 이재식;전주선;박종우;정재필
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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    • pp.94-98
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    • 2003
  • The microstructure of Sn1.8Bi0.8Cu0.6In alloys was evaluated at various aging time. The bumps of Sn1.8Bi0.8Cu0.6In alloys after reflowed at $250^{\circ}C$ were well-formed and had 260um height. The craters on the bumps, however, were observed. Intermetallic compounds formed on the interface between so]der and Cu/Ni UBM were consist of $(Cu,Ni)_6Sn_5$. As aging goes on up to 1000hours, the composition of Ni changed from $6.63\%$ at initial stage(as-reflowed) to $13.47\%$ at final stage(1000hours aging ). In addition, after 500hours aging, the floating of IMC to the solder was observed.

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DEVELOPMENT OF TITANIUM-BASED BRAZING FILLER METALS WITH LOW-MELTING-POING

  • Onzawa, Tadao;Tiyama, Takashi
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.539-544
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    • 2002
  • Titanium and titanium alloy are excellent in corrosion resistance and specific intensity, and also in the biocompatibility. On the other hand, the brazing is bonding method of which productivity and reliability are high, when the complicated and precise structure of the thin plate is constructed. However, though conventional titanium-based brazing filler metal was excellent in bond strength and corrosion resistance, it was disadvantageous that metal structure and mechanical property of the base metal deteriorated, since the brazing temperature (about 1000 C) is considerably high. Authors developed new brazing filler metal which added Zr to Ti-Cu (-Ni) alloy which can be brazed at 900 C or less about 15 years ago. In this paper, the development of more low-melting-point brazing filler metal was tried by the addition of the fourth elements such as Ni, Co, Cr for the Ti-Zr-Cu alloy. As a method for finding the low-melting-point composition, eutectic composition exploration method was used in order to reduce the experiment point. As the result, several kinds of new brazing filler metal such as 37.5Ti-37.5-Zr-25Cu alloy (melting point 825 C) and 30Ti-43Zr-25Cu-2Cr alloy (melting point: 825 C) was developed. Then, the brazing joint showed the characteristics which were almost equal to the base metal from the result of obtaining metallic structure and strength of joint of brazing joint. However, the brazing filler metal composition of the melting point of 820 C or less could not be found. Consequentially, it was clarified that the brazing filler metal developed in this study could be practically sufficiently used from results such as metal structure of brazing joint and tensile test of the joint.

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Development of Titanium-based Brazing Filler Metals with Low-melting-point

  • Onzawa, T.;Iiyama, T.
    • International Journal of Korean Welding Society
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    • 제2권2호
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    • pp.14-18
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    • 2002
  • Titanium and titanium alloy are excellent in corrosion resistance and specific intensity, and also in the biocompatibility. On the other hand, the brazing is bonding method of which productivity and reliability are high, when the complicated and precise structure of the thin plate is constructed. However, though conventional titanium-based brazing filler metal was excellent in bond strength and corrosion resistance, it was disadvantageous that metal structure and mechanical property of the base metal deteriorated, since the brazing temperature ( about $1000^{\circ}C$ ) is considerably high. Authors developed new brazing filler metal which added Zr to Ti-Cu (-Ni) alloy which can be brazed at $900^{\circ}C$ or less about 15 years ago. In this paper, the development of more low-melting-point brazing filler metal was tried by the addition of the fourth elements such as Ni, Co, Cr for the Ti-Zr-Cu alloy. As a method for finding the low-melting-point composition, eutectic composition exploration method was used in order to reduce the experiment point. As the result, several kinds of new brazing filler metal such as 37.5Ti-37.5-Zr-25Cu alloy (melting point: $825^{\circ}C$) and 30Ti-43Zr-25Cu-2Cr alloy (melting point: $825^{\circ}C$) was developed. Then, the brazing joint showed the characteristics which were almost equal to the base metal from the result of obtaining metallic structure and strength of joint of brazing joint. However, the brazing filler metal composition of the melting point of $820^{\circ}C$ or less could not be found. Consequentially, it was clarified that the brazing filler metal developed in this study could be practically sufficiently used from results such as metal structure of brazing joint and tensile test of the joint.

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넓은 과냉각 액체영역을 가지는 Ni-Nb-Ti-Zr계 비정질 합금의 제조 (Fabrication of Ni-Nb-Ti-Zr Amorphous Alloys with Wide Supercooled Liquid Region)

  • 김성규
    • 한국주조공학회지
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    • 제22권5호
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    • pp.252-256
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    • 2002
  • Ni-Nb-Ti-Zr amorphous alloys were manufactured using melt-spinning methods. Amorphous formability, the supercooled liquid region before crystallization and mechanical properties were examined. The value of the reduced glass transition temperature and the supercooled liquid region of $Ni_{62}Nb_{10}Ti_{13}Zr_{15}$ alloy were relatively high and were 0.612 and 76 K respectively. However, amorphous bulk alloy rod was not formed using the Cu-mold die casting. The mechanical properties were in the range of $800{\sim}900DPN$ of hardness and $2.5{\sim}2.8$ GPa of tensile strength in the whole composition range.